Schroff Development Corporation
Mission, KS 66222
Multi-Functional Cases feature integral EMC shielding.
SchroffÃ-® RatiopacPRO Series, designed to IEEE1101.10 specifications, provide system designers with enclosed 19 in. sub-rack solutions. Internal framework consists of extruded aluminum rails mounted between aluminum side panels and support brackets. EMC attenuation is greater than 25 dB at 1 GHz. Symmetric design enables users to plug in modules from front or back without removal of cover...
Read More »CompactPCI Telecom System is compliant with PICMG 2.16.
CompactPCI 2.16 System provides data transfer rates up to 50 Gbit/sec. System is based on 19 in., 10U subrack with CompactPCI packet switching backplane, which incorporates 14 node slots and 2 fabric slots. It includes two 3U high, 19 in. power supplies, 250 W each. Two additional 3U slots are reserved for redundant operation of Chassis Monitoring Modules. Cooling is provided by hot-swappable...
Read More »Development System meets PICMG 3.0 specification.
AdvancedTCA(TM) incorporates full mesh 14-slot backplane installed in 12U, 84HP subrack. Integral cooling unit, with 3 fans, handles heat dissipation up to 120 W per board. Enclosure provides redundancy through dual IntelÃ-® ZT 7101 shelf management controllers and dual 48 V, 60 A power input filters supplying 48 Vdc power. Open, multi-vendor ATCA(TM) architecture suits telecom, datacom, and...
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