Indium Corporation Features Metal Thermal Interface Materials for Burn-in and Test at TestConX

Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, March 1-4 in Mesa, Arizona, USA.

Indium Corporation’s wide portfolio of metal-based TIMs offers proven solutions for a wide variety of applications and process challenges:

  • Challenge: thermal conductivity. Heat dissipation is key to maintaining the longevity and reliability of devices. A pure indium Heat-Spring® offers uniform thermal resistance with minimized surface resistance and increased heat flow.
  • Challenge: handling and multiple insertions. HSMF-OS is a compressible TIM with adhesive properties on just one side for easy hand placement. Its high tensile strength (approximately 90 MPA) with a soft, compliant polymer backing provides a configuration with “designed in” insertion survivability.
  • Challenge: pump-out. Because Indium Corporation’s products are made of metal, they won’t pump-out, even under power cycling.

To learn more about Indium Corporation’s metal thermal interface materials for burn-in and test, visit www.indium.com/TIMs.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

Contact:
Anita Brown
Corporate Communications 
Indium Corporation
abrown@indium.com
tel: +1.315.381.7524
34 Robinson Road
Clinton, NY 13323 USA
www.indium.com

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