New Heat Sink Grease from ACL Staticide is REACH and RoHS Compliant
Available in 5-ounce tubes that is compatible with most materials used in electrical and electronic assemblies. Offers dialectic strength and low bleed properties that make it ideal for various applications including engineering and design work. Comes in ready-to-use convenient delivery system that does not dry out, harden or melt.
Read More »
New Thermally Conductive Gap Filler Pads for Delicate Components or Widely Varying Gap Distances
Exhibits compression forces less than 15PSI, depending on thickness. Thickness options range from 1.00mm to 5.00mm with thermal conductivity between 1.5 and 2.8 W/m K. TIMs help avoid overstressing the PCB and fragile solder joints as interface material is compressed between the heatsink and board-level components during assembly.
Read More »
Don't Get Stressed Out
Carteret, NJ —Wednesday, November 20, 2019— The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and...
Read More »
New Sarcon GR45A for Higher Power Electronics Applications
Offered in thicknesses from 0.50mm to 5.0mm and can be custom cut to precisely fit the shape you need up to a maximum dimension of 300mm × 200mm. Delivers thermal conductivity of 6.0 W/m•K. Thermal resistance ranges from 0.24 to 0.70 °C•in2/W.
Read More »
Lower Barriers to Delivering Integrated Supply Solutions
A commitment to integrated supply is not for the faint of heart, and requires substantial resources dedicated to sourcing, logistics, taxonomy and identification, multi-shift supply room staffing, KPI reporting and more. How do you get into this space while overcoming significant barriers to entry?
Read More »
New Thermal Gap Filler Available in Sheets up to 300 x 200 mm
Sarcon® GR80A-00-100GY delivers a thermal conductivity of 13.0 W/m•K with a thermal resistance of only 1.0° C•in2/W. Silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. Can be die-cut to fit users exact application shape.
Read More »
Fujipoly Releases Sarcon PG80A Thermal Interface Material for Applications Requiring Material Compression Between 30 and 90 Percent
Available in 0.5, 1.0, 1.5 and 2.0 mm sheet thicknesses up to maximum dimension of 300 x 200 mm. Exhibits a thermal resistance of 0.08°C.in²/W at 14.5 PSI and a thermal conductivity of 13 W/m°K. Suitable for applications with operating temperature ranging from -40 to +150°C.
Read More »
Henkel Innovations Take Top Honors at IPC APEX EXPO Event
Irvine, CA – At last month’s IPC APEX EXPO event in San Diego, CA, Henkel Corporation’s BERGQUIST® GAP PAD® TGP 7000ULM thermal interface material (TIM) and LOCTITE® ECCOBOND® UF 11173 underfill were selected as winning products in the Circuits Assembly magazine NPI Awards contest. The new underfill formulation was also chosen as one of five stand-outs in the IPC APEX EXPO Innovation...
Read More »
Indium Corporation Introduces m2TIM Interface Material That Improves Thermal Conductivity
Available in InGa and InGaSn variants and offers wetting ability to metallic and non-metallic surfaces. Combines liquid metal with a solid metal preform for providing reliable thermal conductivity for heat dissipation. Exhibits low interfacial resistance and eliminates the risk of pump-out of the liquid alloy.
Read More »
Indium Corporation Features Metal Thermal Interface Materials for Burn-in and Test at TestConX Workshop 2019
Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz. A pure indium Heat-Spring® in the HSK pattern can be clad on one side with a thin layer of aluminum, which will prevent the indium from sticking to the device under test (DUT). Due to the thinness of the aluminum,...
Read More »
New Bergquist Gap Pad Thermal Interface Materials Feature Low Assembly Stress
Include TGP 6000ULM and TGP 7000ULM materials with thermal conductivity of 6.0 W/m-K and 7.0 W/m-K respectively. Offered in custom-cut shapes and sizes with top and bottom side protective liners. Used in telecom and datacom applications such as routers, switches, servers and base band units.
Read More »
Clear Clogged Drains Faster with General Pipe Cleaners' Kinetic Water Ram
The Kinetic Water Ram by General Pipe Cleaners clears out clogged pipes quickly using kinetic energy. The Ram is so simple to operate, anyone can use it. Check out the video to learn more.
Read More »
