KLA-Tencor Corp.    San Jose, CA 95134
May 02, 2012 Designed for operation in lithography and outgoing quality control, modular CIRCL(TM) Suite monitors front side, back side, and edge of wafer for defects and, in parallel, measures wafer edge profile, edge bead concentricity, and macro overlay error. Data collection is governed by DirectedSampling(TM), which uses results from one measurement to trigger other types of measurements within cluster as needed. Automated optical defect review and classification helps engineers quickly identify defect source.

Universal Instruments Corp.    Binghamton, NY 13902 0825
May 01, 2012 Optimizing productivity for LED and SMT applications by leveraging Lightning® placement head, Advantis® AC-60 LED consists of dual-beam platform configured with two 30-spindle Lightning placement heads that maximize throughput for 1.2 m LED lamps. Enablers for LED applications include specialized long board kits to support boards up to 1.3 m long as well as various LED nozzles that utilize soft compliant tips when contacting LED globe or pick LEDs without contacting globe.

Asymtek    Carlsbad, CA 92008
Apr 27, 2012 Based on 1-piece Genius(TM) Jet Cartridge that can be removed without tools, NexJet(TM) System includes precision software control of jetting process, enabling use with low- and high-viscosity fluids. Cartridge has built-in memory that stores usage data such as number of cycles and cartridge type. Accommodating 3, 5, 10, and 30 cc as well as 2.5 and 6 oz reservoirs, system handles range of fluids for flip chip underfill, chip scale package, BGA, package-on-package underfill, and adhesive dispensing.

Essemtec Ag      Switzerland
Feb 27, 2012 Facilitating feeder handling and set up of SMD pick-and-place machines, Cobra Feeder Cart features 2 racks for 45 feeders each and 360° wheels, which allow pushing in any direction. Cart serves as storage for feeders used for next job as well as repository for feeders disassembled from pick-and-place machine. Transporting feeders in cart is safe because door and elevator thresholds will not allow feeders to fall out.

Manncorp    Willow Grove, PA 19090
Feb 24, 2012 Equipped with programmable top and bottom hot air as well as rapid on/off IR underheaters, lead-free BR750 has 8 set points that allow exact thermal conditions to be produced for profiles containing heating rate, target temperature, dwell time, and cooling. SMDs are automatically pre-aligned and picked up from component nest at exact centers after size is entered, and upward-looking camera verifies positioning. Split-vision optics and electronic zoom adjustment performs fine tuning.

EV Group Inc.    Tempe, AZ 85284
Feb 14, 2012 Equipped with high-intensity UV light source and optional filter fan unit, EVG620HBL Gen II provides wafer throughput up to 165 6-in. wafers/hr. Robotic handling layout with wafer mapping capability supports demand for wafer traceability, while microscope supports automated mask pattern search, minimizing mask setup and change time. With recipe-controlled microscopes, illumination spectrum can be varied to ensure best pattern contrast with various wafer and layer materials.

Essemtec Ag      Switzerland
Nov 15, 2011 Able to store up to 406 trays/reels (7 and 13 in. dia), fully automatic and modular Tower-XL can install close to pick and place machines to let machine operators store components and retrieve from stock just where needed. Unit controls diameter and barcode when storing reel, and access time for each is less than 12 sec. Included stock management software can control multiple towers, and other modules cover job planning and tracking of MSL classified components.

OK International    Garden Grove, CA 92841
Nov 14, 2011 Featuring free-standing board holder and adjustable tool holder, Model MRS-1100A manages diverse board sizes and thicknesses while providing stable working area. System is available with wide array of nozzles, preheater, adjustable tool holder, board holder, and light magnifier. By integrating advanced rework technologies, Model MRS-1100A offers flexible choice for removal of delicate SMT components.

Essemtec Ag      Switzerland
Nov 04, 2011 Available for Cobra and Paraquda pick-and-place machines, TCQ 18-bin changer can replace component tray in less than 5 sec and align it with better than 50 µm accuracy. Trays are stored in magazine that is equipped with handles and can be replaced. Standard magazines feature 18 or 14 slots, depending on tray thickness, each with room for one standard JEDEC tray; space also can be divided for several smaller trays. Capabilities can accommodate needs of small and lightweight components.

Essemtec Ag      Switzerland
Oct 31, 2011 Integrating active tape pull-back system and cutter, intelligent 12 mm Cobra Feeder facilitates and accelerates setup of component reels to SMD pick-and-place machines. One 12 mm tape feed takes less than 60 msec, and pickup position is reproducible within few micrometers. Due to feeder precision, pick-and-place head can pick up 4 components simultaneously from 4 different feeders. Feeders further simplify SMD reel setup by automatically threading tape and cover tape.

KLA-Tencor Corp.    San Jose, CA 95134
Aug 19, 2011 Suitable for chip manufacturing at 20 nm device nodes and below, eDR(TM)-7000 electron-beam (e-beam) wafer defect review system addresses defect imaging and classification challenges at leading edge or located at bottom of deep trench/hole. System can drive directly to site of defect at high resolution, enabling review of multiple defects per second. Features include stage and vibration-isolation system as well as reticle defect review and voltage-contrast imaging modes.

Advanced Micro-Fabrication Equipment Corp    Shanghai 201201, PRC  China
Jul 22, 2011 Featuring 2-13.5 MHz switchable RF in addition to 60 MHz RF, Primo AD-RIE(TM) Advanced Decoupled Reactive Ion Etch system has mini-batch cluster architecture that can be configured with up to 3 dual-station process modules, each capable of dual- or- single-wafer processing. Chamber design incorporates plasma confinement and showerhead technology for optimum on-wafer performance. Additional features include symmetrical power distribution and triple-zone gas distribution with dual tuning gases.

EV Group Inc.    Tempe, AZ 85284
Jun 27, 2011 Available as option on EVG850TB and EVG850DB automated temporary bonding and debonding systems, In-Line Metrology Module can detect variety of thin-wafer process irregularities and defects, including total thickness variation of carrier wafer, adhesive layer, bonded stack, and thinned wafer; bow/warp of bonded stack; and voids in bond interface. Adding in-line metrology to thin wafer processing enables ramp-up of 3D-IC and TSV manufacturing from pilot-line to volume production.

Essemtec Ag      Switzerland
Apr 25, 2011 Requiring 20 mm of space on feeder rack, double 8 mm Cobra Feeder handles paper and blister tapes and allows tape splicing. High-precision indexing wheel moves component tape forward, enabling 4 mm indexing in 60 ms. Position of wheel and tape is measured directly on indexing finger, and tolerances of indexing wheel are registered and electronically compensated. To ensure continuous, jam-free operation, Cobra Feeder features active retracting of tape and cover tape.

Universal Instruments Corp.    Binghamton, NY 13902 0825
Apr 06, 2011 Powered by VRM linear motor with closed-loop 1 µm positioning, Genesis Series 2 is available 1-, 2-, and 4-beam configurations with throughputs up to 140,000 cph. Unit features 30-spindle Lightning® head, which places passives down to 01005, CSPs, WSPs, µBGAs, eCAPs, DPAKs, and MELFs at full speed. Vertical part sensor verifies part presence immediately prior to placement, while dual on-the-head cameras support components up to 30 x 30 mm and up to 6 mm tall.

Universal Instruments Corp.    Binghamton, NY 13902 0825
Mar 25, 2011 Innova and Innova + direct die feeders are portable, high-speed units that enable GenesisSC system to assemble complete module on single machine. Multiple feeders can be installed on single placement machine with minimum feeder slot consumption and feeders can alternate operation for continuous running of like part numbers. Units process wafers up to 300 mm in size and include vision processing, wafer map input or ink dot identification, and barcode identification and tracking.

Dukane Intelligent Assembly Solutions    Saint Charles, IL 60174
Mar 07, 2011 In addition to 15 kHz and super 20 kHz models for larger medical parts, iQ Servo-Controlled Ultrasonic Welding Systems include 30, 40, and 50 kHz models for smaller medical parts such as valves, ports, filters, and implants. Smaller models range from 600-1,800 W, while larger presses range from 3,300-5,000 W. Driven by iQ series digital power supply with data processing rate of 0.5 ms, Melt-Match(TM) technology precisely controls collapse speed profile during weld.

EV Group Inc.    Tempe, AZ 85284
Feb 28, 2011 Model EVG620HBL automated mask alignment system delivers throughput of up to 165 six-inch wafers/hr for manufacturing high-brightness LEDs, compound semiconductors, and power electronics. System includes high-intensity UV light source and 5 cassette stations. Also included are recipe-controlled microscopes with illumination spectrum that optimizes pattern contrast with various wafer and layer materials, including sapphire, silicon carbide, aluminum nitride, metal, and ceramic.

Herrmann Ultrasonics, Inc.    Bartlett, IL 60103
Dec 16, 2010 Designed to address various customer requirements, HiQ Welding Machines enable visualization of thermoplastic welding process via 5.7 in. touch screen display. Machines are equipped with proportional valve technology, digital generators, and position measuring system as standard. When selecting generator, users can choose between 3 frequencies and several power outputs up to 6000 W. Intuitive software menus electronically control all aspects of weld process.

Manncorp    Willow Grove, PA 19090
Dec 01, 2010 Suited for high-mix assembly applications, dual-head Model MC-392 features ball screw X-Y drive and closed-loop servo control with linear encoding for placement accuracy of 30 µm, 3 Sigma. Unit is available in in-line configuration with up to 96 feeders or as stand-alone unit with space for 160 feeders. Equipped with Cognex®-based vision system, Model MC-392 enables on-the-fly alignment of any SMD from 0.4 x 0.2 mm to 16 x 14 mm, including CSPs and µBGAs.