Company News

Indium Corporation

34 Robinson Rd., Clinton, NY, 13323, USA

  • 866-792-5163

Latest New Product News from
Indium Corporation

Materials & Material Processing

Indium10.1HF Solder Paste meets IEC 61249-2-21 standards.

Oct 07, 2017

Offering low bridging, slump, and solder balling and low voiding in bottom termination component assemblies, Halogen-Free Indium10.1HF Solder Paste is formulated to maximize ECM and head-in-pillow performance. This paste minimizes solder beading and improves print transfer efficiency. Compatible with alloys like SnAgCu and SnAg, product provides improved wetting to common fresh and aged... Read More

Materials & Material Processing

Water-Soluble Solder Paste is suited for PCB assembly.

Feb 16, 2016

Available in SAC and Pb-based alloys, Indium6.4R provides balanced performance for PCB assembly applications. This versatile, water-soluble solder paste flux, exhibiting optimized stencil printing performance and response-to-pause, allows for wetting and solderability on multiple surface finishes. In addition to minimizing voiding on QFNs, BGAs, and CSPs, product also maintains tack over... Read More

Materials & Material Processing

Inorganic Indium Compounds offer diverse product solutions.

Feb 16, 2016

Among others, inorganic compound offerings – indium oxide, indium-tin oxide (ITO), indium trichloride, indium hydroxide, indium sulfide, and indium sulfate – can be provided in various crystal forms to address diverse applications. ITO, as transparent conductor, is used for manufacturing flat panel displays, LCDs, and touch sensors, while indium trichloride is used as additive to... Read More

Materials & Material Processing, Paints & Coatings

Flux Coating helps meet flatness, tight tolerance needs.

Apr 21, 2015

Available for solder preforms, LV1000 is halide-free, meets ROL0 requirements, and passes Telcordia GR-78 testing in unactivated state. Durability of glossy, uniform coating facilitates integration of this material into automated assembly processes, while minimal voiding accommodates bottom termination components that do not allow for proper outgassing of volatized flux. With... Read More

Materials & Material Processing

Halogen- and Pb-Free Solder Paste improves ICT first-pass yields.

Mar 02, 2015

Formulated to accommodate processing temperatures required by SnAgCu, SnAg, and other alloy systems used by electronics industry, Indium10.5HF no-clean solder paste conserves time and increases output for companies that require ICT as part of their normal production. Soft, pliable, non-tacky residue minimizes build-up on probes during in-circuit testing and increases first-pass ICT yields,... Read More

Materials & Material Processing

Free-Flowing Gallium Trichloride comes in granulated form.

Sep 12, 2014

Via its granulated form, EZ-Pour™ Gallium Trichloride (GaCl3) enables efficient and consistent transfer between vessels and processing equipment. Clumping is eliminated while fostering accelerated, safe, and accurate transfer. Physical properties negate need for mallable container, and product can be shipped in boroslicate glass without losing its free-flowing nature. Also, transparency of... Read More

Materials & Material Processing

Pb-Free Solder Paste suits high complexity PCBs.

Jul 15, 2014

Compatible with both SnPb and SAC alloys, RMA-155 delivers consistent transfer efficiencies, optimal response-to-pause, and strong oxidation barrier, even for long and hot profiles. Halogen-free product resists graping on small components and tiny deposits, prevents head-in-pillow defects, and minimizes voiding for BGAs and large thermal planes. Conforming to RMA classification for QQ-S-571F,... Read More

Materials & Material Processing

Pb-Free Solder Paste targets small, low-voltage QFN packages.

Feb 10, 2014

Designed as drop-in replacement for standard high Pb-containing solder pastes, BiAgX™ excels in high temperature environments in excess of 150°C. High-melting, lead- and antimony-free product reflows, solders, wets, and solidifies like any other solder paste, and is available in both dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes. Read More

Materials & Material Processing

Pb-Free Solder Paste delivers high first pass yields.

Dec 16, 2013

Indium8.9HF1-P combines max stencil printing performance with optimized no-clean residues to enhance probe testing. Able to print on apertures with area ratios <0.5 using minimal print pressures, product conserves testing time by eliminating false failures. Halogen-free oxidation barrier technology eliminates defects such as head-in-pillow and graping, while soft residue after reflow is... Read More

Materials & Material Processing

Solder Alloy maximizes drop shock performance of electronics.

Aug 15, 2013

Featuring low silver content, platform consists of Indium 8.9 Series solder pastes using SACM™ solder alloy technology for board-side interconnect, and SACM™ solder balls for package level interconnect. SACM’s stable, micro-structural improvements to intermetallic compound layer of solder-to-pad interface maximize drop shock performance of portable electronic devices without... Read More

Materials & Material Processing

Soldering Alloy offers optimal drop shock performance.

Jul 09, 2013

Doped with manganese for strength, SACM™ meets electronics assembly market's demand for solder alloy that offers combination of optimal drop shock performance, thermal cycling, and lead-free composition. Product features tensile strength of 5,625 psi, yield strength of 3,590 psi, and 15.7% elongation. Alloy is especially suitable for manufacture of consumer electronics that experience... Read More

Materials & Material Processing

Solder Alloy meets needs of electronics assembly market.

Jul 02, 2013

Offering optimal drop shock performance without compromises to thermal cycling, SACM™ has lead-free composition and consists of 97.5–98.5% Sn (tin), 0.5–1.0% Ag (silver), 0.5–1.0% Cu (copper), and dopant levels of Mn (manganese). Alloy is doped with manganese, which increases strength, while reduced silver content promotes stable cost structure. Properties include 5,625 psi tensile... Read More

Materials & Material Processing

Solder Paste is suited for use on miniaturized assemblies.

Jun 19, 2013

Suited for assemblers and OEMs of mobile phones and other personal electronics devices contending with sub-8 mil challenges, Indium8.9HFA halogen- and Pb-free solder paste optimizes print performance and mitigates common defects such as QFN voiding, head-in-pillow, and graping. Transfer efficiency lends to consistent, full volume print deposits (8 mil), while print pressure and response-to-pause... Read More

Adhesives & Sealants, Material Handling & Storage, Materials & Material Processing

Water-Soluble Solder Paste minimizes voids.

May 03, 2013

Manufactured with standard type 3 powder in Sn63, Sn62, and Indalloy100, Indium6.4 minimizes voiding under QFN and BGA assemblies. Whereas typical water-soluble paste has approximately 15–30% voiding, Indium 6.4 consistently yields less than 5%. Additional features include optimized response-to-pause printing, cleanability, and reflow properties as well as extended stencil life and slump... Read More

Materials & Material Processing

No-Clean Solder Paste suits PoP applications.

Mar 20, 2013

Designed for use in package-on-package applications 0.3 mm and larger, Indium9.91 can be used with SAC305 and Sn63/Pb37 alloys. Product's rheology optimizes both dipping and package retention. Featuring typical viscosity of 150 kcps, typical tack strength of 40 g, and working life of 8 hours at room temperature, solder paste eliminates defects due to package warping. Read More

Green & Clean, Materials & Material Processing

Thermal Interface Material is optimized for IGBT modules.

Sep 16, 2009

Heat-Spring® metallic thermal interface material is soft metal alloy developed as compressible metallic shim suitable for IGBT mounting applications. Material's Heat-Springs are compressible soft metal performs that adapt to irregularities in mounting surface and are conductive both thermally and electrically. No special mounting apparatus is required. Heat-Springs are made of 100% recyclable... Read More

Materials & Material Processing

Cored Wire Solder is designed for use with Pb-free alloys.

Nov 05, 2008

Colophony/rosin free, no-clean, cored wire solder, CW-501 comes in variety of alloys and wire diameters. Compatible with wave fluxes and Indium8.9, it provides wetting and solder spread with minimal smoking and low odor. Read More

Materials & Material Processing

Solder Flux targets Pb-free wave soldering.

Jul 13, 2005

Suited for soldering surface-mount, mixed-technology, and through-hole electronics assemblies, 1075-EXR is water-based and non-flammable, eliminating special storage requirements and minimizing VOC emissions. Product provides surface wetting, eliminates cleaning, and minimizes solder balling. It can also be used for Sn/Pb assemblies. Read More

Materials & Material Processing

Water-Soluble Solder Paste is lead-free.

Oct 25, 2004

Suited for fine-pitch applications, Indium3.1 exhibits beneficial wetting under air and nitrogen reflow atmosphere. Low-voiding, low-foaming product exhibits slump resistance and results in shiny and smooth solder joints. Stencil life virtually eliminates solder paste waste, and any residue is cleaned with water. Product comes in 500 g jars and 700 g cartridges. Read More

Materials & Material Processing

Wave Solder Flux suits Pb-free applications.

Sep 30, 2004

No-clean, halide-free 3592-35 provides heat stability for high temperatures required in Pb-free wave soldering of mixed-technology and through-hole electronic assemblies. Solvent-based formulation offers wide process window and minimizes solder balling. It can be used with tin/copper, tin/silver/copper, and tin/lead alloys. Read More

Other Company News from
Indium Corporation

Aug 18, 2010

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