Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS
StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its packages for high-frequency and very high power devices will be featured by Elecsys, LLC at IEEE COMCAS, November 13-15, 2017 in Tel Aviv, Israel. In addition to StratEdge products, Elecsys will be showing J...
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Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS
StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its packages for high-frequency and very high power devices will be featured by Elecsys, LLC at IEEE COMCAS, November 13-15, 2017 in Tel Aviv, Israel. In addition to StratEdge products, Elecsys will be showing J...
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StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements
San Diego, CA - 16 October 2017 - StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz, including gallium nitride (GaN) devices. StratEdge...
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StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements
San Diego, CA - 16 October 2017 - StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz, including gallium nitride (GaN) devices. StratEdge...
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Comparing Casting Processes
This white paper compares and contrasts common casting processes.
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QFN Test Package features Nickel Palladium Gold plated terminal and ground pads.
Designed with 100 pins, spaced very fine pitch at 0.4mm, QFN Test Package features Nickel Palladium Gold plated terminal and ground pads. Operating in -65⁰C to +150⁰C temperature range, packages are suitable in SMT process and thermal profile testing applications. Measuring 12 x 12 mm size with height not exceeding 1.0 mm, Unit’s zero-ohm connections are used for determining cause of PCB...
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QFN Test Package features Nickel Palladium Gold plated terminal and ground pads.
Designed with 100 pins, spaced very fine pitch at 0.4mm, QFN Test Package features Nickel Palladium Gold plated terminal and ground pads. Operating in -65⁰C to +150⁰C temperature range, packages are suitable in SMT process and thermal profile testing applications. Measuring 12 x 12 mm size with height not exceeding 1.0 mm, Unit’s zero-ohm connections are used for determining cause of PCB...
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CMC Base Laminate Packages are built with base material ratio of 1:3:1 CMC.
Available for gallium nitride transistor and MMIC devices in leaded and leadless versions, CMC Base Laminate Packages can accommodate MMICs with die attach areas as high as 5.92 X 12.14 mm. Suitable in communications, radar, automotive, aerospace and defense applications, standard transistor package measures 0.8 in. Long x 0.23 in. Wide with 2 leads and epoxy sealed raised lid. CMC package...
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CMC Base Laminate Packages are built with base material ratio of 1:3:1 CMC.
Available for gallium nitride transistor and MMIC devices in leaded and leadless versions, CMC Base Laminate Packages can accommodate MMICs with die attach areas as high as 5.92 X 12.14 mm. Suitable in communications, radar, automotive, aerospace and defense applications, standard transistor package measures 0.8 in. Long x 0.23 in. Wide with 2 leads and epoxy sealed raised lid. CMC package...
Read More »Future Electronics Promotes the 600 V E Series MOSFETs from Vishay
Pointe Claire, Quebec - Future Electronics, a global leading distributor of electronic components, recently announced immediate availability of Vishay's 600 V E Series MOSFETs in PowerPAK® 8 x 8. Vishay's 600 V E Series features Kelvin connections to reduce gate drive inductance. The construction of the PowerPAK 8 x 8 package allows one of the source pins to be arranged as a dedicated Kelvin...
Read More »Future Electronics Promotes Fairchild's Dual Cool MOSFET Packaging Technology
Pointe Claire, Quebec - Future Electronics, a global leading distributor of electronic components, recently announced immediate availability of Fairchild's Dual Cool™ MOSFET packaging technology. Fairchild's Dual Cool™ MOSFET packaging technology provides both bottom- and top-side cooling in the industry standard PQFN package, offering performance flexibility for designers. With enhanced...
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Precision Machined Parts for High Tech Applications
For precision and value that sets the standard for quality and craftsmanship, EGS Production Machining is the source for precision and value. Our extensive capabilities and dedication to customer service allow us to deliver the optimal manufacturing solution. See our video to learn more.
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