Schroff Development Corporation

Multi-Functional Cases feature integral EMC shielding.
Architectural & Civil Engineering Products

Multi-Functional Cases feature integral EMC shielding.

SchroffÂ-® RatiopacPRO Series, designed to IEEE1101.10 specifications, provide system designers with enclosed 19 in. sub-rack solutions. Internal framework consists of extruded aluminum rails mounted between aluminum side panels and support brackets. EMC attenuation is greater than 25 dB at 1 GHz. Symmetric design enables users to plug in modules from front or back without removal of cover...

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CompactPCI Telecom System is compliant with PICMG 2.16.
Communication Systems & Equipment

CompactPCI Telecom System is compliant with PICMG 2.16.

CompactPCI 2.16 System provides data transfer rates up to 50 Gbit/sec. System is based on 19 in., 10U subrack with CompactPCI packet switching backplane, which incorporates 14 node slots and 2 fabric slots. It includes two 3U high, 19 in. power supplies, 250 W each. Two additional 3U slots are reserved for redundant operation of Chassis Monitoring Modules. Cooling is provided by hot-swappable...

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Development System meets PICMG 3.0 specification.
Architectural & Civil Engineering Products

Development System meets PICMG 3.0 specification.

AdvancedTCA(TM) incorporates full mesh 14-slot backplane installed in 12U, 84HP subrack. Integral cooling unit, with 3 fans, handles heat dissipation up to 120 W per board. Enclosure provides redundancy through dual IntelÂ-® ZT 7101 shelf management controllers and dual 48 V, 60 A power input filters supplying 48 Vdc power. Open, multi-vendor ATCA(TM) architecture suits telecom, datacom, and...

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