OK International    Garden Grove, CA 92841
May 08, 2013 Available for Scorpion Rework System, Side-View Camera Upgrade Kit facilitates visibility of reflow during rework process and helps operator set placement height of vacuum and reflow nozzles. Kit features high magnification optics, CMOS sensor camera with USB 2.0 connection, and picture-in-picture functionality, eliminating need for second monitor. Adjustable double articulated arm provides camera mount, while LED lighting lets operator direct light onto part from different angles.

MARTIN    Manchester, NH 03109
May 06, 2013 EXPERT 10.6 Rework Systems are available with IR temperature measurement sensors. Installed next to camera at Advanced Vision Placement unit, IR sensor module has integrated laser pointer that is used to indicate area of measurement on PCB surface. Sensor mount can be unlocked by users, allowing them to swipe measurement location over PCB with minimal effort. System also includes hybrid under-heater and control unit integrated into single housing.

Brooks Instrument    Hatfield, PA 19440
Apr 30, 2013 Insensitive to pressure transients, Model GF135 provides real-time integral rate-of-decay flow measurement. Data can be used to optimize accuracy at critical low-flow set points, set up alarm limits for critical performance parameters, and monitor trends for predictive maintenance. With advanced diagnostic capabilities that verify accuracy, check valve leak-by, and monitor sensor drift, semiconductor manufacturers can maintain uniformity in etch profiles and critical dimensions.

Mini-Circuits    Brooklyn, NY 11235
Apr 30, 2013 With range of 610–810 MHz, SYBD-22-82HP+ 50 Ω, 22 dB coupling, DC pass units feature mainline loss of 0.10 dB typ with VSWR of 1.10:1 typ and deliver directivity at 24 typ. Select models feature power handling capabilities to 150 W at room temperature, and suitable applications include VHF/UHF and SMR. Model SYBD coupler series joins LTCC coupler family with rugged connectorized models. All couplers are ESD compliant and available as RoHS compliant.

Ferrotec (USA) Corporation    Bedford, NH 03110
Apr 12, 2013 Intended for lift-off compound semiconductor applications, Temescal UEFC-5700 incorporates Auratus™ Deposition Process Enhancement Methodology, offering near-perfect uniformity. System features conical shaped vacuum chamber and patent-pending High-Uniformity Lift-off Assembly design that uses dual-axis motion to optimize collection efficiency. With 44,000 L/sec of installed cryogenic pumping capacity, UEFC-5700 offers production capacity up to forty-two 150 mm wafers in batch.

Europlacer    Tampa, FL 33610
Feb 19, 2013 To build iico system, Europlacer starts with pre-owned EP600 or Progress6 placement system, exchanges critical mechanical parts, and installs encoders on X and Y axis. Nozzles are changed for Smart nozzles, and complete head is changed and fit with 8-position turret head with optical sensors and digital cameras. Additionally, system gets new cover with flat screen/control panel, and PC is exchanged for one with latest machine software. iico can place components from 0.4 x 0.2 mm to 50 x 50 mm.

Hitachi High Technologies, Inc.    Schaumburg, IL 60173-2295
Feb 18, 2013 Providing splice-free, continuous operation in SMT component placement industry, 8 mm SL Feeder resolves issues caused by reel splicing, including improperly spliced tape that interrupts production. Unit allows addition of secondary reel supply in same feeder at any time during operation. In addition, SL Feeder accepts strip-tapes, and uses cover tape process that mitigates release of dust and debris inside placement system, minimizing maintenance requirements.

Universal Instruments Corp.    Binghamton, NY 13902 0825
Feb 18, 2013 Intended for electronics manufacturers, FuzionXC2-37 and FuzionXC2-60 leverage NPI software tools featuring icon-driven interface and efficiency tools, including on-line component auto-teach and on-the-fly production editing. FuzionXC2-37 accommodates boards up to 1,300 x 610 mm; 272, 8 mm feeder inputs, and range of input types: strip, tape, tube, odd-form, and tray. FuzionXC2-60 offers 264, 8 mm feeder inputs, larger board support, and on-the-fly part range.

Herrmann Ultrasonics, Inc.    Bartlett, IL 60103
Jan 23, 2013 In one step, HiQ MPW transports membrane belt by conveyor, punches membrane contour, and welds membrane onto part, saving material and cutting cycle time to less than 2 seconds per weld cycle. Modular Weld Punch machine is equipped with vacuum monitor that checks whether membrane is correctly punched and positioned. Machine control also features gentle conveyor transport with splice check, which minimizes other sources of error and potential production downtime.

Owens Design, Inc.    Fremont, CA 94538
Dec 18, 2012 Customizable to allow for integration of specific wafer staging, metrology modules, optics, wafer alignment mechanisms, and other components, Atlas provides OEMs with 450 mm metrology automation solution that also handles 300 mm metrology requirements. Industry standard 300/450 mm capable EFEM is used to align and transfer wafers from loadports to inspection station, while airflow and pressure balance between process stage and EFEM is optimized to ensure clean wafer transfer.

OK International    Garden Grove, CA 92841
Dec 04, 2012 Metcal MX-5200 provides dual simultaneous use option, where 2 hand-pieces can work from one power supply at same time. Dynamic option lets 2 hand-pieces share 80 W output power based on demand, promoting application flexibility and speed. SmartHeat™ Technology promotes responsive, controlled heating and delivers exact amount of energy needed to ensure precise, reliable solder connection. Simultaneous dual operation is supported by 4 hand-pieces and various soldering and rework cartridges.

QTS, Inc    Medway, MA 02053
Nov 15, 2012 Wizard Stencil Stretch Frame System features molded plastic container frame that holds stencil foil, with 64-80 contact points, for handling, mounting, and storage of SMT components. When parts are ready for printing, frame and stencil are mounted in lightweight aluminum, adjustable Wizard Master Stretch Frame and 50-110 psi compressed air is applied for tensioning stencil. Container frames are available in 3 sizes and 3 types of plastic composition for specific applications.

Brewer Science, Inc.    Rolla, MO 65401
Oct 30, 2012 Offering computerized process control, Cee® 1300CSX enables high-temperature slide-off of thinned compound semiconductor substrates in R/D or low-volume production environment. Debonder is designed for maximum accuracy and process flexibility and offers several interface capabilities as well as precision lower platen z-position control and programmable electronic lift pins. Additional features include constant force mode, data logging, and excess force sensing.

KLA-Tencor Corp.    San Jose, CA 95134
Sep 10, 2012 Designed to address complex overlay challenges associated with single- and multi-patterning lithography techniques at advanced sub-28 nm design nodes, Archer(TM) 500 accurately measures and characterizes overlay error. Measurement speed and precision enable thorough overlay characterization on wafers after patterning to help verify that pattern features have been correctly aligned to previously-patterned features, located on either same layer or prior process layer.

MARTIN    Manchester, NH 03109
Jun 20, 2012 Used to rework LEDs and power components on metal or ceramic boards from 30 x 30 mm to 300 x 300 mm, EXPERT 04.6IXM is designed for applications where substrates need to be heated quickly up to 200°C and without overshoot. Single-sided PCBs are placed on glass plate heated with IR radiators rated at up to 3,000 W. Dual manipulator arms, each with movement lock, individually carry placement tool and hot air solder pen to cover entire working area.

KLA-Tencor Corp.    San Jose, CA 95134
May 02, 2012 Designed for operation in lithography and outgoing quality control, modular CIRCL(TM) Suite monitors front side, back side, and edge of wafer for defects and, in parallel, measures wafer edge profile, edge bead concentricity, and macro overlay error. Data collection is governed by DirectedSampling(TM), which uses results from one measurement to trigger other types of measurements within cluster as needed. Automated optical defect review and classification helps engineers quickly identify defect source.

Universal Instruments Corp.    Binghamton, NY 13902 0825
May 01, 2012 Optimizing productivity for LED and SMT applications by leveraging Lightning® placement head, Advantis® AC-60 LED consists of dual-beam platform configured with two 30-spindle Lightning placement heads that maximize throughput for 1.2 m LED lamps. Enablers for LED applications include specialized long board kits to support boards up to 1.3 m long as well as various LED nozzles that utilize soft compliant tips when contacting LED globe or pick LEDs without contacting globe.

Asymtek    Carlsbad, CA 92008
Apr 27, 2012 Based on 1-piece Genius(TM) Jet Cartridge that can be removed without tools, NexJet(TM) System includes precision software control of jetting process, enabling use with low- and high-viscosity fluids. Cartridge has built-in memory that stores usage data such as number of cycles and cartridge type. Accommodating 3, 5, 10, and 30 cc as well as 2.5 and 6 oz reservoirs, system handles range of fluids for flip chip underfill, chip scale package, BGA, package-on-package underfill, and adhesive dispensing.

Essemtec Ag      Switzerland
Feb 27, 2012 Facilitating feeder handling and set up of SMD pick-and-place machines, Cobra Feeder Cart features 2 racks for 45 feeders each and 360° wheels, which allow pushing in any direction. Cart serves as storage for feeders used for next job as well as repository for feeders disassembled from pick-and-place machine. Transporting feeders in cart is safe because door and elevator thresholds will not allow feeders to fall out.

Manncorp    Willow Grove, PA 19090
Feb 24, 2012 Equipped with programmable top and bottom hot air as well as rapid on/off IR underheaters, lead-free BR750 has 8 set points that allow exact thermal conditions to be produced for profiles containing heating rate, target temperature, dwell time, and cooling. SMDs are automatically pre-aligned and picked up from component nest at exact centers after size is entered, and upward-looking camera verifies positioning. Split-vision optics and electronic zoom adjustment performs fine tuning.