SUSS MicroTec Inc.
Yokohama   Japan
Aug 15, 2008 Model MA300 features dedicated alignment kit for creating 3D interconnects for applications such as chip stacking and 3D image sensor packaging. Platform enables bottom side and IR alignment for 300 mm-based 3D packaging lithography applications. While bottom-side alignment enables SUSS 300 mm Mask Aligners to process double-sided structured wafers, IR alignment option allows handling of opaque yet IR-transparent materials for thin wafer handling or encapsulation applications.

Manncorp
Willow Grove, PA 19090
Jul 18, 2008 Optimized for speed and flexibility, Hi Output Line features Cognex® flying vision-controlled MC683 conveyorized dual gantry system with 2 heads that pick as other 2 simultaneously place with repeatable accuracy of ±0.01 mm. Off-line loadable plug-and-play modular smart feeder trolley facilitates changeovers, while 10,500 cph placement speed promotes throughput. Automated, turnkey solution also includes automatic inline stencil printer, 8-zone reflow oven, and pass-through conveyor.

Novellus Systems, Inc.
San Jose, CA 95134
Jul 09, 2008 Designed for high-volume tungsten contact fill and interconnect applications, ALTUS® Max(TM) has processing capability to provide tungsten films that meet or exceed 20 nm memory requirements for fill, resistivity, roughness, and defects. It features PNLxT(TM) pulsed nucleation layer process technology, multi-station sequential deposition architecture, and SwiftTrak(TM) wafer handling. Chamber clean technology achieves single-digit defects at 65 nm particle size.

Lam Research Corp.
Fremont, CA 94538
Jul 07, 2008 Addressing range of challenging etch applications, including high-k/metal gate, hardmask open, shallow trench isolation, and strained silicon, 2300® Versys® Kiyo3x Conductor Etch Series features wafer temperature control to enable radial tuning for edge control and profile shaping. It uses advanced pre-coat and post-etch chamber clean techniques. For complex film stacks such as high-k/metal gate, Kiyo3x provides multi-film etch capability in single chamber.

Deprag Inc.
Lewisville, TX 75057 4726
Jun 23, 2008 Able to be converted for various functions within minutes, DCAM-XS is suitable for component assembly and testing. Basic version consists of 2-axis system based on linear servo motors, industrial PC with touchscreen, and control cabinet. Self-explanatory symbols facilitate choice of device functions, and end-product data is completely traceable. System measures 450 x 802 x 680 mm, with 176 x 176 x 80 mm working range, 3.7 m/sec max processing speed, and ±1 µm positioning accuracy.

Mattson Technology, Inc.
Fremont, CA 94538
May 13, 2008 Alpine(TM) system is designed to meet requirements of photoresist strip processes on back-end-of-line (BEOL) and front-end-of-line (FEOL) applications for future technology nodes. While etch chamber offers optimal profile control, inductively coupled plasma source and bias capability enables independent control of ion energy and density at low pressures to minimize damage to low-k materials for sub-65 nm processing. High-speed vacuum and atmospheric robotics promote throughput.

ESS Technologies, Inc.
Blacksburg, VA 24060
May 02, 2008 Custom-made, end-to-end solution assembles diagnostic test kits, visually inspects them, and loads completed test kits into trays at rates to 45 test kits/min. Solution integrates material handling, product feeding, and packaging equipment as well as automated pick and place modules, multi-axis FANUC robots, vision, and inspection tools. Complete system integrates bowl feeders with low-profile flat belt conveyors, puck carrier, automated reel feeders, and cutters.

Universal Instruments Corp.
Binghamton, NY 13902 0825
Apr 01, 2008 Targeted at mid-tier assembly sector, AdvantisX surface mount platform features linear motor positioning system and is available in single- as well as dual-gantry models empowered by Lightning Head technology. Platform is also offered in several multifunction configurations utilizing Inline7 and Inline4 High Force flexible heads.

Dynatech Technology, Inc.
Horsham, PA 19044
Mar 05, 2008 Designed to handle components from 01005-14 mm², SM411 Dynamic Chip Shooter places at rate of 42,000 cph based on IPC 9850 standard with accuracy to ±50 µ at 3 sigma. Dual gantry system includes dual-lane PCB transport with 3 on-demand production configurations. Featuring single gantry, SM421 Advanced Flexible Mounter extends component range from 01005-55 mm², and is capable of handling up to 72 mm SMT connectors. System reaches placement speeds up to 21,000 cph with ±30 µ accuracy at 3 sigma.

Herrmann Ultrasonics, Inc.
Bartlett, IL 60103
Dec 04, 2007 Used by medical device and other plastic assembly manufacturers, MEDIALOG welding machines are designed with smooth finish and clean room friendly surfaces to meet lower particle requirements. Exhaust air is collected and can be directed through existing ventilation system. Machines offer welding performance up to 5,000 W with frequencies of 20, 30, or 35 kHz and include operator interface FDA System Component that meets FDA 21 CFR chapter 11 guideline.

OK International
Garden Grove, CA 92841
Nov 30, 2007 Designed for Metcal MX-500 Soldering/Rework System, MX-PTZ Precision Tweezer is available with variety of soldering cartridges for reworking discreet and SOIC components. Unit thermally applies heat to end caps of devices while mechanically gripping component during removal. Powered by SmartHeat® Technology, tweezer features double-sided pivot, dual-position pitch adjustment, and fully adjustable tip alignment for both height and rotation.

Owens Design, Inc.
Fremont, CA 94538
Nov 29, 2007 Designed to meet Semi S2 and S8 requirements, Atlas platform uses industry-standard 300 mm/200 mm capable EFEM to align and transfer wafers from loadports to inspection station at rates to 180 wph. Solution is designed to allow for wafer level thermal and vibration isolation, providing controlled environment for tool-to-tool matching. Connectivity software as well as integrated power distribution and control system with GUI are included. Customization options are available.

PolyScience Div. Of Preston Industries Inc.
Niles, IL 60714 4588
Sep 12, 2007 Featuring adjustable temperature, pressure, and flow rate alarms, 1.5 ton Refrigerating/Heating Chiller provides heating and cooling for semiconductor fabrication processes. Integral 7,500 or 9,000 W heater controls temperature during vacuum chamber or reaction vessel heating, soaking, and cooling cycles. From 5 to 90°C, with ±0.5°C temperature stability, chiller provides up to 6,328 W of cooling. Its ¾ or 1 hp turbine pump accommodates various process flow and pressure requirements.

OK International
Garden Grove, CA 92841
Aug 22, 2007 Array package rework system, APR-5000-DZ, delivers targeted and controlled heating for BGA and SMT rework of high thermal demand boards, including lead-free and multilayer assemblies up to 12 x 12 in. In addition to top-side convection heater, system incorporates dual convection bottom-side heater. Nozzle design protects components directly adjacent to rework zone and other temperature-sensitive devices. Software facilitates training and provides repeatable process control.

STMicroelectronics
Carrollton, TX 75006
Jul 03, 2007 Design platform for power-optimized system-on-chip solutions features multiple threshold transistors as well as 193 nm immersion lithography, shallow-trench isolation and transistor stressors, and advanced junction engineering. Densities of up to 1,600 Kgates/mm² are available, supporting core supply of 1.1 V with metal pitches of 0.14 micron and from 6-10 metal routing layers. High-performance and low power consumption cell libaries are available.

BOC Edwards
Wilmington, MA 01887
Jun 19, 2007 Based on inward-fired combustion technology, HELIOS 6(TM) gas abatement solution has head design with 6 inlets for process gases and one inlet for gas box purges or other ancillary operations. Unit does not require compressed air and can reduce hydrogen concentrations below lower explosive limit (LEL) in flows as high as 200 slm. Applications include high hydrogen flow processes, such as Si and SiGe epitaxy, LPCVD tungsten, and compound semiconductor MOCVD.

OK International
Garden Grove, CA 92841
Jun 19, 2007 Designed for BGA and SMT rework, APR-5000-DZ Array Package Rework System uses dual convection bottom-side heater to accelerate rework and sustain temperature levels required by component and material manufacturer specifications. Solution delivers targeted and controlled heating for rework of high thermal demand boards, including Pb-free and multi-layer assemblies up to 12 x 12 in. Other components include precision alignment control, integrated vision system, strobe light.

OK International
Garden Grove, CA 92841
Feb 09, 2007 Using Thermal Tweezers Nozzles, engineers can remove devices such as multiple vertically stacked ICs without damaging IC packages and without exposing PCB to excessive reflow cycles. Units allow heat to be confined to localized area of stacked solder joints, preventing total PCB from reaching reflow temperatures. Operating at 200°C, nozzles are also suited for use with glob-top encapsulated die, small components, and fine pitch plastic connectors.

Kulicke & Soffa Industries, Inc.
Willow Grove, PA 19090
Dec 22, 2006 Available in range of wire diameters to address different wire bonding challenges, CuPRAplus(TM) Copper Capillary can handle copper wire from 0.8 mil to 3.0 thicknesses. Product works together with iCu copper wire and bonder kit, and ensures both 1st and 2nd bond quality for stable mass production.

Mimot - California, LLC
Irvine, CA 92618 2326
Dec 21, 2006 Featuring cascading modularity, Model MX offers placement rates up to 80,000 c/hr and provides 216 feeder slots per segment. It includes double placement areas in each module, with Multilevel Transport System for absolute line balancing and elimination of local head-downtimes.