DLI Announces Line of Healthcare-Centric Rugged Tablets & PDA
LAPORTE, Ind. - DLI (www.dataltd.com), a leading manufacturer of rugged tablets, in-vehicle computers, and mobile POS devices today announced the release of three new medical-grade rugged devices - DLI 7200M Rugged Healthcare PDA, DLI 8800M Rugged Healthcare Tablet & DLI 9000M Rugged Healthcare Tablet. DLI medical-grade rugged tablets provide hospitals, clinics and homecare professionals the...
Read More »Modular Box Computer uses AMD single or dual core processor.
Available as independent unit or with display, Model BC50I is based on AMD's Embedded G-Series, which combines scalable CPU/GPU into single embedded device. Standard model features 1.4 GHz T48N APU, Radeon HD 6310 GPU, and 2 GB DDR3 SDRAM. Front panel hasÃ- 2 DisplayPort interfaces, with max resolution of 2,560 x 1,600 each, as well as 2 Gigabit Ethernet ports, 2 USB 2.0 ports, and 2...
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Industrial ATX Motherboard serves DVR, NVR, and signage markets.
Based on IntelÃ-® B75 Express chipset, IMB204 accommodates 22 nm, third generation IntelÃ-® Core™ i7/i5/i3 processors in LGA1155 socket. Embedded board also supports 32 GB DDR3 1333/1600 system memory and PCIe x16 Gen 3 as well as SATA-600 interfaces, whileÃ- IntelÃ-® HD Graphics with DX11 support enables optimal graphic processing and dual-view capability. Along with diverse...
Read More »COM Express Modules utilize 3rd Gen Intel-® Core(TM) technology.
Equipped with Intel HM76 Express Chipset, conga-TS77 and conga-BS77 are available with 2.20 GHz dual-core IntelÃ-® CeleronÃ-® Processor 1020E, 1.40 GHz dual-core Intel Celeron Processor 1047UE, or 1.50 GHz single-coreÃ- Intel Celeron Processor 927UE. Modules offer up to 16 GB of dual-channel DDR3 memory plus direct support for USB 3.0 and Intel Hyper-Threading Technology. Additional...
Read More »Adhesive Tapes for Energy & Utility Applications
Read about the various types of tapes used in energy and utility applications.
Read More »Embeddable XMC Module targets avionics applications.
Featuring advanced API software, Model RAR15-XMC combines 4 dual-redundant MIL-STD-1553A/B Notice II channels, 10 ARINC 429 receive channels, and 8 ARINC 429 transmit channels. Simultaneous Scheduled and Burst Mode messaging is supported on all ARINC 429 transmit channels. In addition to 8 MB of RAM and 64-bit message time tagging, conduction cooled board provides BC and RT link-list structures,...
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COM Express Type 10 Module is suited for fanless designs.
Suitable for embedding into space-constrained devices in thermal-critical applications, 84 x 55 mm NanoCOM-CV Rev.BÃ- is powered via 1.6 GHz, BGA type dual core IntelÃ-® Atom™ N2600 processor, features 2 GB DDR3 800 MHz onboard memory, and also comes in wide temperature (-40 to +85Ã-
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MicroTCA Carrier Hubs support MTCA.4 specification.
Suited for high-speed data acquisition applications, ModelsÃ- AM4904/AM4910 support 4 high-speed fabric variants, including GbE, sRIO, PCIe, and 10 GbE. Units are equipped with 600 MHz PowerPC 405 EX processor for MCMC functionality and switching management, and enable redundant system architectures with up to 12 AMCs, 2 cooling units, and 4 power units. To provide support for various telco...
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ULP Computer-on-Module fosters enhanced SFF system development.
Helping embedded OEMs develop ULP SFF (ultra-low power small form factor) solutions, ULP-COM-sA3874i provides scalable building block suited for space-constrained, fanless, and harsh environment applications. COM leverages single-core ARM Cortex A8 technology performance based on TI AM3874 Sitara ARM processors; offers diverse interface, storage, and networking...
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CompactPCI SBC supports machine and factory control.
Combining 1.0 GHz Celeron processor 807UE with IntelÃ-® QM77 Platform Controller Hub, 3U Model CP3003-VÃ- provides 1 MB Smart Cache and up to 4 GB DDR3 1,333 MHz SDRAM memory. Double slot version offers comprehensive set of interfaces such as 1x VGA, 2x DisplayPort, 1x USB 3.0, 2x USB 2.0, 3x Gigabit Ethernet ports, and Serial port on front panel plus option to hold CFast module or up to...
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Embedded Box PC features integrated graphics accelerator.
Housed in 75 x 350 x 260 mm chassis, CB 753 Dual Head provides connections for 2 digital or 4 analog displays, making it suitable for fanless multi-display applications with high-resolution graphics. Unit is equipped with 2.26 GHz Intel Core 2 Duo Mobile processor and up to 8 GB DDR3 RAM. Configurable interfaces include 4x USB, 3x GB LAN, 4x RS232, PS/2 M+K, Line in, MIC In, 7.1 HD Audio, and 1x...
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ISO-Certified Plastic Injection Molding from Rodon
The Rodon Group is a proven leader in high-volume, close tolerance injection molding. We offer globally competitive, innovative manufacturing solutions for a broad range of industries. Check out our video to learn more.
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