Remtec, Inc.

Leadless Ceramic SMT Package meets optoelectronic circuit needs.
Electrical Equipment & Systems

Leadless Ceramic SMT Package meets optoelectronic circuit needs.

JDEC TO-style SMT leadless packages address photonics industry demands for SMT packaging solution asÂ- alternative for standard TO-type packages. SMT packages can be produced for circuits and I/O configurations fully compatible with most JEDEC TO-style window caps, such as TO-8, TO-46, and beyond at operating frequencies up to 10 GHz and higher. Ability to use standard TO-style lids on...

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Electronic Components & Devices

LED Packaging is custom tailored to requirements.

Designed to specific customer requirements, LED Substrates and SubmountsÂ- utilize variety of metallization technologies on alumina, AIN, and BeO ceramics, including PCTF® Plated Copper on Thick and Thin Film with 20–75 µm copper, AgENIG® Electroless Nickel and Immersion Gold over Silver, and DBC Direct Bond Copper with 125–250 µm copper. LED substrates for...

Read More »
Ceramic Substrates support SMT soldering and die attach.
Electronic Components & Devices

Ceramic Substrates support SMT soldering and die attach.

Consisting of electroless nickel and immersion gold plating over thick film silver, AgENIG® Substrates eliminate solder leaching, enable processing up to 260°C or higher, assure optimal solder connections, and allow multiple SMT reflow solder cycles as well as touch-up and repairs. Addition of thin layer of Palladium plating also allows welding, gold wire bonding, and eutectic die...

Read More »
Electronic Components & Devices

Remtec Expands Its Enhanced Power Transfer

Norwood, MA - Remtec, the leading manufacturer of substrates and packages with Plated Copper on Thick Film (PCTF®) metallization, has expanded its copper plated Power Transfer Via (PTV)(TM) technology into demanding electronic packaging applications required in RF & DC power circuits, ranging from chip scale packages to power modules. By merging the highly thermally and electrically...

Read More »
Remtec Expands DBC Substrate Capabilities
Chemicals & Gases

Remtec Expands DBC Substrate Capabilities

Norwood, MA - Remtec®, the leading manufacturer of substrates and packages with Plated Copper On Thick Film (PCTF®), has significantly expanded its activity in the design and fabrication of DBC ceramic products for military and commercial applications in small to medium production volumes with fast prototyping and economic pricing. This capability is supported by close cooperation...

Read More »
Remtec's New Universal Finish
Paints & Coatings

Remtec's New Universal Finish

Norwood, MA - Remtec Inc., a leader in ceramic substrates and packages based on Plated Copper on Thick Film (PCTF) technology, has added a new universal finish of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a standard finish to its umbrella of fabrication methods. The new finish resolves a problem of intermetalics detrimental to the reliability of solder joints (black pad...

Read More »
Remtec Expands Its Submount Offerings for Packaging of Laser Diodes, LEDs, and Photo Diodes
Communication Systems & Equipment

Remtec Expands Its Submount Offerings for Packaging of Laser Diodes, LEDs, and Photo Diodes

Norwood, MA - Remtec, Inc., a leading supplier of ceramic packaging solutions with Plated Copper on Thick Film (PCTF) technology, has added new capabilities for Laser Diode, LED and Photo Diode submounts and substrates. Now designers have a wider variety of packaging options with ceramic submounts (alumina, beryllia, and aluminum nitride), metal heat sinks and enhanced plated gold tin...

Read More »
Remtec Has Developed Innovative Flip Chip Packaging for Faster Speed Switching Power Devices.
Electronic Components & Devices

Remtec Has Developed Innovative Flip Chip Packaging for Faster Speed Switching Power Devices.

Norwood, MA - Remtec, a leader in ceramic packages based on Plated Copper on Thick Film (PCTF) technology, has developed an efficient, cost effective chip scale packaging approach for flip chip power devices. It allows for simple, effective packaging of various Si, SiC and GaN FET transistors - MOSFETs and eGAN transistors amongst others - in the form of interposers and hermetic packages for...

Read More »
Remtec Adds New Gold-Tin Plating Line for Economic Production of High Quality Laser Diode Submounts and Semiconductor Packaging
Electronic Components & Devices

Remtec Adds New Gold-Tin Plating Line for Economic Production of High Quality Laser Diode Submounts and Semiconductor Packaging

Norwood, MA. Remtec Inc., a leader in custom and semi-custom ceramic packaging based on Plated Copper & Thick Film (PCTF) technology has completed the installation of a new state-of-the-art gold-tin plating line and associated process control and quality assurance equipment. The contemporary new line provides Remtec with a completely integrated in-house capability to economically produce high...

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Custom Substrates offer fast turnaround times.
Electronic Components & Devices

Custom Substrates offer fast turnaround times.

Direct Bond Substrates, using Curamik® DBC Ceramics, feature Ni, Ni-Au, and Pd plating finish for variety of power applications. DBC Substrates are available in 0.005, 0.008, and 0.012 in. copper thickness on Alumina and Aluminum Nitride cards sized 5.5 x 7.5 in. as multiple multiple-up master cards or as individual parts, after dicing or laser scoring. With turnaround times of ~3-4 weeks,...

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Company News

Remtec Achieves 20% Growth In 2018, Expands Facilities, Adds Personnel and Equipment to Improve Overall Productivity

Norwood, MA. April 8, 2019. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has increased sales 20% in 2018. This marks the second consecutive year of double-digit growth. Remtec hired new personnel in all departments including sales, production, quality assurance and engineering...

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Mergers & Acquisitions

Remtec Has Been Acquired by LTI, A Leading Manufacturer of Precision Glass-To-Metal Seals

Norwood, MA.Â- – Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF (Plated Copper on Thick Film) metallization, has been acquired by LTI (www.legacytechnologies.com), a major player in the field of precision glass-to-metal seals and glass-to-metal hermetic packages. In making the announcement to employees and customers, Remtec...

Read More »
Leadless Ceramic SMT Package meets optoelectronic circuit needs.
Electrical Equipment & Systems

Leadless Ceramic SMT Package meets optoelectronic circuit needs.

JDEC TO-style SMT leadless packages address photonics industry demands for SMT packaging solution asÂ- alternative for standard TO-type packages. SMT packages can be produced for circuits and I/O configurations fully compatible with most JEDEC TO-style window caps, such as TO-8, TO-46, and beyond at operating frequencies up to 10 GHz and higher. Ability to use standard TO-style lids on...

Read More »
Electronic Components & Devices

LED Packaging is custom tailored to requirements.

Designed to specific customer requirements, LED Substrates and SubmountsÂ- utilize variety of metallization technologies on alumina, AIN, and BeO ceramics, including PCTF® Plated Copper on Thick and Thin Film with 20–75 µm copper, AgENIG® Electroless Nickel and Immersion Gold over Silver, and DBC Direct Bond Copper with 125–250 µm copper. LED substrates for...

Read More »
Ceramic Substrates support SMT soldering and die attach.
Electronic Components & Devices

Ceramic Substrates support SMT soldering and die attach.

Consisting of electroless nickel and immersion gold plating over thick film silver, AgENIG® Substrates eliminate solder leaching, enable processing up to 260°C or higher, assure optimal solder connections, and allow multiple SMT reflow solder cycles as well as touch-up and repairs. Addition of thin layer of Palladium plating also allows welding, gold wire bonding, and eutectic die...

Read More »
Electronic Components & Devices

Remtec Expands Its Enhanced Power Transfer

Norwood, MA - Remtec, the leading manufacturer of substrates and packages with Plated Copper on Thick Film (PCTF®) metallization, has expanded its copper plated Power Transfer Via (PTV)(TM) technology into demanding electronic packaging applications required in RF & DC power circuits, ranging from chip scale packages to power modules. By merging the highly thermally and electrically...

Read More »
Remtec Expands DBC Substrate Capabilities
Chemicals & Gases

Remtec Expands DBC Substrate Capabilities

Norwood, MA - Remtec®, the leading manufacturer of substrates and packages with Plated Copper On Thick Film (PCTF®), has significantly expanded its activity in the design and fabrication of DBC ceramic products for military and commercial applications in small to medium production volumes with fast prototyping and economic pricing. This capability is supported by close cooperation...

Read More »
Remtec's New Universal Finish
Paints & Coatings

Remtec's New Universal Finish

Norwood, MA - Remtec Inc., a leader in ceramic substrates and packages based on Plated Copper on Thick Film (PCTF) technology, has added a new universal finish of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a standard finish to its umbrella of fabrication methods. The new finish resolves a problem of intermetalics detrimental to the reliability of solder joints (black pad...

Read More »
Remtec Expands Its Submount Offerings for Packaging of Laser Diodes, LEDs, and Photo Diodes
Communication Systems & Equipment

Remtec Expands Its Submount Offerings for Packaging of Laser Diodes, LEDs, and Photo Diodes

Norwood, MA - Remtec, Inc., a leading supplier of ceramic packaging solutions with Plated Copper on Thick Film (PCTF) technology, has added new capabilities for Laser Diode, LED and Photo Diode submounts and substrates. Now designers have a wider variety of packaging options with ceramic submounts (alumina, beryllia, and aluminum nitride), metal heat sinks and enhanced plated gold tin...

Read More »
Remtec Has Developed Innovative Flip Chip Packaging for Faster Speed Switching Power Devices.
Electronic Components & Devices

Remtec Has Developed Innovative Flip Chip Packaging for Faster Speed Switching Power Devices.

Norwood, MA - Remtec, a leader in ceramic packages based on Plated Copper on Thick Film (PCTF) technology, has developed an efficient, cost effective chip scale packaging approach for flip chip power devices. It allows for simple, effective packaging of various Si, SiC and GaN FET transistors - MOSFETs and eGAN transistors amongst others - in the form of interposers and hermetic packages for...

Read More »

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