New Thermal Gap Fillers with an Embedded Fiberglass Support
Features include highly compressible, promote heat dissipation and conform to irregular surfaces. Thermal conductivity is significantly greater than air (0.025 W/m K) and ranges from 1 to 5 W/m K. Ideal to fill the air gaps between printed circuit board (PCB) components.
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New Silicone Sponge Gaskets and Pads with ESD Grounding Properties
Available in a non-conductive condition, with electrical insulating properties. Offers T62 conductive surface coating process to improve yields in static sensitive industries. Used around aerospace hardware and cushioning pads in electronic assembly.
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New Silicone Sponge Gaskets and Pads with ESD Grounding Properties
Available in a non-conductive condition, with electrical insulating properties. Offers T62 conductive surface coating process to improve yields in static sensitive industries. Used around aerospace hardware and cushioning pads in electronic assembly.
Read More »New Halogen Free Material Comes with Thermal Conductivity of 0.70 W/mK
Available with core thickness ranging from 0.0020 in. (0.05 mm.) to 0.063 in. (1.5 mm.). Capable of operating at continuous operating temperature up to 175°C. Ideal for applications requiring high voltage, high power, and long-term thermal stability.
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Understanding Lights Out Manufacturing
This white paper gives an overview of understanding lights out manufacturing.
Read More »New Halogen Free Material Comes with Thermal Conductivity of 0.70 W/mK
Available with core thickness ranging from 0.0020 in. (0.05 mm.) to 0.063 in. (1.5 mm.). Capable of operating at continuous operating temperature up to 175°C. Ideal for applications requiring high voltage, high power, and long-term thermal stability.
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New Thermal Interface Material is Ideal for Applications with Delicate or Varied Height Components on PCB
Available in four sheet thicknesses (0.5, 1.0, 1.5, 2.0 mm.) up to a maximum dimension of 300 mm. x 200 mm. Delivers thermal conductivity of 8.0 W/m°K with thermal resistance as low as 0.05°C•in2/W at 43.5 PSI. Suitable for environments with operating temperatures ranging from -40 to +150°C.
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New Thermal Interface Material is Ideal for Applications with Delicate or Varied Height Components on PCB
Available in four sheet thicknesses (0.5, 1.0, 1.5, 2.0 mm.) up to a maximum dimension of 300 mm. x 200 mm. Delivers thermal conductivity of 8.0 W/m°K with thermal resistance as low as 0.05°C•in2/W at 43.5 PSI. Suitable for environments with operating temperatures ranging from -40 to +150°C.
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New Line of Thermal Gap Fillers with Electrical Insulative Properties
LG23A and LG30A simply dispense in a liquid form that will cure at room temperature. Delivers a thermal conductivity of 2.3 and 3.0 W/m°K respectively. Ideal for filling large, complex and uneven gaps between heat generating components.
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New Line of Thermal Gap Fillers with Electrical Insulative Properties
LG23A and LG30A simply dispense in a liquid form that will cure at room temperature. Delivers a thermal conductivity of 2.3 and 3.0 W/m°K respectively. Ideal for filling large, complex and uneven gaps between heat generating components.
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New Gap Filler Pads Range in Thickness from 0.50 to 5.00 mm
SARCON® thermal interface materials provide thermal conductivity between 1.3 and 4.5 W/m°K with a thermal resistance between 0.19 and 2.58°Cin2/W. Balances the performance demands of thermal conductivity, thermal resistance, gap thickness and production cost. Offered in pre-cut sheets that can be die-cut or trimmed to virtually any size or proprietary shape for the perfect component fit.
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Basalt America Announces Stronger, Lighter, and Corrosion-Free FRP's (Fiber Reinforced Polymers)
Fiber Reinforced Polymers (FRP), represents a truly groundbreaking advancement in structural reinforcement. Lightweight, strong, and green, they are changing the way the construction industry thinks about rebar. Unlike steel, FRPs don't rust and are far stronger than standard rebar. To learn why Fiber Reinforced Polymers are poised to change the way the world builds, see our video.
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