Semiconductor Processing Equipment

Semiconductor Processing Equipment

Power Delivery System suits semiconductor etch applications.

Fully integrated VHF Ovation(TM) delivers power up to 2.7 kW at fixed 60 MHz. It features onboard plasma measurement and enables fast, high-precision processes such as those required for sub-90 and sub-65 nm etch applications. Compact, half-rack unit delivers power into non 50 ohm environment without external sensor. It includes embedded voltage and current measurement technology for real-time...

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Stud Bumper handles 12 in. wafers in one pass.
Semiconductor Processing Equipment

Stud Bumper handles 12 in. wafers in one pass.

WaferPRO plus single-pass stud bumper bonds 22 bumps/sec, depending on bump type, size, and pitch. It offers +5 Â-µm positional accuracy at 3 sigma and can bump down to 65 µm. Various manual chucks and fully automatic wafer handling options are available. WaferPRO plus kit, which includes hardware, specialized servo code, and motion profiles, provides upgrade path for existing...

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Semiconductor Processing Equipment

Single-Reticle Pod transports and stores 150 mm reticles.

RSP-150 SMIF-POD(TM) features metal-free, gasket-sealed construction minimizing opacity, particle contamination, and drying time, while maximizing cleanability without disassembly. Streamlined design increases storage density. Optional AdvanTag(TM) tracking system with integrated RFID ties into socket built into unit to enable snap-on use of RFID transponder pill. For use in 300 mm fabs, optional...

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