Remtec, Inc.

Electronic Components & Devices

Metallized Ceramic Substrates are RoHS compliant.

Offering substitute for thick film materials containing platinum-palladium, LCMC metallized ceramic substrates are manufactured by process that combines thick film processing with Ni-Au plating. They can withstand multiple SMT reflow solder cycles and repairs without solder leaching. Featuring tracks resistivity of 1-2 mohm/sq, substrates can be fabricated in 5 x 7 in. format and are suited for...

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Electronic Components & Devices

Ceramic Packages suit direct PCB mount applications.

Plated Copper on Thick Film technology permits manufacture of leadless ceramic chip carriers and packages larger than .75 in. Wrap-around interconnections eliminate use of leads and additional interface boards, and ensure connections can operate at frequencies above 32 GHz. Plugged via holes with resistance less than 1 mΩ provide for RF losses below .1 dB at 4 GHz. Depending on die size and...

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Company News

Remtec Achieves 20% Growth In 2018, Expands Facilities, Adds Personnel and Equipment to Improve Overall Productivity

Norwood, MA. April 8, 2019. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has increased sales 20% in 2018. This marks the second consecutive year of double-digit growth. Remtec hired new personnel in all departments including sales, production, quality assurance and engineering...

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Mergers & Acquisitions

Remtec Has Been Acquired by LTI, A Leading Manufacturer of Precision Glass-To-Metal Seals

Norwood, MA.Â- – Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF (Plated Copper on Thick Film) metallization, has been acquired by LTI (www.legacytechnologies.com), a major player in the field of precision glass-to-metal seals and glass-to-metal hermetic packages. In making the announcement to employees and customers, Remtec...

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Company News

Remtec Increases Sales 62%, Adds New Technologies and Products for Optoelectronics, Wireless Communication, Medical Instrumentation, Defense and Space Applications.

Norwood, MA, May 6, 20ll. - Remtec Inc., a leader in custom and semi-custom ceramic packaging based on Plated Copper on Thick Film (PCTF) technology, has reported an increase in sales of 62 percent for Y2010. This growth has permitted Remtec to add new equipment and to develop new technologies that have resulted in a more advanced and diverse product offerings for optoelectronics, wireless...

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People in the News

Remtec Appoints Martin B. Nadler New Director of Quality Assurance

Norwood, MA. November 16, 2010. Remtec Inc., the leading manufacturer of substrates and packages with Plated Copper on Thick Film (PCTFÂ-®) technology, has appointed Martin B. Nadler the new Director of Quality Assurance. In making the announcement, Remtec president, Nahum Rapoport said, Martin Nadler brings us over twenty five years of quality, engineering and management experience in...

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Company News

Twenty Years of Technological Development Position Remtec as Leader in Metallized Ceramic Substrates and Packages

Norwood, MA - Remtec Inc., the leading manufacturer of metallized ceramic substrates and packages with Plated Copper on Thick Film (PCTFÂ-®) technology, is celebrating its twentieth year as a company specializing in manufacturing a variety of ceramic packaging products for both commercial and military electronics. Acknowledging this anniversary, Remtec President Nahum Rapoport commented: Over...

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People in the News

Dollman Joins Remtec Management Team

Norwood MA, January 2, 2007: Remtec's President & CEO, Nahum Rapoport, announced that Walt Dollman has joined the Remtec management team as Vice-President of Sales and Marketing. Rapoport said Walt has nearly 30 years of previous experience in senior sales, marketing, and management positions in the ceramics and electronics industry, and we are very pleased to add Walt to our team at Remtec. Walt...

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Electronic Components & Devices

Metallized Ceramic Substrates are RoHS compliant.

Offering substitute for thick film materials containing platinum-palladium, LCMC metallized ceramic substrates are manufactured by process that combines thick film processing with Ni-Au plating. They can withstand multiple SMT reflow solder cycles and repairs without solder leaching. Featuring tracks resistivity of 1-2 mohm/sq, substrates can be fabricated in 5 x 7 in. format and are suited for...

Read More »
Electronic Components & Devices

Ceramic Packages suit direct PCB mount applications.

Plated Copper on Thick Film technology permits manufacture of leadless ceramic chip carriers and packages larger than .75 in. Wrap-around interconnections eliminate use of leads and additional interface boards, and ensure connections can operate at frequencies above 32 GHz. Plugged via holes with resistance less than 1 mΩ provide for RF losses below .1 dB at 4 GHz. Depending on die size and...

Read More »

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