Wet Processing Work Station cleans semiconductor components.
Suitable for cleaning silicon wafers, solar cells, and other semiconductor components, Wet Processing Cleaning Station houses sink, gooseneck faucet, spray guns, and perforated surface with raised lip to contain spills. Transparent sliding front sash protects personnel from splashes while fluorescent light illuminates surface. Offered in white polypropylene or stainless steel, both of which...
Read More »Nordson ASYMTEK has been honored with the 2016 Global Technology Award for its IntelliJet Jetting System.
Nordson ASYMTEK Receives 2016 Global Technology Award for the IntelliJet Jet Dispensing System Award presented at SMTA International 2016 Joe Stockunas, vice president, Advanced Technology, Nordson Corporation, accepts award Carlsbad, CA, USA - Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), the global leader in dispensing, jetting, and coating equipment and technologies, has been honored with...
Read More »FEI Launches Three New Tools for Next-Generation Semiconductor Manufacturing
New solutions are designed to address the challenges of 7nm technology node metrology and defect/failure analysis.Â- Hillsboro, Ore. - FEI (NASDAQ: FEIC) announced today the release of three new tools for process control and defect/failure analysis in advanced semiconductor manufacturing. Two of the tools are specifically targeted at the 7nm node, and all are designed to allow manufacturers...
Read More »Ultratech and Qoniac Jointly Develop 3D Lithography APC Solution
3D Distortion Inspection and Lithography APC Leaders to Deliver Second Generation 3D Distortion Lithography APC SAN JOSE, Calif. - Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBÂ- -LEDs), as well as atomic layer deposition (ALD) systems, and Qoniac GmbH of...
Read More »
Designing a cast or forged component? What Industrial Designers Need to Know About ‘Design for Manufacturing' Before Reaching for a Pencil.
To learn more about how you can save time and money with design for manufacturing strategies, download now.
Read More »
MEI Wet Processing's Patent Covers Unique, Low Cost, Batch Immersion Metal Lift-Off Process
ALBANY, Ore.Â- – MEI Wet Processing Systems and Services announced today their receipt of a patent from the US Patent Office for one of their targeted semiconductor processing applications. This patent protects MEI's unique metal liftoff process which was trademarked earlier under the name FluidJet™. The U.S. Patent No. 9,070,631 describes a new approach to providing metal liftoff by...
Read More »Cavium Unveils Flash Support for the Cavium ThunderX(TM) Processor Family
ThunderX processors with SanDisk Flash solutions will accelerate performance for HPC and Hyperscale workloads FRANKFURT, Germany - Cavium, Inc., (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for enterprise, data center, cloud, wired and wireless networking, today announced support for SanDisk flash memory solutions with Cavium's 64-bit...
Read More »Picosun Wins Market in IC, MEMS, and LED Manufacturing
ESPOO, Finland — Picosun Oy, the leading provider of high quality Atomic Layer Deposition (ALD) technology for global industries, reports winning important production markets in MEMS, LED, and other III-V compound semiconductor device manufacturing. To provide these manufacturers with always the best, most comprehensive ALD solutions, Picosun has extended its range of automatic vacuum batch...
Read More »
Inspection System supports advanced semiconductor packaging.
Designed for characterization and monitoring of processes used in wafer-level packaging, CIRCL-AP™ enables all-surface wafer defect inspection, review, and metrology at high throughput. ICOS® T830 provides fully automated optical inspection of IC packages, leveraging sensitivity with 2D and 3D measurements to determine final package quality for diverse device types and sizes. Both systems...
Read More »Hardmask Materials enable advanced semiconductor nodes.
Targeting 10 nm node semiconductor processing, 3D NAND, power ICs, andÂ- MEMS applications, SAP-100 Materials are based on organo-siloxane modified spin-on metal oxide thin films that are compatible with advanced photoresist lithography. Products offer tunable optical properties and provide optimized etch resistance in plasma etching processes, even at very low film thicknesses. Materials...
Read More »Budzar Industries Acquires BV Thermal Systems
Budzar Industries, Inc., a leader in process fluid heat cold transfer systems that measure and control the temperature of primary processing equipment, announces the recent acquisition of BV Thermal Systems, LLC of Modesto, California. BV Thermal Systems, designs and manufactures refrigeration-based, temperature-controlled liquid recirculation systems and water-cooled heat exchanger systems. BV...
Read More »
5 and 13 Micron Resolve Columns with Greater Bed Stability
Jordi Labs provides materials solutions that set the standard for innovation and quality. Our line of GPC and GFC columns are on the cutting edge of precision manufacturing and a result of our uncompromising commitment to quality and customer service. See our video to learn more.
Read More »
