New AP730 Multi-function I/O Module Can Move Data Between Module Memory and PCIe Bus
Features high-density mix of 28 I/O channels and 32-bit counter/timers in 30 x 70 mm. card. Offers eight differential analog inputs (0-10V, ±10V ranges) feed 16-bit A/D converter capable of sampling at nearly 800 KHz. Bidirectional digital I/O is configured as two 8-channel groups with TTL-compatible thresholds and programmable change-of-state or level interrupts.
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New FMC259 Fiber FMC+ Module Meets VITA 57.4 (FMC+) Specification
Offers dual board-mount optical assemblies, each providing 24 channel full-duplex transceivers capable of up to 28.1 Gb/s per channel. Provides clock data recovery and front-panel fiber I/O via MTP/MPO that has on board ultra-low jitter clock generator with two independent, fractional PLL. Features clocking that allow synchronization to an external clock input or on board and comes with LEDs in...
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New Rugged ECU Accelerates ADAS and Autonomous System Product Design
RVP-TDA4Vx production-intent kit features TDA4VM SoC processor and configurable SerDes interface. Supports multiple SerDes capture streams with different transport protocols through its configurable personality card. Ideal for automated valet park, neural networks, video analytics, driver notification, multi-camera display, mirror replacement and sensor fusion applications.
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New Dual Channel CAN Bus Expansion Board Compatible with Linux, Windows and VersaAPI
C1 is fully backwards compatible with CAN 2.0 A and CAN 2.0 B with signaling up to 1 Mbps. Provides 2.5 kV of signal isolation to protect the host computer and increase system resilience. Delivers an simple and economical way to add high-speed CAN Bus ports to any embedded computer systems.
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Custom Presentation Kits - Elevating ideas from conception to creation!
To find out more about how you can get a custom presentation kit tailored to your exact needs, download this whitepaper now.
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New Image Sensor and Wafer-level Camera Module Features Small Pixel Size of 2.2 Microns
OC0VA wafer-level camera module combines sensor with image signal processing and optics into a 2.69 x 3.04 x 3.04mm. OG0VA image sensor has a small form factor that results in a 2.69x3.04mm footprint for the OC0VA camera module. Provides 640x480 VGA resolution at 240 fps and 320x240 QVGA resolution at 480 fps.
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New AMC573 FPGA Board is AMC.1, 2, 3 and 4 Compliant
Utilizes the Xilinx XCZU28DR RFSoC and comes with onboard re-configurable FPGA which interfaces directly to the AMC FCLKA, TCLKA-D. Includes Trig-in, Trig-out, clock inputs, dual USB, dual serial ports and connector for external I/O. Features front panel that incorporates 18 high-density RF Coaxial connectors routed to the 8 ADC (12-bit @ 4 GSPS) and 8 DAC (14-bit @ 6.4 GSPS).
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Ballard-Powered Fuel Cell Tram-Buses from Van Hool Now in Revenue Service in France
VANCOUVER and PAU, FRANCE, Dec. 17, 2019 /PRNewswire/ - Ballard Power Systems (NASDAQ: BLDP; TSX: BLDP) today announced that 8 ExquiCity tram-buses built by Van Hool NV ("Van Hool"; www.vanhool.be) and powered by 8 Ballard FCveloCity®-HD 100-kilowatt fuel cell modules have been inaugurated at a ceremony in Pau, France and are now in revenue service in Pau's Bus Rapid Transit System....
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New Two I/O Modules Feature Spring-clamp Field Wiring Terminals
GRV-ITM-12 provides a high-density, low-cost temperature sensing option with two isolated zones and 6 channels per zone. Accurate to 0.1% of the configured range over 20-bit resolution for V/mV sensing with accuracy ranging from 2.0-5.0 °C for thermocouple sensing. GRV-CCANI-2 supports integrating CAN data into control applications using IEC 61131-3 languages.
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Richardson RFPD Announces Availability of Innovative All-in-one 5G mMIMO RF Power Amplifiers from NXP
Portfolio of RF power multi-chip modules supports massive MIMO active antenna systems for 5G base stations December 3, 2019 – Geneva, Ill.: Richardson RFPD, Inc., an Arrow Electronics company, announced today the availability and full design support capabilities for the comprehensive RF power multi-chip module (MCM) portfolio for 5G mMIMO from NXP Semiconductors. These devices are part of...
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New 54141A Module from Pentek Meets VITA 65.0 3U VPX Specification
Offers dual channel analog-to-digital and digital-to-analog converter with sample rates up to 6.4 GHz. Features programmable DDCs (digital downconverters) and DUCs (digital upconverters) support connections to IF or RF signals. Comes with Jade architecture that uses Xilinx Kintex UltraScale FPGA and is ideal for wideband defense, radar and communication applications.
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DoorKing Releases Advanced Long Range Card Reader System with Frequency Hopping Technology
The DoorKing DKS AVI system is at the cutting edge of automotive security technology and represents a leap forward in engineering innovation. When it comes to long-range passive card readers, we lead the industry and set the standard for quality and performance. To find out why the DoorKing DKS AVI system is taking the automotive security industry by storm, see our video.
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