Thermal Interface Materials

Spinnaker Coating Announces New Polypropylene Film
Miscellaneous Film

Spinnaker Coating Announces New Polypropylene Film

Troy, OH -Spinnaker Coating now offers 4 mil TC Matte White Polypropylene. The extra thickness of this film, compared to lower caliper material, allows it to have excellent success in thermal transfer machines. The stiffness is ideal for print-and-apply and print-and-present label applications, and it performs as well or better than other similar films touting the same dispensing benefits. In...

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Ultra-low Silicone Gap Filler suits silicone-sensitive applications.
Thermal Interface Materials

Ultra-low Silicone Gap Filler suits silicone-sensitive applications.

Available in 8.3 x 11.7 in. sheets or die-cut parts, TP-S3LS pads contain less than 50 ppm of silicone while providing 3.0 W/mK of thermal conductivity between hot components and their heat sinks. Standard sheet thicknesses range from 0.020-0.196 in., and compliance allows for compression and filling of air gaps between irregular mating surfaces. Used in temperatures up to 200°C, product...

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Thermal Adhesive Film aids heat-transfer in electronic parts.
Miscellaneous Film

Thermal Adhesive Film aids heat-transfer in electronic parts.

Thermal adhesive film FL901AO provides heat-transfer path between heat-generating components and heat sinks or other cooling devices. Curing in 1 hr at 250°F or 30-40 min at 300°F, B-stage adhesive-preform features thermal conductivity on level of 10 BTU-in/ftÂ-²hr°F and volume resistivity exceeding 10 x 1012 W-cm. Properties are maintained over temperature range of -100 to...

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Thermal Management Materials

Thermal Management Material optimizes performance of LEDs.

Designed to transfer heat generated by LED lamps, LTM6300-SP Thermal Interface Material helps minimize power use and maximize lifespan for light emitting diodes. Used mainly as screen printable paste, phase change material was designed for LED backlights used in flat panel displays, but packaging technology can also be implemented in LEDs used in wide range of industries, from automobiles to...

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Thermal Interface Material is optimized for IGBT modules.
Thermal Interface Materials

Thermal Interface Material is optimized for IGBT modules.

Heat-Spring® metallic thermal interface material is soft metal alloy developed as compressible metallic shim suitable for IGBT mounting applications. Material's Heat-Springs are compressible soft metal performs that adapt to irregularities in mounting surface and are conductive both thermally and electrically. No special mounting apparatus is required. Heat-Springs are made of 100%...

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Gel Paste offers thermal conductivity up to 6.5 W/moK.
Coatings

Gel Paste offers thermal conductivity up to 6.5 W/moK.

Supplied in syringe to facilitate application, V30Z63MDP Series features specific volume resistance ratio up to 7.2 x 1014 Wocm, dissipation factor down to 0.0004 at 1 MHz, and breakdown voltage up to 9.6 kV/mm. RoHS-controlled substance is used to fill gaps around heat sources such as semiconductors. Other applications involve surface, underside, and lead heat sources such as ICs, as well as...

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Thermal Interface Material is silicone-free.
Miscellaneous Film

Thermal Interface Material is silicone-free.

Keratherm U 90 consists of ceramic-filled polyurethane film with thermal conductivity of 6.0 W/mK and thermal impedance of just 0.05 Kin2/W. They feature voltage breakdown property of 4.0 kV, and provide perforation protection with tensile strength of 2.5 N/mm2 and Shore A hardness of 70. Available in 0.100 and 0.200 mm thicknesses, material suits application in medical devices, laser equipment,...

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Thermal Interface Materials

Dow Corning Electronics Introduces its High-Performance TC-5026 Thermal Grease to the Automotive Industry

Reliability, Stability and Low Thermal Resistance Make it Ideal for Demanding Auto Applications MIDLAND, Mich., Sept. 30 -- Dow Corning Corporation's Automotive Electronics group today announced that its DOW CORNING® TC-5026 Thermally Conductive Compound is now available for automotive industry use. Although originally developed primarily for use in computer-industry semiconductor...

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Miscellaneous Compounds

Thermally Conductive Compound resists pump-out.

Developed for use with Intel® Core®2 Extreme mobile processor QX9300, TC-5688 non-curing thermal grease offers low thermal resistance of 0.05°C-cmÂ-²/W and thermal conductivity of 5.67 W/mK. Product performs in real-world applications involving non-uniform substrates and varying bond line thicknesses. TC-5688 is also suitable for non-computing areas including power,...

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Thermal Interface Materials

Soft Gap Filler suits thermal interface applications.

T-flex(TM) 700, with 5.0 W/mK thermal conductivity and shore OO hardness value of 50, exhibits high compliancy that accommodates applications with high tolerance stack-up and low mechanical stress on components. Available in standard sheets or die cut parts that can be customized, soft gap filler has 0.040-0.200 in. thickness range in 0.010 in. increments. RoHS compliant product targets...

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