Modules

Mobile Compassing Gets New Push from STMicroelectronics' Power- and Space-Saving Geo-Magnetic Modules

GENEVA, - STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and the leading supplier of MEMS (Micro-Electro-Mechanical Systems) for consumer and portable applications,[1] is set to accelerate the deployment of high-precision mobile compassing with the introduction of its newest geo-magnetic module. Housed inside a...

Read More »

I/O Expansion Modules accommodate various board formats.

Expansion modules, intended for systems based on SBCs that expand using PCI/104-Express, PC/104-Plus, or SUMIT-ISM, implement identical analog and digital I/O feature-sets on all 3 formats. Thus one expansion format can be chosen while allowing migration later to alternate format without major rework. Analog modules each include sixteen 16-bit A/D inputs and D/A outputs with programmable range...

Read More »

Dual Splitter Modules target VDSL2 applications.

Model B8891DVNL is used on rack cards found in DSLAMs or within roadside cabinets to combine or split plain old telephone service data from DSL data. Combining 2 central office splitter modules onto one platform, product minimizes component count on PCBs. It is RoHS-6 compliant and TR-127-compliant to support ADSL2 and VDSL2 applications, as well as compliant to China MII YD/T 1187-2006 ADSL2+...

Read More »

Laird Technologies to Attend ESC Silicon Valley 2011 Trade Show

Company to Display Entire Product Portfolio of Telematics and Wireless M2M Solutions St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will be attending the ESC Silicon Valley 2011 trade show. The trade show will be held at the...

Read More »
Rudolph Launches F30 Advanced Macro Inspection Module

Rudolph Launches F30 Advanced Macro Inspection Module

High throughput, robust capability among key features driving new orders Flanders, New Jersey -Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, today announced the global launch of the F30(TM) Advanced Macro Inspection Module, further extending the capabilities of the Explorer-®...

Read More »
Remote I/O Gateway accelerates data transfer via Modbus TCP.

Remote I/O Gateway accelerates data transfer via Modbus TCP.

Comprised of Ethernet communication gateway and backplane, ETHERNET Remote I/O bridges field instruments and Modbus TCP-based Ethernet with data transfer rates to 100 Mbps. Field signals can have intrinsically safe connection for Div 1/Zone 0 applications, and up to 80 analog or 184 discrete signals can be controlled through one gateway. While high transfer frequencies require LWL connections for...

Read More »

GE Libraries Enable Developers to Maximize DSP Performance of Embedded Mil/Aero Platforms Based on 2nd Generation Intel® Core(TM) i7 Technology

AXISLib-AVX optimizes performance, reduces errors, speeds time to ISR solutions CHARLOTTESVILLE, VA -GE Intelligent Platforms today announced AXISLib-AVX optimized DSP and math libraries for GE's latest high performance embedded computing (HPEC) solutions using 2nd Generation Intel-® Core(TM) i7 processors with Advanced Vector Extensions (AVX). This new generation of technology from Intel...

Read More »

Laird Technologies to Attend Automotive Electronics Conference 2011

Company to Focus on Solutions for Automotive Electronics Segment in India St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will be attending the Automotive Electronics Conference (AEC) 2011. The conference will be held at the...

Read More »
Power Modules drive up to 10 A output current.

Power Modules drive up to 10 A output current.

Compliant with CISPR 22 (Class B) radiated and conducted EMI standard, SIMPLE SWITCHER-® Power Modules offer current sharing and frequency synchronization. For high-current intermediate rail and FPGA applications, multiple modules can be placed in parallel to achieve output currents up to 60 A. Synchronization pin enables modules to operate at same frequency, controlling switching noise in...

Read More »
Dongle-Sized Interface Kit offers analog inputs and DIO.

Dongle-Sized Interface Kit offers analog inputs and DIO.

Completely plug-and-play, 1011 - PhidgetInterfaceKit 2/2/2 provides 2 analog inputs, 2 digital inputs, and 2 digital outputs on dongle-sized board that supports USB voltage from 4.75-5.25 Vdc. Respective update rates for analog inputs and DIO lines are 1,000 and ~125 samples/sec. Solution comes with custom 12-wire cable, where wires 1/2/3 and 7/8/9 end with female connector designed to take...

Read More »

All Topics