MagnaChip Unveils Power Solutions at 3GSM World Congress
SEOUL, South Korea, Feb. 13 -- MagnaChip Semiconductor, Ltd., a leading provider of analog and mixed signal semiconductor products for high volume consumer applications, today, announced that it will present four new power management products, for which samples are now available, at the 3GSM World Congress 2008 in Barcelona, Spain this week. These products include LDO regulator, Analog Switch IC...
Read More »TriQuint Sets the Benchmark with Highly Integrated, Global Front End Solution for 3G Handsets
Modules Support Worldwide Standards, Quad-band GSM/GPRS/EDGE and Tri-band WCDMA/HSUPA, While Improving Battery Life, Reducing Dropped Calls BARCELONA, Spain, Feb. 12 - TriQuint Semiconductor, Inc. (NASDAQ:TQNT), a leading RF front-end product manufacturer and foundry services provider, today announced a new multi-mode system solution using highly-integrated modules to support all global standards...
Read More »Programmable Receiver IC includes jam avoidance.
Featuring selectable IF bandwidth for 300-450 MHz operation, QwikRadioÃ-® MICRF218 ASK/OOK Receiver can accommodate 2 reference crystals with use of external switch. It includes fully integrated IF section with built-in image rejection. Wide IF bandwidth can be chosen for backward compatibility with older transmitters that are LC-based. Able to escape from jamming source and migrate to...
Read More »Wolfson WM8400 Audio and Power Management IC Has been Selected by MtekVision to Support Its Tiger 7 Processor
First multimedia handset design-in for new AudioPlus(TM) product MWC, Barcelona, Spain. February 11th, 2008 - Wolfson Microelectronics plc (LSE: WLF.L) announced that Korean processor vendor MtekVision has selected Wolfson's WM8400 AudioPlus(TM) Smart Power device as part of a complete mobile handset reference design supporting its multimedia applications processor. The combination of the...
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Maximum Grip and Comfort With Standard and Custom Knobs
Learn more about Innovative Components' wide variety of knobs available or explore our customization options for your specific applications and needs in this compressive product guide.
Read More »Big Picture Experience from Mobile Devices is One Step Closer to Reality
Texas Instruments DLPÃ-® announces production availability of new imaging chipsets for pico-projection in 2008 BARCELONA, Spain, Feb. 11 -- DLPÃ-® Technology from Texas Instruments (TI) (NYSE:TXN), announced today production availability of a DLP Pico(TM) chipset, which includes an imaging chip and a processor to enable a new class of handheld and mobile projection products. These ground...
Read More »Broadcom Demonstrates Support for All Key Mobile Phone Open Operating Systems on Its Single-Chip Smartphone Solution
Broadcom's 3G Cellular Design Platform Supports Symbian-®, Windows Mobile-® and Linux-®, with Live Demonstrations at 2008 Mobile World Congress BARCELONA, Spain, Feb. 11 -- 2008 MWC -- Broadcom Corporation (NASDAQ:BRCM), a global leader in semiconductors for wired and wireless communications, today announced that it will demonstrate support for the three most popular open operating systems...
Read More »TRIACs operate up to junction temperature of 150-
Suitable for appliance motor-control applications, HiTj Snubberless(TM) TRIACs deliver noise immunity up to 1,500 V/Ã-µs, require no derating of any parameters, and achieve turn-off performance at 150Ã-
Read More »Infineon Technologies Chooses On2 for Video Codecs
World leading manufacturer of wireless chipsets to integrate Hantro(TM) hardware video acceleration. Tarrytown, NY (date) - On2 Technologies, Inc. (Amex: ONT), a leader in video compression technologies, announced today that Infineon Technologies AG (FSE/ NYSE: IFX) has signed a multiple use license agreement for integrating the On2's latest Hantro video accelerators. Configurable to support...
Read More »Sandbridge Technologies Demos LTE at Mobile World Congress 08 in Barcelona
Advanced mobile chip innovator showcases 4G Software Modem form-factor UE TARRYTOWN, N.Y., Feb. 7 -- Sandbridge Technologies, a cutting edge fabless semiconductor company developing multi-mode baseband/multimedia processors for low-cost advanced mobile data devices, announced today that it will showcase an LTE UE implementation based on it's SB3000Ã-® series SOC platform during the Mobile...
Read More »Redpine Signals Demonstrates Its Lite-Fi(TM) Ultra Low Power 802.11n Wi-Fi-® Connectivity on Infineon Technologies S-GOLD-® 3H/MP-EH Mobile Platform
Redpine's 802.11n solution achieves less than 1 mW in standby associated mode and more than 200 hours of talk time on a 800 mAH battery for VoWiFi BARCELONA, Spain, Feb. 11 / / -- GSMA Mobile World Congress -- Redpine Signals, Inc., a leading developer of ultra low power multi-standard OFDM and MIMO silicon-based solutions, today announced the availability and successful integration of its...
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560 and 572 Series IP67 Waterproof Inline Plug and Socket Connectors with Shock and Vibration Resistance
EDAC's new line of IP67 waterproof plug and socket connectors represent the cutting edge of waterproof connection technology. Part of the 560 and 572 series of connectors, they utilize innovative design concepts to deliver a level of performance and value that is unmatched in the industry. See our video to learn more.
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