Broadcom to Demonstrate HSUPA on Breakthrough '3G Phone-on-a-Chip' Processor, New GPS Product Offering and Its Technology Leadership Portfolio Including Mobile Multimedia, Wi-Fi, Bluetooth, Mobile TV, RF and Power Management
IRVINE, Calif., Feb. 5 - Broadcom Corporation (NASDAQ:BRCM), a global leader in semiconductors for wired and wireless communications, will demonstrate its innovative and leading portfolio of complete system-on-a-chip (SoC) solutions for mobile devices at the 2008 Mobile World Congress trade show in Barcelona, Spain, from February 11th through February 14th.
Broadcom® mobile and wireless technologies enable manufacturers to develop leading-edge mobile devices and end-to-end wireless connectivity solutions for the home, business and mobile markets. Addressing every major wireless market segment, Broadcom features products for wireless local area networking, cellular and wide area networking, and personal area networking, as well as a comprehensive range of mobile technologies, including advanced GPS solutions. The company's portfolio of mobile and wireless products is enabling a new generation of portable devices including cellular handsets, personal navigation devices, gaming platforms and other wireless-enabled consumer electronics and peripherals, such as home gateways, printers, VoIP phones, home entertainment systems and notebook computers.
With a host of "industry first" products recently introduced, Broadcom addresses the key technological requirements of evolving mobile handset and portable multimedia devices, and has established itself as a technology leader in the handset market. Broadcom's leading product line features the most integrated "phone-on-a-chip" solutions, including 2G and 3G processors with built-in RF and multimedia, as well as the most advanced mobile multimedia processor available, capable of enabling HD-quality video capture and playback on cell phones.
The company also offers the most flexible smartphone platform in the industry, supporting all of the major open operating systems and including the processing power and high levels of integration required to develop more affordable, highly functional smartphone products. Broadcom demonstrations will also include the company's all-COMS GPS solutions, which feature leading levels of chip integration and RF sensitivity.
Highlighting the company's strength and leadership as a technological powerhouse for mobile devices, the following technologies and products will be demonstrated at the 2008 Mobile World Congress in Barcelona:
o Broadcom's new BCM21551 single-chip 3G SoC processor with HSUPA
functionality for high bandwidth transfers of data to mobile devices.
The new baseband solution enables manufacturers to build next
generation 3G smartphones with breakthrough features, sleek form
factors and extended battery life. Broadcom will also be demonstrating
the BCM21331 single-chip 2G SoC, enabling a range of cost effect new
o GPS demonstrations showcasing the company's first highly integrated
GPS solution for personal navigation devices and mobile handsets. The
new BCM4750 GPS receiver sets new standards in performance and power
consumption, using less than half the power of competitive solutions.
o Mobile multimedia demonstrations featuring Broadcom's new VideoCore®
III mobile multimedia technology. The BCM2727 is the world's first
low power multimedia processor that enables high definition video
camcorder and playback in cell phones and portable media players. It
features game console-quality 3D graphics, up to 12 megapixel high
resolution digital image processing, and expensive components required
for ISP subsystem implementation.
o Mobile TV demonstrations include the newly announced BCM2940 and
BCM2930 platforms, introducing superior radio receive performance and
ultra low power consumption to enable Digital Video Broadcast services
in phone handsets and other mobile devices.
o Bluetooth® and Wi-Fi® demonstrations including multiple advanced
combination technology products such as the BCM2048 (which includes
Bluetooth and FM tuner) and the BCM4325 (which combines Bluetooth, Wi-
Fi and FM radio functionality and was recently selected as a finalist
for EDN Magazine's "Innovation Awards"). These products enable new
usage models for a variety of consumer products, with breakthrough
pricing and performance levels. Broadcom will also be demonstrating
groundbreaking Bluetooth audio technology, including the BCM2044 and
BCM2047 headset chips, as well as the company's SmartAudio(TM)
technology that significantly improves audio clarity over Bluetooth.
o Cellular RF demonstrations featuring the world's first 65 nanometer
digital CMOS 2G and 3G cellular RF single-chip solutions, which are
enabled by Broadcom's innovative architectures, delivering the
smallest size and lowest bill of materials (BOM) cost.
o Mobile power management unit (PMU) demonstrations featuring the
BCM59001 and BCM59035 show Broadcom's industry leading levels of
integration, efficiency and programmability that provide optimized
system-level power consumption and lower overall system cost in mobile
o Most new products demonstrated by Broadcom feature the 65 nanometer
process geometry (the most advanced lithographic node for
manufacturing semiconductors in large volumes today). 65nm provides
significant benefits over 90nm and 130nm processes by enabling lower
power consumption, smaller size and higher levels of integration.
About Broadcom's Mobile & Wireless Solutions
Broadcom's mobile and wireless products allow manufacturers to develop leading-edge mobile devices, enabling end-to-end wireless connectivity for the home, business and mobile markets. Products in this area include solutions in every major wireless market segment including wireless local area networking, cellular and wide area networking, and personal area networking, as well as a comprehensive range of mobile technologies. Our portfolio of mobile and wireless products is enabling a new generation of portable devices including cellular handsets, personal navigation devices, mobile TV, gaming platforms and other wireless-enabled consumer electronics and peripherals, such as home gateways, printers, VoIP phones, home entertainment systems and notebook computers.
Broadcom Corporation is a major technology innovator and global leader in semiconductors for wired and wireless communications. Broadcom products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. We provide the industry's broadest portfolio of state-of-the-art, system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything(R).
Broadcom is one of the world's largest fabless semiconductor companies, with 2007 revenue of $3.78 billion, and holds over 2,500 U.S. and 1,000 foreign patents, more than 7,400 additional pending patent applications, and one of the broadest intellectual property portfolios addressing both wired and wireless transmission of voice, video and data.
Broadcom is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at +1.949.926.5000 or at www.broadcom.com.
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