VESTA Announces Multi-Chamber Order for Its VULCAN System to Leading Foundry in Taiwan
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Posted: November 27, 2007
VESTA Technology, Inc., a leading supplier of production proven thermal process systems and an industry innovator in atomic layer deposition (ALD), today announced it received a multi-chamber order for its VULCAN(TM) Single wafer High-k and Metal ALD system from the largest leading foundry based in Taiwan. The foundry, a new ALD customer for VESTA, plans to utilize the VULCAN(TM) systems for memory device production at the 65-nm and below geometries. The tools will help support the foundry's technology requirements and capacity targets for its 300-mm fab where the systems will be shipped to the foundry's latest manufacturing facility.
"We are very pleased to have received this multi-chamber order from this foundry customer. This new ALD customer penetration enables the company to further expand its global presence and increase its ALD market penetration," said Chuck Kim, Vice President of VESTA Technology, Inc. "This order was a result of VESTA's ability to demonstrate its expertise and experience on high-k and metal ALD technology, offering revolutionary solutions with the technical flexibility and the versatility of the VULCAN(TM) cluster ALD system."
A unique feature of the VULCAN(TM) system is a versatile and flexible design providing either in-situ and/or sequential dual mode with both ALD and CVD processing capability. VESTA's dual mode deposition technology allows the integration of a precision ALD technology for initial layers with the gas phase reactions such as pseudo-CVD, CVD, etc for bulk layers for enhanced productivity. Both the ALD layer and the CVD fill can be deposited within the same VULCAN(TM) Process Module with or without plasma. The integration of in-situ and/or sequential deposition approach overcomes both the film quality limitation of CVD processing and the low deposition rate limitation of ALD processing. In addition, the VULCAN(TM) System can provide an integrated SoftEtch process module which can provide wafer pre cleaning capability to reduce and minimize interfacial layer before high-k and/or metal film depositions with a controlled environment utilizing advanced MICP (Multi-pole Inductively Coupled Plasma) technology.
About VESTA Technology, Inc.:
VESTA, headquartered in San Jose, Calif. is a leading supplier of next generation thermal processing and deposition solutions to the global semiconductor and nano-technology industries. VESTA's R&D and Demo facilities are located at ATDF (atdf.com) in Austin, TX, a wholly owned subsidiary of SEMATECH. IPS Ltd. (www.ips-tech.com) located in Pyungtaek, S. Korea is an exclusive partner and equipment provider to VESTA with an exclusive technology license and world-wide distributorship agreement. Additional information about the company can be found at vestatechnology.com.
