Despatch Industries Receives Large Order for Clean Process Ovens from Semiconductor Manufacturer
Minneapolis, Minn., U.S.A. - Despatch Industries, the world's leading thermal processing equipment provider for over one hundred years, announces that the company has received a large order for its LLD inert atmosphere clean process ovens from a long-time customer in the semiconductor industry. The customer will use the ovens to perform stress baking of wafers for its innovative semiconductor...
Read More »Despatch Industries Receives Large Order for Clean Process Ovens from Semiconductor Manufacturer
Minneapolis, Minn., U.S.A. - Despatch Industries, the world's leading thermal processing equipment provider for over one hundred years, announces that the company has received a large order for its LLD inert atmosphere clean process ovens from a long-time customer in the semiconductor industry. The customer will use the ovens to perform stress baking of wafers for its innovative semiconductor...
Read More »Wafer Defect Review System is designed for 20 nm node.
Suitable for chip manufacturing at 20 nm device nodes and below, eDR(TM)-7000 electron-beam (e-beam) wafer defect review system addresses defect imaging and classification challenges at leading edge or located at bottom of deep trench/hole. System can drive directly to site of defect at high resolution, enabling review of multiple defects per second. Features include stage and vibration-isolation...
Read More »Wafer Defect Review System is designed for 20 nm node.
Suitable for chip manufacturing at 20 nm device nodes and below, eDR(TM)-7000 electron-beam (e-beam) wafer defect review system addresses defect imaging and classification challenges at leading edge or located at bottom of deep trench/hole. System can drive directly to site of defect at high resolution, enabling review of multiple defects per second. Features include stage and vibration-isolation...
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Advantages of Nylon Washers and Other Non-Metallic Materials
Check out this white paper to learn about the types of non-metallic washers.
Read More »Etch Tool meets process requirements of 22 nm and beyond.
Featuring 2-13.5 MHz switchable RF in addition to 60 MHz RF, Primo AD-RIE(TM) Advanced Decoupled Reactive Ion Etch system has mini-batch cluster architecture that can be configured with up to 3 dual-station process modules, each capable of dual- or- single-wafer processing. Chamber design incorporates plasma confinement and showerhead technology for optimum on-wafer performance. Additional...
Read More »Etch Tool meets process requirements of 22 nm and beyond.
Featuring 2-13.5 MHz switchable RF in addition to 60 MHz RF, Primo AD-RIE(TM) Advanced Decoupled Reactive Ion Etch system has mini-batch cluster architecture that can be configured with up to 3 dual-station process modules, each capable of dual- or- single-wafer processing. Chamber design incorporates plasma confinement and showerhead technology for optimum on-wafer performance. Additional...
Read More »Best of West Finalist, MonolithIC 3D, Inc., Announces Multiple 3D IC Technologies at SemiconWest
SAN JOSE, Calif. - MonolithIC 3D, Inc., the innovator of practical monolithic 3D IC technology, has unveiled multiple 3D IC technologies that now cover most mainstream semiconductor device types. Besides logic structures, these monolithic 3D technologies include DRAM, NAND Flash and RRAM memory types, FPGA and gate arrays, as well as methods of fabricating image sensors and micro-displays. With...
Read More »Best of West Finalist, MonolithIC 3D, Inc., Announces Multiple 3D IC Technologies at SemiconWest
SAN JOSE, Calif. - MonolithIC 3D, Inc., the innovator of practical monolithic 3D IC technology, has unveiled multiple 3D IC technologies that now cover most mainstream semiconductor device types. Besides logic structures, these monolithic 3D technologies include DRAM, NAND Flash and RRAM memory types, FPGA and gate arrays, as well as methods of fabricating image sensors and micro-displays. With...
Read More »Wafer Bonding System offers in-line metrology module.
Available as option on EVG850TB and EVG850DB automated temporary bonding and debonding systems, In-Line Metrology Module can detect variety of thin-wafer process irregularities and defects, including total thickness variation of carrier wafer, adhesive layer, bonded stack, and thinned wafer; bow/warp of bonded stack; and voids in bond interface. Adding in-line metrology to thin wafer processing...
Read More »Wafer Bonding System offers in-line metrology module.
Available as option on EVG850TB and EVG850DB automated temporary bonding and debonding systems, In-Line Metrology Module can detect variety of thin-wafer process irregularities and defects, including total thickness variation of carrier wafer, adhesive layer, bonded stack, and thinned wafer; bow/warp of bonded stack; and voids in bond interface. Adding in-line metrology to thin wafer processing...
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Clear Clogged Drains Faster with General Pipe Cleaners' Kinetic Water Ram
The Kinetic Water Ram by General Pipe Cleaners clears out clogged pipes quickly using kinetic energy. The Ram is so simple to operate, anyone can use it. Check out the video to learn more.
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