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Indium Corporation Features Indium, Gallium, and Germanium Materials at SVC Technical Conference
Indium Corporation will feature their indium, gallium and germanium metals and compounds at the SVC Technical Conference May 6-7 in Chicago, IL. Indium Corporation supplies high-purity indium, gallium, and germanium metal. These metals are used in the production of alkaline dry cell batteries, flat-panel liquid crystal displays (LCDs), optical fibers, photovoltaic devices, III-V compound...Read More »
Indium Corporation Features SACm(TM) at NEPCON China
Indium Corporation will feature SACm™ solder paste at NEPCON China April 23-24 in Shanghai, China. SACm™ is a high-reliability, low-cost solder paste that offers drop test performance far superior to other SAC pastes without compromising on thermal cycling – all at a cost below that of typical SAC solder paste. SACm™ meets the electronics assembly market’s demand for a solder paste that...Read More »
Indium Corporation Features BiAgX(TM): New, High Temperature, Lead-Free Solder Paste Technology at Semicon China
Indium Corporation will feature its new high-melting lead-free solder paste technology, BiAgX™, at Semicon China on March 18-20 in Shanghai, China. BiAgX™ was created specifically for high-reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor...Read More »
Indium Corporation Features SACM(TM) High-Reliability Solder Paste at APEX
Indium Corporation will feature its new technology platform using SACM™ solder paste at APEX March 25-27 in Las Vegas, Nevada. SACM™ is a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACM™ is doped with manganese and contains less silver than other Pb-free solder pastes. The manganese...Read More »
Pb-Free Solder Paste targets small, low-voltage QFN packages.
Designed as drop-in replacement for standard high Pb-containing solder pastes, BiAgX™ excels in high temperature environments in excess of 150-Read More »
Pb-Free Solder Paste delivers high first pass yields.
Indium8.9HF1-P combines max stencil printing performance with optimized no-clean residues to enhance probe testing. Able to print on apertures with area ratiosRead More »
Indium Corporation Wins Global Technology Award
Indium Corporation was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in MÃ¼nich, Germany on November 12. Sponsored by Global SMT Packaging magazine, the award acknowledges outstanding innovations in the printed circuit board assembly and packaging industry. The award was presented to Tim Jensen, Product Manager – PCB Assembly Materials, and Brian...Read More »
Indium Corporation Features New, High-Reliability Solder Alloy SACM(TM) at Productronica
Indium Corporation will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in MÃ¼nich, Germany. SACM™ is a high-reliability solder alloy that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACM is doped with manganese and contains less silver than other Pb-free alloys. The manganese...Read More »
Indium Corporation Soldering Products Meet New IPC J-STD004B
Indium Corporation introduces a full line of soldering products that satisfy IPC's J-STD004B. The IPC's new 004B has stricter requirements for measuring halogens and electromigration risk. Indium Corporation's full line of PCB assembly products were specifically designed to meet these new international standards, which help to improve both first pass yields and long-term reliability. Users'...Read More »
Solder Alloy maximizes drop shock performance of electronics.
Featuring low silver content, platform consists of Indium 8.9 Series solder pastes using SACM™ solder alloy technology for board-side interconnect, and SACM™ solder balls for package level interconnect.- SACM’s stable, micro-structural improvements to intermetallic compound layer of solder-to-pad interface- maximize drop shock performance of portable electronic devices without...Read More »