Thermal Interface Materials

Laird Technologies to Attend Strategies in Light 2013
Circuit Board Assembly Services

Laird Technologies to Attend Strategies in Light 2013

Company to Showcase Thermal Interface Materials St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will attend Strategies in Light 2013. The event will take place at the Santa Clara Convention Center in Santa Clara, California,...

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Thermal Interface Materials

Thermal Gap Fillers feature silicone-free design.

Offered in variety of thicknesses to suit virtually any need, Tflex™ SF800 features thermal conductivity of 7.9 W/mK, while Tflex™ SF200 offers thermal conductivity of 1.8 W/mK or 2.0 W/mK, depending on thickness. Silicone-free gap pads are naturally tacky on both sides and require no additional adhesive coating. In addition, SF200 is available with differential tack for assembly and rework....

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Electrolube Showcases New Silicone Resins, Conformal Coatings, and Non-Silicone Thermal Products at NEPCON South China
Resins

Electrolube Showcases New Silicone Resins, Conformal Coatings, and Non-Silicone Thermal Products at NEPCON South China

Electrolube, the global manufacturer at the forefront of chemicals technology for the electronics, automotive and industrial manufacturing industries, will showcase its newest SC Silicone range and non-silicone thermal products to the Chinese market at NEPCON South China 2012, taking place between the 28th to the 30th August at the Shenzhen Convention & Exhibition Centre. The new SC range of...

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Resins

SABIC Demonstrates High-Tech Materials Solutions for Top Healthcare Trends in Patient Safety and Device Portability at New MD&M Brazil

SÃ-ƒO PAULO, Brazil - Major healthcare industry trends, such as improving patient safety and creating smaller, more accessible devices, are receiving strong support from SABIC's Innovative Plastics business, which is spotlighting an array of advanced thermoplastic resins from its broad product portfolio here at the debut of MD&M Brazil 2012 (booth #709). Among the featured applications...

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Indium Corporation's Heat-Spring® Enhances Green Revolution's CarnotJet(TM) Server Cooling System
Electronics Coolers

Indium Corporation's Heat-Spring® Enhances Green Revolution's CarnotJet(TM) Server Cooling System

Indium Corporation's Heat-Spring® compressible soft metal thermal interface material is now being used in Green Revolution's CarnotJet(TM) liquid server cooling system. Green Revolution's CarnotJet(TM) System is one of the most powerful and efficient computer server cooling systems in the world. With over 100kW of cooling potential per rack, it can reduce a data center's total energy use by...

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Circuit Board Assembly Services

Henkel Develops Materials Innovations for High Power Electronics

Henkel develops materials innovations for high power electronics Advances in power electronics are key to a sustainable energy future: Semiconductor power devices such as insulated gate bipolar transistors (IGBTs) deliver the high switching speeds which are critical for energy efficiency in electric cars, trains and other industrial applications. For the use of alternative energies, ultra-high...

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Electrically Conductive Adhesive from Henkel Compatible with Multiple Metals; Delivers Manufacturing Flexibility for Optical Technology Leader, LensVector
Adhesives

Electrically Conductive Adhesive from Henkel Compatible with Multiple Metals; Delivers Manufacturing Flexibility for Optical Technology Leader, LensVector

Leveraging research regarding contact resistance performance, Henkel Electronic Materials has developed an electrically conductive adhesive (ECA) that overcomes the drawbacks of older generation ECAs and extends the material's advantages to multiple applications. The adhesive system, HYSOL ECCOBOND CE 3103WLV, provides exceptional contact resistance stability on surfaces such as OSP copper and Sn...

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Miscellaneous Compounds

PLA Compounds offer high strength and heat resistance.

Impact-modified polylactic acid (PLA) bioplastic compounds are designed for select semi-durable and durable applications and offer enhanced impact strength and high heat deflection temperatures. Available in both injection and extrusion grades, PLA compounds are fully colorable and have bio-content as high as 95% depending on additive loading levels. Applications include molded covers, housings,...

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Miscellaneous Compounds

PLA Bioplastic Compounds deliver strength, thermal performance.

Glass fiber-reinforced polylactic acid (PLA) compounds, optimized for strength, stiffness, and thermal performance, target durable and semi-durable applications. Engineered bioplastic compounds offer sustainable alternative to traditional hydrocarbon-based thermoplastics. Fully colorable, PLA bio-polymers have glass fiber loadings from 10%-40%; 30% grade has 16,500 psi tensile strength, 1,630,000...

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Thermal Interface Materials

Phase Change Material offers optimized handling, dispensability.

Suited for use between high-power electrical device requiring electrical isolation and its heat sink, Hi-Flow® 650P thermally conductive phase change material offers thermal impedance of 0.20Â-ºC-in.²/W at 25 psi. Top side is dry to touch, bottom side has natural tack, and polyimide film reinforcement provides dielectric strength as well as cut-through resistance. Appropriate...

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