Redpine Signals Demonstrates Its Lite-Fi(TM) Ultra Low Power 802.11n Wi-Fi-® Connectivity on Infineon Technologies S-GOLD-® 3H/MP-EH Mobile Platform
Redpine's 802.11n solution achieves less than 1 mW in standby associated mode and more than 200 hours of talk time on a 800 mAH battery for VoWiFi BARCELONA, Spain, Feb. 11 / / -- GSMA Mobile World Congress -- Redpine Signals, Inc., a leading developer of ultra low power multi-standard OFDM and MIMO silicon-based solutions, today announced the availability and successful integration of its...
Read More »Qualcomm to Ship Industry's First Multi-Mode LTE Chipsets in 2009
New Family of Multi-mode LTE Device Solutions to Deliver Backward Compatibility to Existing UMTS and CDMA2000 Networks SAN DIEGO, Feb. 7 - Qualcomm Incorporated (NASDAQ:QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced that it has expanded both its device and base station chipset roadmaps to include Long Term Evolution (LTE). The new...
Read More »Agilent Technologies and Comsys Communications to Speed Mobile WiMAX(TM) Handset Production
SANTA CLARA, Calif., and HERZELLA, Israel, Feb. 6, 2008 - Agilent Technologies Inc. (NYSE: A) and Comsys Communications and Signal Processing Ltd. today announced that Agilent's Wireless Networking test set will be used to help roll out Mobile WiMAX-compliant chip sets. The two companies will collaborate on the speed-optimization of RF power-calibration and production-test systems for Mobile...
Read More »Integrated Radio-on-a-Chip operates in 57-64 GHz band.
Supplied in 10 mm BGA package, tiny radio modules combine 60 GHz transmitters and receivers with integrated antennas. Development system includes 60 GHz transmitter board and 60 GHz receiver board, each with USB controller. To facilitate setup and operation, embedded control firmware and GUI interface are included. Solutions enable commercial, government, and academic institutions to utilize...
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Industrywide Applications for Deep Drawn Metal Stamping
Deep-drawn metal stamping applies a significant punching force to radically draw metal sheets into a die cavity. Finished components produced by this process tend to have a depth that exceeds their diameter, which is why manufacturers refer to it as "deep-drawn" metal stamping.
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Six-Channel Supervisor has selectable supply tolerances.
Designed for monitoring equipment with numerous supply voltage rails, 6-channel LTC2932 includes separate open-drain voltage comparator outputs. External resistive divider between bandgap reference output, ADC input, and ground determines which channels are set to preset or adjustable voltage monitor inputs. Offered in 20-pin TSSOP package, IC has adjustable reset timeout period as well as reset...
Read More »Dblur Announces the Availability of a Software Lens(TM) Enabled Chip
Sample Chips Now Available From Pantek Technologies Corp. With Mass Production Starting in May, 2008 HERZLIYA, Israel, February 7 / / - Dblur, the developer of Software Lens(TM) Technology, today announced the availability of a stand-alone chip that integrates Dblur's groundbreaking Software Lens(TM) Technology. The PA-DB3615SA chip, produced by SMIC, enables Software Lens(TM) camera modules of...
Read More »Tunable SFF Transponder is fully Telcordia-qualified.
Measuring 2.2 x 3 x 0.45 in., LambdaFLEX(TM) TL9000 promotes increased port density by supporting direct drop-in of 2 SFF (small form factor) 300-pin transponders on one card instead of one LFF (large form factor) device. Universal nature allows customization to individual specifications, while standard but flexible platform design is used across all applications. Operating up to 11.3 Gbps,...
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High-Side Power Monitor measures current and voltage.
Offered in MSOP-10 and 3 x 3 mm DFN-10 packages, LTC4151 utilizes internal 12-bit ADC to continuously measure high-side current and input voltage from 7-80 V to give true power reading. Single-chip solution has 2-wire, IÃ-²C-compatible interface that reports input power data, which can be delivered continuously or via no-latency single snapshot mode. Third low-voltage input can be used to...
Read More »Broadcom Demonstrates Industry Leading Technologies for Next Generation Mobile Devices at 2008 Mobile World Congress
Broadcom to Demonstrate HSUPA on Breakthrough '3G Phone-on-a-Chip' Processor, New GPS Product Offering and Its Technology Leadership Portfolio Including Mobile Multimedia, Wi-Fi, Bluetooth, Mobile TV, RF and Power Management IRVINE, Calif., Feb. 5 - Broadcom Corporation (NASDAQ:BRCM), a global leader in semiconductors for wired and wireless communications, will demonstrate its innovative and...
Read More »Xilinx at Mobile World Congress 2008
What: Mobile World Congress 2008 Where: Fira de Barcelona, Barcelona, Hall 1, Stand E47 When: February 11-14, 2008 Exhibits: Monday - Wednesday, 9a.m.-7p.m. Thursday, 9a.m.-5p.m. DUBLIN, Ireland, Feb. 5 - Xilinx, Inc. (NASDAQ:XLNX) today announced its participation at Mobile World Congress 2008 in Barcelona, Spain from February 11 through 14. The company will unveil its latest portfolio of...
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Custom Fabrication & Machining Services with Over 30 Years of Experience
As a trusted manufacturer to customers across a broad range of industries, Key Gas Components is a premier provider of CNC machining and tube fabrication. Our entire organization is quality driven and customer-centric, with broad-based manufacturing capabilities that can accommodate the most challenging requirements. See our video to learn more.
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