Indium Corporation
Suite 301
Clinton, NY 13323
Indium Corporation to Feature Materials for HIA at Electronics Packaging Symposium
Indium Corporation will feature its proven materials for Heterogeneous Integration & Assembly (HIA) at the 31st Annual Electronics Packaging Symposium, September 5-6 in Niskayuna, New York, USA. Indium Corporation’s soldering materials for HIA applications have a proven track record of success in more than two billon front-end module SiP devices manufactured over the last three years....
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Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019
Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process...
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New InFORMS ESM02 Solder Preform Offers Enhanced Thermal Cycling Reliability
Designed to provide consistent bondline thickness of 50μm for die-level attach applications. Formulated for high-reliability solder joint with improved thermal and mechanical performance. Features bondline co-planarity and increased lateral strength.
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Indium Corporation Introduces m2TIM Interface Material That Improves Thermal Conductivity
Available in InGa and InGaSn variants and offers wetting ability to metallic and non-metallic surfaces. Combines liquid metal with a solid metal preform for providing reliable thermal conductivity for heat dissipation. Exhibits low interfacial resistance and eliminates the risk of pump-out of the liquid alloy.
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Indium Corporation Features Metal Thermal Interface Materials for Burn-in and Test at TestConX Workshop 2019
Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz. A pure indium Heat-Spring® in the HSK pattern can be clad on one side with a thin layer of aluminum, which will prevent the indium from sticking to the device under test (DUT). Due to the thinness of the aluminum,...
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New InFORMS Solder Preforms and Ribbon Use a Reinforced Matrix
InFORMS consists of solder with a reinforcing matrix which provides mechanical and thermal reliability, uniform solder bondline thickness, and low-void performance. Also, InFORMS's strong and dependable joints allow for high power densities.
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Indium10.1HF Solder Paste meets IEC 61249-2-21 standards.
Offering low bridging, slump, and solder balling and low voiding in bottom termination component assemblies, Halogen-Free Indium10.1HF Solder Paste is formulated to maximize ECM and head-in-pillow performance. This paste minimizes solder beading and improves print transfer efficiency. Compatible with alloys like SnAgCu and SnAg, product provides improved wetting to common fresh and aged...
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Indium Corporation to Feature MEMS Microphone Lid-Attach Indium8.9HF Solder Paste at MEMS and Sensors Technology Symposium 2017
Indium Corporation will feature its MEMS microphone lid-attach Indium8.9HF Solder Paste at MEPTEC’s 15th Annual MEMS and Sensors Technology Symposium on June 6, in San Jose, Calif. Indium8.9HF is a no-clean, halogen-free (no intentionally added, halogen-free flux) solder paste that enables dispensing of fine lines and shapes down to a width of less than 150 microns. Indium8.9HF provides...
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Indium Corporation to Discuss Low-Voiding Options at SMTA Rocky Mountain
Indium Corporation will feature its void-reducing solder pastes at the SMTA Rocky Mountain Expo & Technical Conference on Jan. 19 in Denver, Colo. Indium Corporation’s Indium8.9HF and Indium10.1 Solder Pastes: Are designed to provide ultra-low voiding Offer great print capabilities for small and low profile components Are designed to overcome head-in-pillow (HIP) Have excellent shelf and...
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Indium Corporation Features InFORMS® Reinforced Solder Preforms at IMAPS 2016
Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS-®, at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 - Packaging the Connected World), Oct. 10-13, in Pasadena, Calif. InFORMS are reinforced solder preforms that maintain a constant bondline thickness, thus significantly improving thermal cycling reliability. This is a key...
Read More »Indium Corporation Engineers Earn SMTA Certification
Indium Corporation is proud to announce that members of its United States-based technical support team have earned SMTA certification. Two Technical Support Engineers have recently earned certification as Certified SMT Process Engineers (CSMTPE): Meagan Sloan Miloš Lazić They join a number of CSMTPE colleagues at Indium Corporation, including two fellow United States-based technical support...
Read More »Indium Corporation President to Speak at Workforce and Education Conference
Indium Corporation’s Ross Berntson, President and COO, will be one of the featured speakers at Jobs for the Future (JFF) Horizons virtual conference at 3 p.m. EST (2 p.m. CST), Tuesday, June 9. Drawing from his unique global manufacturing experience, Berntson will participate in the session Responding to Crisis and Preparing for the Future: Regional Manufacturing Perspectives. In this session,...
Read More »Indium Corporation Features Metal Thermal Interface Materials for Burn-in and Test at TestConX
Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, March 1-4 in Mesa, Arizona, USA. Indium Corporation’s wide portfolio of metal-based TIMs offers proven solutions for a wide variety of applications and process challenges: Challenge: thermal conductivity. Heat dissipation is key to maintaining the longevity and reliability of devices....
Read More »Indium Corporation Expert to Present at SMTA Indiana Indesign Symposium
Indium Corporation’s Claire Hotvedt, Product Development Specialist, will present at the SMTA Indiana Indesign Product Engineering and Development LCC Symposium, November 19, Indianapolis, Indiana, USA. Solder alloy development is a balancing act between desirable and undesirable properties. Hotvedt’s presentation, Durafuse™ LT: Developing a Mixed-Alloy Process for Property Fusion, will...
Read More »Indium Corporation Expert to Present at SMTA San Diego Technical Expo
Indium Corporation expert Joe Bahou, Technical Sales Support Engineer, will share his knowledge at the SMTA San Diego Technical Expo, November 5, San Diego, Calif., USA. Voiding can cause field failures and thermal problems, and lead to customer dissatisfaction with their end product. In Avoiding the Pitfalls of Voiding in PCB Assemblies, Bahou helps attendees Avoid the Void® with an...
Read More »Indium Corporation Expert to Present at IPC Electronics Materials Forum
Indium Corporation expert Dr. Jie Geng, Research Metallurgist, will share his knowledge at the IPC Electronics Materials Forum, November 5-7, Minneapolis, Minn., USA. Dr. Geng will present Fluxes Designed for Suppressing Non-Wet-Open during BGA Assembly, which examines the increasing severity of warpage and non-wet-open (NWO) defects during BGA assembly due to the continuing advancement of...
Read More »Indium Corporation Expert to Present at SMTA Space Coast
Indium Corporation expert Kim Flanagan, Technical Support Engineer, will present new developments in low-temperature solder materials at SMTA Space Coast on November 20 in Melbourne, Fl., USA. From wearable electronics to rework processes, the use of low-temperature solder is expanding in the PCBA industry. Flanagan’s presentation, Understanding Reliability of Low-Temperature Solders and New...
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Indium Corporation to Feature Materials for HIA at Electronics Packaging Symposium
Indium Corporation will feature its proven materials for Heterogeneous Integration & Assembly (HIA) at the 31st Annual Electronics Packaging Symposium, September 5-6 in Niskayuna, New York, USA. Indium Corporation’s soldering materials for HIA applications have a proven track record of success in more than two billon front-end module SiP devices manufactured over the last three years....
Read More »
Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019
Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process...
Read More »Indium Corporation Experts to Present at ICEET
Indium Corporation experts will share their knowledge at the International Conference for Electronics Enabling Technologies (ICEET), June 4-6, Markham, Ontario. Ed Briggs, Northeast Regional Sales Manager, will present Electrical Reliability for Automotive Assembly. He will discuss how the increasing amount of electronics in vehicles has escalated demands on automotive electrical systems in an...
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