CPS Corp.

Electronic Components & Devices

Flip Chip Lids provide thermal management.

Compliant with RoHS, AlSiC metal matrix composite lids are available in large format for SiP devices used in workstations, servers, video processing, data communications products, and Internet routers. AlSiC cast products can incorporate functional design features such pockets for memory chips, ridges for reinforcement, bosses for alignment, and cavities or pedestals for die. Surface supports...

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Metal Matrix Composite enhances thermal performance.
Materials

Metal Matrix Composite enhances thermal performance.

AlSiC features high stiffness to low density ratio, making it structurally suited for large parts with thin cross sections while enabling incorporation of thermal management features such as pin fins. Pins are cast during AlSiC pressure infiltration process and are targeted for microprocessor lids or liquid cooled IGBT base plates. Tailored, isotropic coefficient of thermal expansion provides...

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End Effectors are suited for wafer fabrication machinery.
Machinery & Machining Tools

End Effectors are suited for wafer fabrication machinery.

End effectors have strength and stiffness of steel at one-third the density. Effectors are made from CPS metal matrix composite, AlSiC (aluminum silicon carbide). Using QuickCast(TM) process, manufacturer can integrate fiber optic feeds, wafer shoes, and location pins during production. Coatings include Ni plating, anodization, and Teflon® impregnated anodization. Effectors are suited for...

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Metal-Matrix Composite provides thermal management.
Materials

Metal-Matrix Composite provides thermal management.

Suited for IGBT base plates, Aluminum Silicon Carbide Composite is RoHS-compliant and features high thermal conductivity, preventing bowing and flexing of packaging and substrate material. Isotropic coefficient of thermal expansion can be adjusted for specific applications by modifying Al-metal/SiC-particulate ratio to match CTE of die or substrate. Base plates can be used in high-power traction,...

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Metal Matrix Composite has adjustable CTE value.

AlSiC (Aluminum Silicon Carbide) enables tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies; isotropic CTE value is adjusted by modifying Al-metal/SiC-particulate ratio. Thermal conductivity of material prevents bowing and flexing of packaging and substrate material. Product is suited for housing, interconnection, and thermal...

Read More »
Electronic Components & Devices

Flip Chip Lids provide thermal management.

Compliant with RoHS, AlSiC metal matrix composite lids are available in large format for SiP devices used in workstations, servers, video processing, data communications products, and Internet routers. AlSiC cast products can incorporate functional design features such pockets for memory chips, ridges for reinforcement, bosses for alignment, and cavities or pedestals for die. Surface supports...

Read More »
Company News

CPS Technologies Doubles Manufacturing Space

CPS Technologies, the worldwide leader in the design and production of metal matrix composites, announces that the company has entered into a 10-year lease to double manufacturing space at its current location. CPS has been leasing 18,000 square feet at 111 South Worcester Street in Chartley, MA for the past 12 years. The newly signed lease provides the company with 38,000 square feet at the same...

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Metal Matrix Composite enhances thermal performance.
Materials

Metal Matrix Composite enhances thermal performance.

AlSiC features high stiffness to low density ratio, making it structurally suited for large parts with thin cross sections while enabling incorporation of thermal management features such as pin fins. Pins are cast during AlSiC pressure infiltration process and are targeted for microprocessor lids or liquid cooled IGBT base plates. Tailored, isotropic coefficient of thermal expansion provides...

Read More »
End Effectors are suited for wafer fabrication machinery.
Machinery & Machining Tools

End Effectors are suited for wafer fabrication machinery.

End effectors have strength and stiffness of steel at one-third the density. Effectors are made from CPS metal matrix composite, AlSiC (aluminum silicon carbide). Using QuickCast(TM) process, manufacturer can integrate fiber optic feeds, wafer shoes, and location pins during production. Coatings include Ni plating, anodization, and Teflon® impregnated anodization. Effectors are suited for...

Read More »
Metal-Matrix Composite provides thermal management.
Materials

Metal-Matrix Composite provides thermal management.

Suited for IGBT base plates, Aluminum Silicon Carbide Composite is RoHS-compliant and features high thermal conductivity, preventing bowing and flexing of packaging and substrate material. Isotropic coefficient of thermal expansion can be adjusted for specific applications by modifying Al-metal/SiC-particulate ratio to match CTE of die or substrate. Base plates can be used in high-power traction,...

Read More »
Company News

CPS Awarded Patent for AlSiC Composite with Integrated Heat Exchanger

Advanced thermal management for active cooling application CPS Corporation, the worldwide leader in the design and production of metal matrix composites, offers AlSiC (Aluminum Silicon Carbide), a metal matrix composite that provides high-performance heat spreaders, packages, and substrates for the flip-chip IC packaging, power control, and optoelectronic markets. CPS has recently been awarded a...

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Metal Matrix Composite has adjustable CTE value.

AlSiC (Aluminum Silicon Carbide) enables tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies; isotropic CTE value is adjusted by modifying Al-metal/SiC-particulate ratio. Thermal conductivity of material prevents bowing and flexing of packaging and substrate material. Product is suited for housing, interconnection, and thermal...

Read More »

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