OK International, Inc
Suwanee, GA 30024
Sep 25, 2009 MRS-1000 Modular Rework System can process components up to 40 x 40 mm, and handle PCBs up to 12 x 12 in. or above using stand-alone BH-1000 board holder. HCT-1000 programmable hand held convection tool aids in removal and placement of SMT components. PCT-1000 programmable preheater enables users to increase heat capacity with highly controlled thermal output. Other features included are programmability, digital display, program storage of up to 50 profiles, and adjustability.

Manncorp
Willow Grove, PA 19090
Sep 21, 2009 Optimized for flexibility and throughput, dual-head MC-385 suits high-mix, mid-volume assembly applications from product development to full manufacturing. Cognex® flying vision and stationary bottom vision speeds throughput, with latter providing instantaneous imaging of undersides of components. Traditional bottom vision is used for oversized components to 100 x 50 mm, chip placement capability covers 0201s as well as flip chips, and placement accuracy is ±.03 mm.

Tec-Option
Blissfield, MI 49228
Jul 28, 2009 Featuring modular design, Tec-Flex System is based on interchangeable tooling plate that can support spot welding, fastener welding, hole piercing, bushing insertion, and part making. Tooling plates are designed with mechanical and electrical poka-yokes to ensure that parts are loaded correctly. Integrated clamps and anti-removal devices contain part until process is complete and error-free, while advanced programming techniques allow for fault recovery at nearly every level of assembly.

Schreiner Label Tech, Inc.
Southfield, MI 48034
Jul 10, 2009 Measuring 4 x 4 mm, Mini-DSAPs are miniature, double-sided adhesive parts designed to join extremely small parts to other miniature assembly components. Products offer alternative to conventional bonding and joining techniques such as gluing, bolting, soldering, or ultrasonic welding. Offering instantaneous adhesion with very low maintenance, Mini-DSAPs require no curing, eliminating need for additional equipment such as drying ovens.

SUSS MicroTec Inc.
Yokohama   Japan
Jun 17, 2009 Based on microlens arrays of high optical quality, MO Exposure Optics provides high intensity, light uniformity, and customized illumination shaping, allowing users of mask aligners to optimize process window and enhance yield in contact and proximity lithography. Illumination system includes library of mask aligner settings (A-Optics, D-Optics, LGO and HR) and additional settings such as ring illumination, dipole, quadrupole, multipole, and maltese cross.

Manncorp
Willow Grove, PA 19090
Mar 10, 2009 Providing source for equipment, frames, masks, and accessories, 03.1 Reballing/Prebumping Station offers in-house solution for contractors and OEMs. It uses Rapid IR Heating Technology for energy-efficient lead-free processing temperatures while preventing component/board damage. Also able to convert BGAs, CSPs, and QFNs from leaded to lead-free devices, or vice versa, it incorporates tools and accessories needed to process nearly all common packages.

FSI International
Chaska, MN 55318
Nov 12, 2008 Suited for 32 and 22 nm technologies, ORION® Single Wafer Cleaning System features closed chamber design for complete control and containment of wafer environment. It addresses issues such as reduction of material loss during photoresist stripping after ultra shallow implants and elimination of material loss and galvanic corrosion in high-k metal gates and copper interconnects with metal containing capping layers. 3D cluster configuration optimizes throughput and flexibility.

Manncorp
Willow Grove, PA 19090
Oct 07, 2008 Martin Expert lead-free rework system v09.6 automatically accomplishes SMT repair, from removal to replacement, as well as resoldering of BGAs, CSPs, µBGAs, and other SMDs. In addition to Hi-Res camera combined with Auto Vision Placement, PC-controlled solution provides IR underheating unit that adjusts to exact board size, software that automatically generates profiles for all solder and desolder processes; as well as nozzles for placement, soldering, and solder removal.

SUSS MicroTec Inc.
Yokohama   Japan
Aug 15, 2008 Model MA300 features dedicated alignment kit for creating 3D interconnects for applications such as chip stacking and 3D image sensor packaging. Platform enables bottom side and IR alignment for 300 mm-based 3D packaging lithography applications. While bottom-side alignment enables SUSS 300 mm Mask Aligners to process double-sided structured wafers, IR alignment option allows handling of opaque yet IR-transparent materials for thin wafer handling or encapsulation applications.

Manncorp
Willow Grove, PA 19090
Jul 18, 2008 Optimized for speed and flexibility, Hi Output Line features Cognex® flying vision-controlled MC683 conveyorized dual gantry system with 2 heads that pick as other 2 simultaneously place with repeatable accuracy of ±0.01 mm. Off-line loadable plug-and-play modular smart feeder trolley facilitates changeovers, while 10,500 cph placement speed promotes throughput. Automated, turnkey solution also includes automatic inline stencil printer, 8-zone reflow oven, and pass-through conveyor.

Novellus Systems, Inc.
San Jose, CA 95134
Jul 09, 2008 Designed for high-volume tungsten contact fill and interconnect applications, ALTUS® Max(TM) has processing capability to provide tungsten films that meet or exceed 20 nm memory requirements for fill, resistivity, roughness, and defects. It features PNLxT(TM) pulsed nucleation layer process technology, multi-station sequential deposition architecture, and SwiftTrak(TM) wafer handling. Chamber clean technology achieves single-digit defects at 65 nm particle size.

Lam Research Corp.
Fremont, CA 94538
Jul 07, 2008 Addressing range of challenging etch applications, including high-k/metal gate, hardmask open, shallow trench isolation, and strained silicon, 2300® Versys® Kiyo3x Conductor Etch Series features wafer temperature control to enable radial tuning for edge control and profile shaping. It uses advanced pre-coat and post-etch chamber clean techniques. For complex film stacks such as high-k/metal gate, Kiyo3x provides multi-film etch capability in single chamber.

Deprag Inc.
Lewisville, TX 75057 4726
Jun 23, 2008 Able to be converted for various functions within minutes, DCAM-XS is suitable for component assembly and testing. Basic version consists of 2-axis system based on linear servo motors, industrial PC with touchscreen, and control cabinet. Self-explanatory symbols facilitate choice of device functions, and end-product data is completely traceable. System measures 450 x 802 x 680 mm, with 176 x 176 x 80 mm working range, 3.7 m/sec max processing speed, and ±1 µm positioning accuracy.

Mattson Technology, Inc.
Fremont, CA 94538
May 13, 2008 Alpine(TM) system is designed to meet requirements of photoresist strip processes on back-end-of-line (BEOL) and front-end-of-line (FEOL) applications for future technology nodes. While etch chamber offers optimal profile control, inductively coupled plasma source and bias capability enables independent control of ion energy and density at low pressures to minimize damage to low-k materials for sub-65 nm processing. High-speed vacuum and atmospheric robotics promote throughput.

ESS Technologies, Inc.
Blacksburg, VA 24060
May 02, 2008 Custom-made, end-to-end solution assembles diagnostic test kits, visually inspects them, and loads completed test kits into trays at rates to 45 test kits/min. Solution integrates material handling, product feeding, and packaging equipment as well as automated pick and place modules, multi-axis FANUC robots, vision, and inspection tools. Complete system integrates bowl feeders with low-profile flat belt conveyors, puck carrier, automated reel feeders, and cutters.

Universal Instruments Corp.
Binghamton, NY 13902 0825
Apr 01, 2008 Targeted at mid-tier assembly sector, AdvantisX surface mount platform features linear motor positioning system and is available in single- as well as dual-gantry models empowered by Lightning Head technology. Platform is also offered in several multifunction configurations utilizing Inline7 and Inline4 High Force flexible heads.

Dynatech Technology, Inc.
Horsham, PA 19044
Mar 05, 2008 Designed to handle components from 01005-14 mm², SM411 Dynamic Chip Shooter places at rate of 42,000 cph based on IPC 9850 standard with accuracy to ±50 µ at 3 sigma. Dual gantry system includes dual-lane PCB transport with 3 on-demand production configurations. Featuring single gantry, SM421 Advanced Flexible Mounter extends component range from 01005-55 mm², and is capable of handling up to 72 mm SMT connectors. System reaches placement speeds up to 21,000 cph with ±30 µ accuracy at 3 sigma.

Herrmann Ultrasonics, Inc.
Bartlett, IL 60103
Dec 04, 2007 Used by medical device and other plastic assembly manufacturers, MEDIALOG welding machines are designed with smooth finish and clean room friendly surfaces to meet lower particle requirements. Exhaust air is collected and can be directed through existing ventilation system. Machines offer welding performance up to 5,000 W with frequencies of 20, 30, or 35 kHz and include operator interface FDA System Component that meets FDA 21 CFR chapter 11 guideline.

OK International
Garden Grove, CA 92841
Nov 30, 2007 Designed for Metcal MX-500 Soldering/Rework System, MX-PTZ Precision Tweezer is available with variety of soldering cartridges for reworking discreet and SOIC components. Unit thermally applies heat to end caps of devices while mechanically gripping component during removal. Powered by SmartHeat® Technology, tweezer features double-sided pivot, dual-position pitch adjustment, and fully adjustable tip alignment for both height and rotation.

Owens Design, Inc.
Fremont, CA 94538
Nov 29, 2007 Designed to meet Semi S2 and S8 requirements, Atlas platform uses industry-standard 300 mm/200 mm capable EFEM to align and transfer wafers from loadports to inspection station at rates to 180 wph. Solution is designed to allow for wafer level thermal and vibration isolation, providing controlled environment for tool-to-tool matching. Connectivity software as well as integrated power distribution and control system with GUI are included. Customization options are available.