Dblur Announces the Availability of a Software Lens(TM) Enabled Chip
Sample Chips Now Available From Pantek Technologies Corp. With Mass Production Starting in May, 2008 HERZLIYA, Israel, February 7 / / - Dblur, the developer of Software Lens(TM) Technology, today announced the availability of a stand-alone chip that integrates Dblur's groundbreaking Software Lens(TM) Technology. The PA-DB3615SA chip, produced by SMIC, enables Software Lens(TM) camera modules of...
Read More »Tunable SFF Transponder is fully Telcordia-qualified.
Measuring 2.2 x 3 x 0.45 in., LambdaFLEX(TM) TL9000 promotes increased port density by supporting direct drop-in of 2 SFF (small form factor) 300-pin transponders on one card instead of one LFF (large form factor) device. Universal nature allows customization to individual specifications, while standard but flexible platform design is used across all applications. Operating up to 11.3 Gbps,...
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High-Side Power Monitor measures current and voltage.
Offered in MSOP-10 and 3 x 3 mm DFN-10 packages, LTC4151 utilizes internal 12-bit ADC to continuously measure high-side current and input voltage from 7-80 V to give true power reading. Single-chip solution has 2-wire, I-²C-compatible interface that reports input power data, which can be delivered continuously or via no-latency single snapshot mode. Third low-voltage input can be used to measure...
Read More »Xilinx at Mobile World Congress 2008
What: Mobile World Congress 2008 Where: Fira de Barcelona, Barcelona, Hall 1, Stand E47 When: February 11-14, 2008 Exhibits: Monday - Wednesday, 9a.m.-7p.m. Thursday, 9a.m.-5p.m. DUBLIN, Ireland, Feb. 5 - Xilinx, Inc. (NASDAQ:XLNX) today announced its participation at Mobile World Congress 2008 in Barcelona, Spain from February 11 through 14. The company will unveil its latest portfolio of...
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Laser Cutting
In this eBook, you'll learn more about how laser cutting works, as well as the benefits and applications
Read More »Broadcom Demonstrates Industry Leading Technologies for Next Generation Mobile Devices at 2008 Mobile World Congress
Broadcom to Demonstrate HSUPA on Breakthrough '3G Phone-on-a-Chip' Processor, New GPS Product Offering and Its Technology Leadership Portfolio Including Mobile Multimedia, Wi-Fi, Bluetooth, Mobile TV, RF and Power Management IRVINE, Calif., Feb. 5 - Broadcom Corporation (NASDAQ:BRCM), a global leader in semiconductors for wired and wireless communications, will demonstrate its innovative and...
Read More »Demodulator IC meets Chinese digital TV standards.
Suited for TV and set-top box manufacturers addressing China's digital terrestrial television requirements, MXD1320 exhibits full compliance with GB20600-2006 national standard by supporting defined single- and multi-carrier modes. It achieves maximum resource sharing via algorithm and architecture design as opposed to placing 2 demodulators on one chip. Power consumption is rated at 170 mW.
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PCIe Quad Equalizer extends backplane and cable reach.
Consuming of 100 mW (typ) per channel, PowerWise DS50EV401 supports PCIe Gen1 (2.5 Gbps), PCIe Gen2 (5 Gbps), and PCIe Gen3 (8 Gbps) data rates. Solution compensates for transmission medium losses, reducing deterministic jitter on 4 data transmission channels. Receive boost of 20 dB equalizes up to 10 m of PCIe cable or 40 in. of FR-4 PCB at data transmission rates up to 5 Gbps, with less than...
Read More »IC enables short-range wireless services on mobile devices.
Implimented in 0.13 micron embedded non-volatile memory EEPROM technology, ST21NFCA integrates all necessary hardware and software for complete NFC (Near Field Communication) system, including support for all NFC proximity and vicinity standards. It enables contactless communication at 14.56 MHz and integrates Host Controller Interface (HCI) functions as well as interfaces for I2C bus and SPI...
Read More »NEC Electronics Announces Agreement to Develop Power Management IC Solution for Mobile Internet Devices
NEC Electronics Applies Mobile Market Expertise to Highly Integrated MID Solution KAWASAKI, Japan and SANTA CLARA, Calif., Feb. 4 -- NEC Electronics Corporation and its subsidiary in the United States, NEC Electronics America, Inc., today announced that they have teamed with Intel Corporation to develop a power management IC (PMIC) solution optimized for mobile Internet devices (MIDs). The highly...
Read More »New Scale Awarded Third U.S. Patent for Piezoelectric SQUIGGLE® Motor Technology and Applications
Patent covers the latest micro motor improvements related to electrical interconnections, low-power drive electronics and integration in mobile phone cameras VICTOR, NY - Feb. 4, 2008 - New Scale Technologies, Inc. has received its third US patent for its miniature piezoelectric SQUIGGLE motors, the company announced today. The patent covers New Scale's SQUIGGLE motor design improvements in three...
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ISO-Certified J&D Tube Benders Delivers Rapid Tubeline Fabrication Services
J&D Tube Benders' laser cutting and machining services provide accurate and complex features on tubes of all shapes and sizes. Check out the video to learn more!
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