Semiconductor Processing Equipment

Semiconductor Processing Equipment

New Tools from DEK Enable 25 Micron Backside Wafer Coating at High-Speed

Fueled by the need for faster processing times and smaller device footprints, DEK has developed a next-generation equipment and tooling package that enables the coating of wafers with ultra-thin die attach materials down to 25 microns in thickness. Traditional dispensing methods and paste die attach processes have manufacturing challenges such as the inability to achieve emerging UPH (units per...

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MKS' TOOLweb® Sensor Integration Platform Wins Editors' Choice Best Product Award
Semiconductor Processing Equipment

MKS' TOOLweb® Sensor Integration Platform Wins Editors' Choice Best Product Award

Wilmington, MA, July 5, 2006 - MKS Instruments, Inc. (Nasdaq: MKSI), a leading provider of process control technologies for improving productivity in semiconductor and other advanced manufacturing processes, is pleased to announce it has received the esteemed Editors' Choice Best Product Award, presented annually by Semiconductor International magazine, for the TOOLweb® Sensor Integration...

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Semiconductor Processing Equipment

Mott Corporation at Semicon West 2006

Exhibiting High Purity Filtration Products and Engineered Solutions FARMINGTON, CT [June, 2006] - Mott Corporation will be showcasing a variety of their all-metal products with a particular emphasis on engineered solutions for the semiconductor and other high tech industries. In addition to Mott's industry leading line of gas filtration products, the company will display a variety of all-metal...

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Wet Process Stations suit semiconductor facilities.
Semiconductor Processing Equipment

Wet Process Stations suit semiconductor facilities.

Satisfying stringent cleanliness requirements of semiconductor process facilities, Series 1414 achieves flexibility by mounting components on support rails. Stations include modular electrical devices and plumbing systems, and are available in white stress-relieved polypropylene, natural polypropylene, fire retardant polypropylene, stainless, and PVC. Based on touch-tone microprocessors, units...

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Semiconductor Processing Equipment

Semitool's New Raider® Platform Used by Casio to Increase Lead-Free Capacity for 300mm Wafer-Level Packaging

Semitool Delivers Follow-on Raider for 300mm Lead-Free Electroplating KALISPELL, Mont., Dec. 5 -- Semitool, Inc. (NASDAQ:SMTL), a leading manufacturer of advanced single-wafer deposition and surface preparation process equipment for the semiconductor and wafer-level packaging industry, today announced the delivery of a follow-on order for Semitool's electroplating Raider tool by Japan-based Casio...

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Semiconductor Processing Equipment

Analyzer facilitates lithography cell qualification.

Integrated with Archer overlay, eCD CD SEM, and SpectraCD optical CD metrology platforms for 65 nm and below IC production, K-T Analyzer lithography correctable platform provides automated, on-tool analysis of overlay and critical dimension metrology data in real time. System gives engineers immediate feedback on quality of lithography process, enabling them to correct errors, minimize...

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Semiconductor Processing Equipment

Luminescent to Provide Enabling Lithography Platform to Cypress's Silicon Valley Technology Center

SVTC and Luminescent to Jointly Develop New Manufacturing Approach Using Inverse Lithography Technology (ILT) MOUNTAIN VIEW, Calif. and SAN JOSE, Calif., Oct. 3 -- Luminescent Technologies, Inc. and Silicon Valley Technology Center (SVTC), a division of Cypress Semiconductor Corp. (NYSE:CY) today announced a joint development program in which the companies will collaborate on advanced lithography...

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Semiconductor Processing Equipment

Strip System can be configured with 2 dual-wafer modules.

Suited for high-volume manufacturing at 90 nm node and below, Suprema 300 mm Strip System is based on modular design that makes it suited for development and production environments. Vacuum and atmospheric robots deliver throughput greater than 300 wafers/hr, and vacuum robot is capable of transferring 4 wafers simultaneously. Inductively coupled plasma source provides strip rates over 9...

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Reader tracks semiconductor wafers through manufacturing.
Semiconductor Processing Equipment

Reader tracks semiconductor wafers through manufacturing.

Featuring image formation technology and OCR, 2D matrix, and barcode recognition algorithms, In-Sight® 1721 delivers reliable reading performance on SEMI-standard scribes. It can read wafer marks that have been affected by CMP, edge beads, copper metallization, and blue or green nitride coating. GUI facilitates set up, and automatic tuning minimizes operator intervention. Built-in network...

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