Assembly Machinery

Design Platform supports low-power 45 nm CMOS systems.

Design platform for power-optimized system-on-chip solutions features multiple threshold transistors as well as 193 nm immersion lithography, shallow-trench isolation and transistor stressors, and advanced junction engineering. Densities of up to 1,600 Kgates/mmÂ-² are available, supporting core supply of 1.1 V with metal pitches of 0.14 micron and from 6-10 metal routing layers....

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Ultrasonic Bonding Provides Fail-Safe Reliability for Armored Vest Manufacturers as Military Demand Surges

Industry Leaders Depend on Sonobond Ultrasonics' SeamMaster(TM) Bonders WEST CHESTER, Pennsylvania, June 26, 2007 - Pressured to keep pace with military demand for armored vests to protect U.S. forces in Iraq and Afghanistan, manufacturers worldwide are relying on Sonobond Ultrasonics' bonding equipment to ensure the life-saving properties of their products. Benefits of Ultrasonic Assembly...

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Beckwood Press Company Designs Innovative New Automated Assembly System

Beckwood Press Company Designs Innovative New Automated Assembly System

ST. LOUIS, MO - Beckwood Press Company has recently designed an innovative new automated assembly system for a leading heavy machinery manufacturer. The system, which has been integrated with multiple robots for loading and unloading of part components, assembles and tests bushings to be used in tracked vehicles. Pneumatic and hydraulic cylinders harmonize to achieve a high level of efficiency....

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Automated Machine facilitates hearing aid production.

Objet Hearing Aids Solution is based on PolyJet(TM) technology, which builds ear molds by printing ultra-thin 16-micron layers to create exact 3D structure required. Resulting hearing aid molds are perfectly shaped and have smooth, unmarked surfaces. Machine offers 3 hearing aid-specific photopolymer resins and can quickly switch between them. Utilizing digital scans and Objet Studio software,...

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Programming Solutions promote operational flexibility.

Plugged into standard wall outlet, portable FLX500 picks devices from tray media, places them in sockets for programming, and returns programmed devices to output trays. Automated programming solution features self-contained air supply and language-independent, touch screen interface. After devices are mounted on PCB, ImageWriter in-system programming solution can program final application code...

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Universal to Present Leading-edge Placement Technology at Mexitronica 2006

Universal to Present Leading-edge Placement Technology at Mexitronica 2006

Universal Instruments has announced plans to showcase the highly flexible AdVantis AX-72 and Quadris-S machine sets from booth #718 at this year's Mexitronica, being held over October 10th - 12th in Guadalajara, Mexico. An example of the AdVantis Platform's inherent flexibility, Universal's AdVantis AX-72 display will highlight one of the most adaptable models in the AdVantis collection. A...

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MIMOT's New 'Advantage X' Boosts Placement Rates

MIMOT's New 'Advantage X' Boosts Placement Rates

MIMOT's New 'Advantage X' Boosts Placement Rates Irvine, California, USA - MIMOT's new 'Advantage X' enhancement package boosts placement rates by 15%. The retrofittable Advantage X upgrade is suitable for all MIMOT pick and place machines; it combines both hardware and software advances. It is especially beneficial for MIMOT high-mix pick and place systems, bringing the c/h rate to 24,000 for...

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Tape Feeders suit high-speed chip placement equipment.

Tape Feeders suit high-speed chip placement equipment.

Including PSV sensor that notifies machine and line software when component reels are serviced by operator, High-Performance Gold Feeders support line-level reporting and traceability functionality. They offer continuous splice capability and high speed chip component presentation. Single lane 8 and 12 mm feeders have features for precise and repeatable feeder registration, while 16, 24, and 32...

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Universal Instruments to Showcase AdVantis Platform at ATExpo 2006

Universal Instruments to Showcase AdVantis Platform at ATExpo 2006

Universal Instruments has unveiled plans to showcase its popular AdVantis placement platform from booth #5842 at this year's Assembly Technology Expo, taking place over September 26th - 28th in Chicago, US. The Universal display will highlight AdVantis' ability to blend high-end machine productivity and operator flexibility for a value-driven performance. Equipped to respond to a variety of...

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Mass Imager performs singulated substrate processing.

SinguLign(TM) enables mass imaging of multiple materials such as solder paste, solder spheres, flux, and adhesive onto singulated substrates or components directly from carrier. Through use of printing platform, specialized tooling, carrier, and miniaturized print or ball placement head, precise deposits can be applied to individual parts down to 20 mm. Tooling and parts handling mechanisms...

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