ABB Inc.    Wickliffe, OH 44092
May 04, 2012 Available as part of Symphony(TM) Plus plant automation platform, Symphony Plus Control HPC800 process controller accommodates applications that require modular DIN rail packaging. Ethernet-based plant network makes it suited for geographically distributed control applications in conventional or renewable power plants and water networks. Interface modules are available that expand connectivity of controller to intelligent electronic devices using PROFIBUS DP and HART communication protocols.

KLA-Tencor Corp.    San Jose, CA 95134
May 02, 2012 Designed for operation in lithography and outgoing quality control, modular CIRCL(TM) Suite monitors front side, back side, and edge of wafer for defects and, in parallel, measures wafer edge profile, edge bead concentricity, and macro overlay error. Data collection is governed by DirectedSampling(TM), which uses results from one measurement to trigger other types of measurements within cluster as needed. Automated optical defect review and classification helps engineers quickly identify defect source.

Count On Tools    Gainesville, GA 30501
May 01, 2012 Benefitial to EMS companies and contract manufacturers, ezLOAD 40 Series features 40 x 40 mm extruded aluminum base and soft foam pad. Compact design, which helps target more specific areas on builds with increased precision, also provides capability to flexibly handle multiple board widths. Protecting components while allowing boards to move freely through assembly line, ESD-safe ezLOAD PAD features active grip technology. Customizable product is compatible with any SMT equipment.

Universal Instruments Corp.    Binghamton, NY 13902 0825
May 01, 2012 Optimizing productivity for LED and SMT applications by leveraging Lightning® placement head, Advantis® AC-60 LED consists of dual-beam platform configured with two 30-spindle Lightning placement heads that maximize throughput for 1.2 m LED lamps. Enablers for LED applications include specialized long board kits to support boards up to 1.3 m long as well as various LED nozzles that utilize soft compliant tips when contacting LED globe or pick LEDs without contacting globe.

Asymtek    Carlsbad, CA 92008
Apr 27, 2012 Based on 1-piece Genius(TM) Jet Cartridge that can be removed without tools, NexJet(TM) System includes precision software control of jetting process, enabling use with low- and high-viscosity fluids. Cartridge has built-in memory that stores usage data such as number of cycles and cartridge type. Accommodating 3, 5, 10, and 30 cc as well as 2.5 and 6 oz reservoirs, system handles range of fluids for flip chip underfill, chip scale package, BGA, package-on-package underfill, and adhesive dispensing.

Essemtec Ag      Switzerland
Feb 27, 2012 Facilitating feeder handling and set up of SMD pick-and-place machines, Cobra Feeder Cart features 2 racks for 45 feeders each and 360° wheels, which allow pushing in any direction. Cart serves as storage for feeders used for next job as well as repository for feeders disassembled from pick-and-place machine. Transporting feeders in cart is safe because door and elevator thresholds will not allow feeders to fall out.

Manncorp    Willow Grove, PA 19090
Feb 24, 2012 Equipped with programmable top and bottom hot air as well as rapid on/off IR underheaters, lead-free BR750 has 8 set points that allow exact thermal conditions to be produced for profiles containing heating rate, target temperature, dwell time, and cooling. SMDs are automatically pre-aligned and picked up from component nest at exact centers after size is entered, and upward-looking camera verifies positioning. Split-vision optics and electronic zoom adjustment performs fine tuning.

DEK    Rolling Meadows, IL 60006
Feb 22, 2012 Enabling real-time continuous alignment adjustments and cleaning frequency adaptation, ProDEK optimizes throughput and yield while limiting operator intervention. From paste offset data feeds delivered to printer by SPI system, ProDEK monitors configurable quantity of PCBs, sending corrected forward/reverse offset to printer, which then adjusts paste on pad alignment in real-time. ProDEK also monitors high area warning counts, which may indicate excessive or insufficient understencil cleaning.

EV Group Inc.    Tempe, AZ 85284
Feb 14, 2012 Equipped with high-intensity UV light source and optional filter fan unit, EVG620HBL Gen II provides wafer throughput up to 165 6-in. wafers/hr. Robotic handling layout with wafer mapping capability supports demand for wafer traceability, while microscope supports automated mask pattern search, minimizing mask setup and change time. With recipe-controlled microscopes, illumination spectrum can be varied to ensure best pattern contrast with various wafer and layer materials.

Putnam Plastics Company, LLC    Dayville, CT 06241
Dec 12, 2011 Tri-Tie(TM) guide catheter shaft manufacturing replaces traditional hand lay-up manufacturing process of multiple components with continuous processing that creates 3-layer composite shaft, with maximum adhesion between layers for optimal performance. Solution also provides gradual transition of varying durometer outer layer without bonding or hinge points.

Essemtec Ag      Switzerland
Nov 15, 2011 Able to store up to 406 trays/reels (7 and 13 in. dia), fully automatic and modular Tower-XL can install close to pick and place machines to let machine operators store components and retrieve from stock just where needed. Unit controls diameter and barcode when storing reel, and access time for each is less than 12 sec. Included stock management software can control multiple towers, and other modules cover job planning and tracking of MSL classified components.

OK International    Garden Grove, CA 92841
Nov 14, 2011 Featuring free-standing board holder and adjustable tool holder, Model MRS-1100A manages diverse board sizes and thicknesses while providing stable working area. System is available with wide array of nozzles, preheater, adjustable tool holder, board holder, and light magnifier. By integrating advanced rework technologies, Model MRS-1100A offers flexible choice for removal of delicate SMT components.

Essemtec Ag      Switzerland
Nov 04, 2011 Available for Cobra and Paraquda pick-and-place machines, TCQ 18-bin changer can replace component tray in less than 5 sec and align it with better than 50 µm accuracy. Trays are stored in magazine that is equipped with handles and can be replaced. Standard magazines feature 18 or 14 slots, depending on tray thickness, each with room for one standard JEDEC tray; space also can be divided for several smaller trays. Capabilities can accommodate needs of small and lightweight components.

Essemtec Ag      Switzerland
Oct 31, 2011 Integrating active tape pull-back system and cutter, intelligent 12 mm Cobra Feeder facilitates and accelerates setup of component reels to SMD pick-and-place machines. One 12 mm tape feed takes less than 60 msec, and pickup position is reproducible within few micrometers. Due to feeder precision, pick-and-place head can pick up 4 components simultaneously from 4 different feeders. Feeders further simplify SMD reel setup by automatically threading tape and cover tape.

Essemtec Ag      Switzerland
Oct 24, 2011 Available in loader, unloader, and combined module, Models BHL-04 and BHU-04 replace pneumatic piston with electric telescope push-in, cutting overall length by ½ m. Loaders and unloaders can be integrated into any production line via SMEMA interface, while combined module is suitable for fully automatic batch solutions such as independent printing cells that serve multiple assembly lines. For programming, units include graphical touchscreen console where all parameters can be set and saved.

Essemtec Ag      Switzerland
Sep 15, 2011 Accommodating 2 dispensing heads simultaneously, Model CDS6200 utilizes micro-dispensing valves that can be modularly adjusted for numerous applications. Valves are suitable for small dosing dot sizes and non-contact dispensing applications such as dosing LED lenses. Designed to dispense small drops from 2 nl, valves can be exchanged, and fluidic part can be separated from drive part for cleaning and maintenance. Machine supports 3D-MID, which allows LEDs to be placed in any angle and direction.

KLA-Tencor Corp.    San Jose, CA 95134
Aug 19, 2011 Suitable for chip manufacturing at 20 nm device nodes and below, eDR(TM)-7000 electron-beam (e-beam) wafer defect review system addresses defect imaging and classification challenges at leading edge or located at bottom of deep trench/hole. System can drive directly to site of defect at high resolution, enabling review of multiple defects per second. Features include stage and vibration-isolation system as well as reticle defect review and voltage-contrast imaging modes.

ETCO South    Bradenton, FL 34203
Aug 02, 2011 To meet UL 749 dishwasher standard, ETCO Closed-Back Insulated Flag Applicator inserts small plastic cover into back of pre-assembled insulated flag terminal after it is processed and attached to wire. Plastic inserts are made of fire-retardant nylon. Featuring semi-automatic operation, benchtop pneumatic assembly machine processes up to 2,000 parts/hr.

Advanced Micro-Fabrication Equipment Corp    Shanghai 201201, PRC  China
Jul 22, 2011 Featuring 2-13.5 MHz switchable RF in addition to 60 MHz RF, Primo AD-RIE(TM) Advanced Decoupled Reactive Ion Etch system has mini-batch cluster architecture that can be configured with up to 3 dual-station process modules, each capable of dual- or- single-wafer processing. Chamber design incorporates plasma confinement and showerhead technology for optimum on-wafer performance. Additional features include symmetrical power distribution and triple-zone gas distribution with dual tuning gases.

EV Group Inc.    Tempe, AZ 85284
Jun 27, 2011 Available as option on EVG850TB and EVG850DB automated temporary bonding and debonding systems, In-Line Metrology Module can detect variety of thin-wafer process irregularities and defects, including total thickness variation of carrier wafer, adhesive layer, bonded stack, and thinned wafer; bow/warp of bonded stack; and voids in bond interface. Adding in-line metrology to thin wafer processing enables ramp-up of 3D-IC and TSV manufacturing from pilot-line to volume production.