Indium Corporation Expert to Present at SMTA Indiana Indesign Symposium

Indium Corporation’s Claire Hotvedt, Product Development Specialist, will present at the SMTA Indiana Indesign Product Engineering and Development LCC Symposium, November 19, Indianapolis, Indiana, USA.

Solder alloy development is a balancing act between desirable and undesirable properties. Hotvedt’s presentation, Durafuse LT: Developing a Mixed-Alloy Process for Property Fusion, will demonstrate the possibility of combining alloy properties using Indium Corporation’s patent-pending mixed-alloy process in Durafuse™ LT. While low-temperature solders often struggle with drop shock reliability or lower shear strength, Durafuse™ LT’s unique formulation provides enhanced drop shock resilience and reliability. Composed of a lower melting
In-containing alloy with a higher melting SAC alloy, the low-temperature solder melts to fuse with the SAC alloy powder during fusion and forms a continuous metal joint. Some Sn diffuses into the liquid indium-containing alloy to increase the re-melt temperature and enhance strength.

To learn more about Durafuse™ LT, visit

Hotvedt is responsible for facilitating the transition of new solder paste products from developmental stages into fully launched and marketable solutions. She also oversees product characterization and the creation of marketing material to assist the sales team. Prior to joining Indium Corporation in 2018, Hotvedt held two engineering positions, one at Orthogonal, Inc. and one at Bristol-Myers Squibb. She was also an Indium Corporation Summer Intern in 2014. Claire earned her bachelor’s degree in chemical engineering with a minor in Mandarin Chinese from the University of Rochester.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.

Anita Brown, Corporate Communications
Indium Corporation
tel: +1.315.381.7524
34 Robinson Road
Clinton, NY 13323 USA

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