Indium Corporation

Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019
Materials

Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019

Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process...

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Water-Soluble Solder Paste is suited for PCB assembly.
Materials

Water-Soluble Solder Paste is suited for PCB assembly.

Available in SAC and Pb-based alloys, Indium6.4R provides balanced performance for PCB assembly applications. This versatile, water-soluble solder paste flux, exhibiting optimized stencil printing performance and response-to-pause, allows for wetting and solderability on multiple surface finishes.Â- In addition toÂ- minimizing voiding on QFNs, BGAs, and CSPs, product also maintains tack...

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Inorganic Indium Compounds offer diverse product solutions.

Inorganic Indium Compounds offer diverse product solutions.

Among others, inorganic compound offeringsÂ- – indium oxide, indium-tin oxide (ITO), indium trichloride, indium hydroxide, indium sulfide, and indium sulfate – can be provided inÂ- various crystal forms to addressÂ- diverse applications. ITO, asÂ- transparent conductor, is used for manufacturing flat panel displays, LCDs, and touch sensors, while indium trichloride is used as...

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Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016
Materials

Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo, which will be held on March 15-17 in Las Vegas, Nev. Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 solder paste to reduce voiding significantly below the industry average – for improved...

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Indium Corporation Features Indium8.9HF, Indium10.1 Solder Pastes at NEPCON South China
Materials

Indium Corporation Features Indium8.9HF, Indium10.1 Solder Pastes at NEPCON South China

Indium Corporation will feature its Indium8.9HF and Indium10.1 solder pastes at NEPCON South China 2015, on Aug. 25-27, in Shenzhen, China. Pb-free, halogen-free Indium8.9HF is perfectly suited for a wide variety of applications, including automotive, consumer, and communications. This is due to its high print transfer efficiency and robust reflow process window capability. With reliable...

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Indium Corporation Features Indium8.9HF Solder Paste at SMTAI
Machinery & Machining Tools

Indium Corporation Features Indium8.9HF Solder Paste at SMTAI

Indium Corporation will feature Indium8.9HF, a halogen-free, no-clean solder paste with excellent performance stability during printing, at the SMTA International Conference Sept. 27-Oct. 1 in Rosemont, Ill. Pb-free Indium8.9HF is perfectly suited for a wide variety of applications, including automotive, consumer and communications. This is due to its high print transfer efficiency and robust...

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Indium Corporation Features Ultra-Low Residue No-Clean Flip-Chip Flux at SEMICON Taiwan
Materials

Indium Corporation Features Ultra-Low Residue No-Clean Flip-Chip Flux at SEMICON Taiwan

Indium Corporation will feature the newest in flux technology with its ultra-low and near-zero residue (ULR/NZR) no-clean Flip-Chip Flux product line at SEMICON Taiwan 2015 in Taipei, Taiwan. Indium Corporation’s ultra-low and near-zero residue no-clean Flip-Chip Fluxes eliminate the cost of cleaning flux residues and prevent damage to the die from stresses during cleanings. Flip-Chip Flux...

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Indium Corporation's Patented BiAgX-®: A Drop-In Replacement for High-Pb Solders
Materials

Indium Corporation's Patented BiAgX-®: A Drop-In Replacement for High-Pb Solders

Indium Corporation's newly-patented BiAgXÂ-® solder paste technology is the only low-cost, lead-free replacement solder paste that is customer-proven to survive JEDEC/IPC J-STD-020Â-  MSL1 preconditioning in specific devices without delamination. BiAgX is a high-melting, lead-free (Pb-free) solder paste technology that serves as a drop-in replacement for the high-Pb solder pastes used in...

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Materials

Indium Corporation Receives SMT China Vision Award

Indium Corporation was presented with the SMT China Vision Award for its Indium10.1 solder paste at NEPCON China on April 21 in Shanghai, China. The SMT China Vision Award recognizes domestic and international companies with innovative products and technologies in SMT methods, processes, materials, equipment, software, and management services. Each product entry was evaluated based on its...

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Company News

Indium Corporation Engineers Earn SMTA Certification

Indium Corporation is proud to announce that members of its United States-based technical support team have earned SMTA certification. Two Technical Support Engineers have recently earned certification as Certified SMT Process Engineers (CSMTPE): Meagan Sloan Miloš Lazić They join a number of CSMTPE colleagues at Indium Corporation, including two fellow United States-based technical support...

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People in the News

Indium Corporation President to Speak at Workforce and Education Conference

Indium Corporation’s Ross Berntson, President and COO, will be one of the featured speakers at Jobs for the Future (JFF) Horizons virtual conference at 3 p.m. EST (2 p.m. CST), Tuesday, June 9. Drawing from his unique global manufacturing experience, Berntson will participate in the session Responding to Crisis and Preparing for the Future: Regional Manufacturing Perspectives. In this session,...

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Company News

Indium Corporation Features Metal Thermal Interface Materials for Burn-in and Test at TestConX

Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, March 1-4 in Mesa, Arizona, USA. Indium Corporation’s wide portfolio of metal-based TIMs offers proven solutions for a wide variety of applications and process challenges: Challenge: thermal conductivity. Heat dissipation is key to maintaining the longevity and reliability of devices....

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People in the News

Indium Corporation Expert to Present at SMTA Indiana Indesign Symposium

Indium Corporation’s Claire Hotvedt, Product Development Specialist, will present at the SMTA Indiana Indesign Product Engineering and Development LCC Symposium, November 19, Indianapolis, Indiana, USA. Solder alloy development is a balancing act between desirable and undesirable properties. Hotvedt’s presentation, Durafuse™ LT: Developing a Mixed-Alloy Process for Property Fusion, will...

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People in the News

Indium Corporation Expert to Present at SMTA San Diego Technical Expo

Indium Corporation expert Joe Bahou, Technical Sales Support Engineer, will share his knowledge at the SMTA San Diego Technical Expo, November 5, San Diego, Calif., USA. Voiding can cause field failures and thermal problems, and lead to customer dissatisfaction with their end product. In Avoiding the Pitfalls of Voiding in PCB Assemblies, Bahou helps attendees Avoid the Void® with an...

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Company News

Indium Corporation Expert to Present at IPC Electronics Materials Forum

Indium Corporation expert Dr. Jie Geng, Research Metallurgist, will share his knowledge at the IPC Electronics Materials Forum, November 5-7, Minneapolis, Minn., USA. Dr. Geng will present Fluxes Designed for Suppressing Non-Wet-Open during BGA Assembly, which examines the increasing severity of warpage and non-wet-open (NWO) defects during BGA assembly due to the continuing advancement of...

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Company News

Indium Corporation Expert to Present at SMTA Space Coast

Indium Corporation expert Kim Flanagan, Technical Support Engineer, will present new developments in low-temperature solder materials at SMTA Space Coast on November 20 in Melbourne, Fl., USA. From wearable electronics to rework processes, the use of low-temperature solder is expanding in the PCBA industry. Flanagan’s presentation, Understanding Reliability of Low-Temperature Solders and New...

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Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019
Materials

Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019

Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process...

Read More »
Company News

Indium Corporation Experts to Present at ICEET

Indium Corporation experts will share their knowledge at the International Conference for Electronics Enabling Technologies (ICEET), June 4-6, Markham, Ontario. Ed Briggs, Northeast Regional Sales Manager, will present Electrical Reliability for Automotive Assembly. He will discuss how the increasing amount of electronics in vehicles has escalated demands on automotive electrical systems in an...

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Company News

Indium Corporation to Host Reliability Symposium at SMTA Chapter Events

Indium Corporation, in cooperation with industry partners MicroCare and Weller, is kicking off a half-day, reliability-focused technical symposium roadshow at SMTA Carolinas’ Expo & Tech Forum, starting May 2 in Durham, North Carolina. Surface Mount Technology Association (SMTA) will host a series of these technical symposiums during which partners—global leaders in their own areas of...

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