ECTC is 1 Month Away! Visit Yincae Booth # 506 May 31st to June 3rd
ECTC is 1 MONTH AWAY! VISIT YINCAE BOOTH # 506 May 31st to June 3rd Albany, NY – ECTC is only 1 month away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV from May 31st to June 3rd. YINCAE hopes that you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer. YINCAE offers a variety of exclusive Adhesives, Thermal Interface,...
Read More »Henkel Solder and Thermal Innovations Earn Industry Recognition
Henkel Adhesive Technologies’ Electronics business was the big winner at the NPI Awards presented at last month’s APEX event in Las Vegas. Scoring victories in the Solder Materials and Underfill/Thermal Interface Materials categories for its Loctite® GC 3W and Gap Pad® EMI 1.0 materials, respectively, Henkel continues its streak of award wins for innovative product development. Hosted...
Read More »Henkel Solder and Thermal Innovations Earn Industry Recognition
Henkel Adhesive Technologies’ Electronics business was the big winner at the NPI Awards presented at last month’s APEX event in Las Vegas.- Scoring victories in the Solder Materials and Underfill/Thermal Interface Materials categories for its Loctite® GC 3W and Gap Pad® EMI 1.0 materials, respectively, Henkel continues its streak of award wins for innovative product development. ...
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Thermal Interface Thin Film improves heatsink cooling performance.
Carteret, NJ – The introduction of Sarcon® YR-c by Fujipoly® gives electronic packaging engineers an unprecedented level of performance from a thin film, thermal interface product. The new formulation delivers a thermal conductivity of 4.0 W/m°K with a thermal resistance of only .08°Cin2/W. When placed between a heat source such as a high-performance semiconductor and a nearby heatsink,...
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Comparing Casting Processes
This white paper compares and contrasts common casting processes.
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Thermal Interface Thin Film improves heatsink cooling performance.
Carteret, NJ- – The introduction of Sarcon® YR-c by Fujipoly® gives electronic packaging engineers an unprecedented level of performance from a thin film, thermal interface product. The new formulation delivers a thermal conductivity of 4.0 W/m°K with a thermal resistance of only .08°Cin2/W. When placed between a heat source such as a high-performance semiconductor and a nearby...
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Thermal Interface Material combines soft touch, high performance.
Carteret, NJ – Fujipoly® introduces Sarcon® PG80A, its newest high-performance, low compression force putty-like thermal interface material. The 13 W/m°K gap filler pad gently conforms to most component shapes and uneven surfaces to transfer heat from its source to a nearby heat sink or spreader while exhibiting a thermal resistance as low as 0.08°Cin2/W at 14 PSI. This advanced...
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Thermal Interface Material combines soft touch, high performance.
Carteret, NJ- – Fujipoly® introduces Sarcon® PG80A, its newest high-performance, low compression force putty-like thermal interface material. The 13 W/m°K gap filler pad gently conforms to most component shapes and uneven surfaces to transfer heat from its source to a nearby heat sink or spreader while exhibiting a thermal resistance as low as 0.08°Cin2/W at 14 PSI. This advanced...
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Low-Viscosity Gap Filling Material has high thermal conductivity.
Viscosity of- GAP FILLER 1400SL allows this 2-part, silicone-based, liquid gap filling material to flow in and around tight, uniquely shaped structures to fill small voids and provide thermal transfer to 1.4 W/m-K. When cured, soft material allows absorption of CTE stresses and provides mechanical shock dampening for fragile assemblies. Product cures at room temperature without any...
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Low-Viscosity Gap Filling Material has high thermal conductivity.
Viscosity ofÃ- GAP FILLER 1400SL allowsÃÂ this 2-part, silicone-based, liquid gap filling materialÃÂ to flow in and around tight, uniquely shaped structures to fill small voids and provide thermal transfer to 1.4 W/m-K. When cured, soft material allows absorption of CTE stresses and provides mechanical shock dampening for fragile assemblies. Product cures at room temperature without...
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Liquid Gap Filler delivers 3.5 W/m-K thermal conductivity.
To ensure reliable thermal interface for heat management, GAP FILLER 3500LV can fill tiny gaps and voids and offers zero shrinkage. This 2-part material, suited for use in applications that require optics to remain free of lens fogging,- addresses thermal requirements of next-generation product designs, produces minimal outgassing, and cures at room temperature. Accelerated curing can be...
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Come Alive Organics' Premium Organic Agave Provides a Healthier Choice
Come Alive Organics distributes all-natural, proprietary flavored agave for the food and beverage industry while helping children across the globe. Learn more about our agave products and our one sweet cause in this video and two-page PDF.
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