New Circuits Products

Mobile WiMAX Chip integrates baseband and triple-band RF.

Incorporating baseband/triple-band RF in 65 nm die, SQN1210 delivers maximum throughput of greater than 40 Mbps with power consumption of less than 350 mW with fully loaded MIMO traffic and less than 0.5 mW in standby. Chip RF supports TDD and half-duplex FDD and covers 2.3, 2.5, and 3.5 GHz global WiMAX bands. Unit also supports 2 Tx, enabling uplink MIMO, as well as H-ARQ up to category 4....

Cellular Front End Platform provides 9-band coverage.

Featuring converged, multimode architecture, Model RF6460 simultaneously supports implementation of up to 5 WCDMA/HSPA+/LTE bands and all 4 bands of GSM/GPRS/EDGE in 3G/4G multimode mobile devices. Unit is comprised of RF6260 multi-band, multimode power amplifier module; RF6360 antenna switch module; and RF6560 front end power management IC. Platform utilizes 2 quadrature amplification paths...

Femtocell Chipsets deliver 3G broadband to homes/offices.

Femtocell Station Modem(TM) (FSM(TM)) chipsets utilize 3GPP HSPA+ broadband speeds as well as CDMA2000Ã-®, including 1X and EV-DO Rev. A and Rev. B. They include baseband functions, network listen, and integrated RF capabilities for all major wireless bands. Suited for residential and enterprise applications, chipsets also feature techniques that address interference between femtocells and...

Bluetooth/Wi-Fi Chip expands wireless usage modes.

MarvellÃ-® 88W8688 leverages flexible open software architecture that enables implementation of software features that optimize ways to use Wi-Fi connectivity. Mobile hotspot mode can transform any CE device with Internet connection into wireless hotspot, and support for BT-AMP allows integrated Bluetooth radio to support usage models such as simultaneous A/V streaming and instant...

Maximum Grip and Comfort With Standard and Custom Knobs

Learn more about Innovative Components' wide variety of knobs available or explore our customization options for your specific applications and needs in this compressive product guide.

Atheros Delivers Industry-Leading WLAN Combined with Qualcomm's Bluetooth-® Connectivity for Advanced Mobile Handsets

SANTA CLARA, California, February 16/-- - Collaboration Results in Best-in-Class Connectivity Solutions for Advanced Handsets Atheros Communications, Inc. (Nasdaq: ATHR), a global leader in innovative technologies for wireless and wired communications, today announced the availability of a connectivity solution combining Atheros' latest-generation AR6002 Radio-on-Chip for Mobile (ROCm(R)) WLAN...

DC-to-AC IC drives liquid lens in autofocus camera modules.

Utilizing charge-pump architecture, MAX14515 DC-to-AC liquid lens driver comes in 2 x 1 mm WLP package, reducing number of external components. It features low-voltage capacitor and bypass capacitor, and integrates 8-bit monotonic DAC with single-differential high-voltage output controlled by 2-wire IÃ-²C interface, delivering up to 42 Vrms into 200 pF liquid lens load at 1.1 kHz. Specified...

Switches and Latches operate in temperatures up to 150-

Models A1220 and A1221 include dynamic offset cancellation for high-temperature performance. Each unit features silicon chip with voltage regulator, Hall-voltage generator, small-signal amplifier, chopper stabilization, Schmitt trigger, and short-circuit protected open-collector output that can sink up to 25 mA. On-board regulator permits operation with supply voltages of 3.0-24 V. Package types...

Digital Pulsers provide 1.3 A of minimum output current.

Utilizing active-clamping architecture, MAX4810/MAX4811/MAX4812 dual digital pulsers reduce 2nd harmonic output, and can be independently configured to enable unipolar or bipolar pulsing in high-voltage systems from low-voltage logic inputs. They operate from single positive supply up to +220 V, single negative supply down to -200 V, or dual Ã-

SoCs reduce component count in mobile phones.

Designed for mobile phones on GSM/GPRS network, MT6253 integrating all essential electronic components - DBB, ABB, power management unit, and RF transceiver - onto one chip. It also offers peripheral support for camera, high-speed USB, and Class D audio AMP. Supporting LCD resolution up to WVGA, MT6516 smart phone solution can process MPEG-2 transport stream decoding without any co-processor. It...

Class D Audio Subsystem ICs are Windows Vista compliant.

Suited for space-constrained applications, MAX9791/MAX9792 audio-subsystem ICs combine 2 W stereo or 3 W mono Class D speaker amplifier, stereo DirectDriveÃ-® headphone amplifier, and one 120 mA low-dropout (LDO) regulator in single 4 x 4 mm chip. Low-EMI design reduces interference with radios found in notebook PCs, while low RF susceptibility ensures operation in close proximity to wireless...

How SpinSelect Can Save You Time and Money

Thanks to the unique SpinSelect™ Multi-Pocket selectable quick change tool holder, it's time to rethink the range, complexity and volume of parts that your lathe can produce. Our Spin-Select™ tool was created to increase productivity and consistency by decreasing downtime associated with lathe cutting tool and insert setups or changeovers. This product is a game-changer for the industry and we're pleased to show you why.