CPS Awarded Patent for AlSiC Composite with Integrated Heat Exchanger
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Advanced thermal management for active cooling application
CPS Corporation, the worldwide leader in the design and production of metal matrix composites, offers AlSiC (Aluminum Silicon Carbide), a metal matrix composite that provides high-performance heat spreaders, packages, and substrates for the flip-chip IC packaging, power control, and optoelectronic markets. CPS has recently been awarded a patent for tubing which is integrally enveloped within AlSiC thermal management composite materials for active cooling solutions (USPO # 6668912 B2).
AlSiC enables a tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies. Unlike traditional packaging materials, the isotropic CTE value of AlSiC can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. AlSiC's CTE matching capabilities eliminate the need for thermal interface stacking, increasing reliability in the field. AlSiC also exhibits a high thermal conductivity that results in extremely efficient thermal dissipation. Coupled with its superior CTE matching, AlSiC's high thermal conductivity reduces thermal induced stresses that can lead to electronic assembly failures.
The CPS AlSiC net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and allowing rapid prototyping for high volume advanced thermal management solutions.
Stainless steel cooling tubes, or heat exchanger cavities, can be captured during the fabrication process for an integrated solution. The integration improves thermal performance, reducing thermal resistance between cooling tube or heat exchanger cavities and the matrix material by providing a metallic structural bond. Cooling tubes have been integrated in CPS AlSiC structures for pieces as small as microprocessor lids to products as large as IGBT cooler bases. Stainless steel cooling tubes are preferred for high purity water systems.
About CPS Corporation
CPS Corporation is the worldwide leader in the design and high-volume production of metal matrix composites. With over 30 years combined experience, CPS engineers and scientists use a net-shape fabrication process, including patented QuickSet(TM) injection molding and QuickCast(TM) infiltration. AlSiC components are utilized in applications in the wireless communications infrastructure, high-performance microprocessor, motor controller, and other microelectronic markets. CPS' customers include TI, Motorola, HP, Agilent and Amkor. For more information on CPS' AlSiC components, contact CPS at 1 (508) 222-0614 x42; e-mail marko@alsic.com, or visit www.alsic.com.
