New Flux Products

Solder Flux targets Pb-free wave soldering.

Suited for soldering surface-mount, mixed-technology, and through-hole electronics assemblies, 1075-EXR is water-based and non-flammable, eliminating special storage requirements and minimizing VOC emissions. Product provides surface wetting, eliminates cleaning, and minimizes solder balling. It can also be used for Sn/Pb assemblies.

Submerged Arc Flux suits offshore welding applications.

Suited for submerged arc welding, LincolnweldÃ-® 888 highly basic flux is classified to AWS H4 requirements for diffusible hydrogen levels under 4 mL/100 g of weld metal. It exhibits weld metal toughness and features packaging properties that positively impact moisture resistance. Product is suited for pressure vessel, shipbuilding, and structural fabrication as well as narrow gap...

Solder Powder/Flux allows soldering irons to be re-tinned.

MulticoreÃ-® TTC-LF consists of lead-free grade solder powder and flux, formed into shape of thick disk for cleaning and de-wetting soldering irons. Users wipe tip of iron across surface of TTC-LF to produce local melting, and then wipe on damp sponge. Suited for lead and lead-free applications, product features activators that thermally decompose into inert components, and ability to clean...

Liquid Fluxes target consumer electronics applications.

MulticoreÃ-® MF101 and MF300 are VOC-free, no-clean liquid fluxes suited for low solderability surfaces such as oxidized copper. They minimize or eliminate solder balling and are non-flammable. To complement lead-free wave soldering applications, MF200 helps eliminate micro solder balling, leaves minimal residue, and offers maximum process window. No-clean, sustained activity flux, MFR301 is...

3 Formulation Methods to Reduce Lean Giveaway for Processed Meat

Download this white paper, and learn about three methods that can help you improve your bottom line and yield by reducing lean tissue giveaway.

No-Clean Flux is compatible with all solder alloys.

Designed for surfaces with poor solderability, MulticoreÃ-® MF210 is resin-free and halide-free. Sustained activity flux works over range of solder resists and is compatible with rosin and OSP-based surface preservatives. Material allows for high-speed soldering on conventional leaded and surface-mount components and offers good through hole penetration. No-clean characteristic ensures...

Low-VOC Flux suits lead-free soldering applications.

Able to withstand temperatures required for lead-free soldering, 94QMB9 maintains its wetting characteristics and has evaporative formula that reduces preheating time and potential for oxidation and splatter. No-clean flux contains DI-water and alcohol and features non-ionic activator system that exhibits block-polymer functionality. Product is suited for lead-free soldering in wave and selective...

Soldering Flux offers anti-slump characteristics.

Colorless, no-clean P520 Flux leaves clear residue for cosmetic joint finish. Printed or dispensed solder paste deposits retain shape through reflow cycle without slumping or bridging, making flux suited for fine pitch, no-clean electronic and electro-mechanical soldering applications. Flux is environmentally safe and exceeds IPC Joint Industry Standards J-STD-004A.

Wave Solder Flux suits Pb-free applications.

No-clean, halide-free 3592-35 provides heat stability for high temperatures required in Pb-free wave soldering of mixed-technology and through-hole electronic assemblies. Solvent-based formulation offers wide process window and minimizes solder balling. It can be used with tin/copper, tin/silver/copper, and tin/lead alloys.

Interconnect Flux is water-soluble.

Designed for use in BGA bumping and board level attachment, WS-364 water-soluble paste-flux can be applied by pin-transfer or stencil printing. It can be cleaned using room-temperature water and offers high yield in BGA bumping process. Available in syringes or cartridges, halide-free product is suitable for Sn/Pb and Pb-free applications.

No-Clean Rosin Flux is solvent-based.

LoctiteÃ-® MulticoreÃ-® MFR301 sustained activity liquid flux, designed for wave soldering PCBs, is suited for dual wave processing. Rosin/solvent synergism ensures optimum drainage behavior at exit of wave, minimizing bridging, spiking, and mid-pad solder balling. Product leaves thin, protective coating of rosin on soldered PCBs and leaves them dry to touch with slight rosinous luster....