Indium Corporation

Indium Corporation to Feature Materials for HIA at Electronics Packaging Symposium
Materials

Indium Corporation to Feature Materials for HIA at Electronics Packaging Symposium

Indium Corporation will feature its proven materials for Heterogeneous Integration & Assembly (HIA) at the 31st Annual Electronics Packaging Symposium, September 5-6 in Niskayuna, New York, USA. Indium Corporation’s soldering materials for HIA applications have a proven track record of success in more than two billon front-end module SiP devices manufactured over the last three years....

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Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019
Materials

Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019

Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process...

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Indium Corporation Features Metal Thermal Interface Materials for Burn-in and Test at TestConX Workshop 2019
Materials

Indium Corporation Features Metal Thermal Interface Materials for Burn-in and Test at TestConX Workshop 2019

Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz. A pure indium Heat-Spring® in the HSK pattern can be clad on one side with a thin layer of aluminum, which will prevent the indium from sticking to the device under test (DUT). Due to the thinness of the aluminum,...

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Indium10.1HF Solder Paste meets IEC 61249-2-21 standards.
Materials

Indium10.1HF Solder Paste meets IEC 61249-2-21 standards.

Offering low bridging, slump, and solder balling and low voiding in bottom termination component assemblies, Halogen-Free Indium10.1HF Solder Paste is formulated to maximize ECM and head-in-pillow performance. This paste minimizes solder beading and improves print transfer efficiency. Compatible with alloys like SnAgCu and SnAg, product provides improved wetting to common fresh and aged...

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Indium Corporation to Feature MEMS Microphone Lid-Attach Indium8.9HF Solder Paste at MEMS and Sensors Technology Symposium 2017
Materials

Indium Corporation to Feature MEMS Microphone Lid-Attach Indium8.9HF Solder Paste at MEMS and Sensors Technology Symposium 2017

Indium Corporation will feature its MEMS microphone lid-attach Indium8.9HF Solder Paste at MEPTEC’s 15th Annual MEMS and Sensors Technology Symposium on June 6, in San Jose, Calif. Indium8.9HF is a no-clean, halogen-free (no intentionally added, halogen-free flux) solder paste that enables dispensing of fine lines and shapes down to a width of less than 150 microns. Indium8.9HF provides...

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Indium Corporation to Discuss Low-Voiding Options at SMTA Rocky Mountain
Materials

Indium Corporation to Discuss Low-Voiding Options at SMTA Rocky Mountain

Indium Corporation will feature its void-reducing solder pastes at the SMTA Rocky Mountain Expo & Technical Conference on Jan. 19 in Denver, Colo. Indium Corporation’s Indium8.9HF and Indium10.1 Solder Pastes: Are designed to provide ultra-low voiding Offer great print capabilities for small and low profile components Are designed to overcome head-in-pillow (HIP) Have excellent shelf and...

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People in the News

Indium Corporation Expert to Present at SMTA San Diego Technical Expo

Indium Corporation expert Joe Bahou, Technical Sales Support Engineer, will share his knowledge at the SMTA San Diego Technical Expo, November 5, San Diego, Calif., USA. Voiding can cause field failures and thermal problems, and lead to customer dissatisfaction with their end product. In Avoiding the Pitfalls of Voiding in PCB Assemblies, Bahou helps attendees Avoid the Void® with an...

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Company News

Indium Corporation Expert to Present at IPC Electronics Materials Forum

Indium Corporation expert Dr. Jie Geng, Research Metallurgist, will share his knowledge at the IPC Electronics Materials Forum, November 5-7, Minneapolis, Minn., USA. Dr. Geng will present Fluxes Designed for Suppressing Non-Wet-Open during BGA Assembly, which examines the increasing severity of warpage and non-wet-open (NWO) defects during BGA assembly due to the continuing advancement of...

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Company News

Indium Corporation Expert to Present at SMTA Space Coast

Indium Corporation expert Kim Flanagan, Technical Support Engineer, will present new developments in low-temperature solder materials at SMTA Space Coast on November 20 in Melbourne, Fl., USA. From wearable electronics to rework processes, the use of low-temperature solder is expanding in the PCBA industry. Flanagan’s presentation, Understanding Reliability of Low-Temperature Solders and New...

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Indium Corporation to Feature Materials for HIA at Electronics Packaging Symposium
Materials

Indium Corporation to Feature Materials for HIA at Electronics Packaging Symposium

Indium Corporation will feature its proven materials for Heterogeneous Integration & Assembly (HIA) at the 31st Annual Electronics Packaging Symposium, September 5-6 in Niskayuna, New York, USA. Indium Corporation’s soldering materials for HIA applications have a proven track record of success in more than two billon front-end module SiP devices manufactured over the last three years....

Read More »
Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019
Materials

Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019

Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process...

Read More »
Company News

Indium Corporation Experts to Present at ICEET

Indium Corporation experts will share their knowledge at the International Conference for Electronics Enabling Technologies (ICEET), June 4-6, Markham, Ontario. Ed Briggs, Northeast Regional Sales Manager, will present Electrical Reliability for Automotive Assembly. He will discuss how the increasing amount of electronics in vehicles has escalated demands on automotive electrical systems in an...

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Company News

Indium Corporation to Host Reliability Symposium at SMTA Chapter Events

Indium Corporation, in cooperation with industry partners MicroCare and Weller, is kicking off a half-day, reliability-focused technical symposium roadshow at SMTA Carolinas’ Expo & Tech Forum, starting May 2 in Durham, North Carolina. Surface Mount Technology Association (SMTA) will host a series of these technical symposiums during which partners—global leaders in their own areas of...

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Company News

Indium Corporation Earns International Automotive Quality Recognition at Solder Manufacturing Facilities

Indium Corporation has earned IATF 16949:2016 management system certificates for five of its solder manufacturing facilities in Clinton and Utica, NY, USA; Singapore; Milton Keynes, UK; and China. The company’s headquarters in Clinton, NY, USA has also achieved IATF 16949 certification. Indium Corporation has demonstrated effective implementation of a management system that satisfies the tough...

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Company News

Indium Corporation Interview Among SMT007's Top 10 Most-Read Articles for March

Indium Corporation’s Chris Nash, Product Manager PCB Assembly Materials, is on SMT007’s list of the Top 10 Most-Read Articles for March for his show floor interview at IPC APEX Expo 2019. During the interview, Nash shared how Indium Corporation delivers electrical, mechanical, and thermal reliability to customers’ processes and end products. While achieving reliability in any of these...

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