Epoxies Etc.

New 20-3035 Syntactic Epoxies are Resistant to Thermal and Mechanical Shock
Adhesives & Sealants

New 20-3035 Syntactic Epoxies are Resistant to Thermal and Mechanical Shock

The 20-3035 Syntactic Epoxy is offered in ready-to-use FreezeBond® premixed and frozen syringe. The product is made by incorporating hollow glass microspheres into a proprietary resin blend. The epoxy is designed for various curing agents for creating thermally insulative and lightweight casting. This compound exhibits low dielectric constant, low shrinkage on cure, low moisture absorption,...

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New 70-3812NC Epoxy Adhesive Meets NASA Outgassing Stamdards as per ASTM E-595-07
Adhesives & Sealants

New 70-3812NC Epoxy Adhesive Meets NASA Outgassing Stamdards as per ASTM E-595-07

The 70-3812NC Aluminum Filled Epoxy Adhesive is designed for bonding heat sinks, which require high thermal conductivity and strong structural bonds. The product is cured at room temperature with mild heat and the 10:1 mix ratio used for batch mixing. The 70-3812NC adhesive is suitable for heat sink bonding applications such as fin to base, folded-fin set to base, pin-fin set to base and cold...

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TriggerBond Dispensing System features static mixers.
Material Handling & Storage

TriggerBond Dispensing System features static mixers.

TriggerBond Dispensing System features cartridges and dispensing guns. Unit helps user to increase production and offers less mixing errors. Cartridges are available in 50ml, 200ml and 400ml volumes and are suitable for bonding, sealing, or small potting applications. Cartridges offer consistent mix ratio and enables operator to apply air-free mixture directly into a cavity.

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Fast Curing Epoxy Assembly Adhesives
Adhesives & Sealants

Fast Curing Epoxy Assembly Adhesives

A series of fast curing thixotropic Epoxy Assembly Adhesives was developed by Epoxies, Etc. These non-sag epoxy adhesives offer manufacturers the ability to improve productivity due to their quick 5-46 minute set times. 10-3005 NS 5 Minute Set Epoxy 10-3020 NS 20 Minute Set Epoxy 10-3046 NS 46 Minute Set Epoxy In addition to providing rapid assembly they also offer good water resistance, chemical...

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40-3907 Epoxy Resin provides resistance to chemicals.
Optics & Photonics

40-3907 Epoxy Resin provides resistance to chemicals.

Ideal for bonding and sealing applications that cannot utilize heat to cure the adhesive, 40-3907 Epoxy Resins are electrically conductive room temperature curing adhesives. Used as repair material for electrical traces, device includes thin film set time of ninety minutes at room temperature and within six hours is close to full hardness (Shore D 78). Film is used for applications like solder...

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Adhesives & Sealants

Silicone Potting Compound features lightweight formulation.

Utilizing advanced micro balloon technology fillers, 20-1634 Light Weight Silicone Potting Compound features specific gravity of 0.82, making it suited for applications that require low weight, flexibility, high heat resistance, and optimized electrical insulation properties. Two-component silicon elastomer features Shore A hardness of 34 and tensile strength of 125 psi. Formulated without...

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New 20-3035 Syntactic Epoxies are Resistant to Thermal and Mechanical Shock
Adhesives & Sealants

New 20-3035 Syntactic Epoxies are Resistant to Thermal and Mechanical Shock

The 20-3035 Syntactic Epoxy is offered in ready-to-use FreezeBond® premixed and frozen syringe. The product is made by incorporating hollow glass microspheres into a proprietary resin blend. The epoxy is designed for various curing agents for creating thermally insulative and lightweight casting. This compound exhibits low dielectric constant, low shrinkage on cure, low moisture absorption,...

Read More »
New 70-3812NC Epoxy Adhesive Meets NASA Outgassing Stamdards as per ASTM E-595-07
Adhesives & Sealants

New 70-3812NC Epoxy Adhesive Meets NASA Outgassing Stamdards as per ASTM E-595-07

The 70-3812NC Aluminum Filled Epoxy Adhesive is designed for bonding heat sinks, which require high thermal conductivity and strong structural bonds. The product is cured at room temperature with mild heat and the 10:1 mix ratio used for batch mixing. The 70-3812NC adhesive is suitable for heat sink bonding applications such as fin to base, folded-fin set to base, pin-fin set to base and cold...

Read More »
Company News

Tips and Tricks Videos

A new video has been added to the Epoxies, Etc. Tips and Tricks Video Series; How to Choose the Right Chemistry Formulation. Design engineers have many choices when selecting an adhesive or potting compound. One important decision to make when narrowing down the field of choices is which chemistry to use for a particular application. Epoxies, Urethanes, and Silicones all have their advantages and...

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TriggerBond Dispensing System features static mixers.
Material Handling & Storage

TriggerBond Dispensing System features static mixers.

TriggerBond Dispensing System features cartridges and dispensing guns. Unit helps user to increase production and offers less mixing errors. Cartridges are available in 50ml, 200ml and 400ml volumes and are suitable for bonding, sealing, or small potting applications. Cartridges offer consistent mix ratio and enables operator to apply air-free mixture directly into a cavity.

Read More »
Fast Curing Epoxy Assembly Adhesives
Adhesives & Sealants

Fast Curing Epoxy Assembly Adhesives

A series of fast curing thixotropic Epoxy Assembly Adhesives was developed by Epoxies, Etc. These non-sag epoxy adhesives offer manufacturers the ability to improve productivity due to their quick 5-46 minute set times. 10-3005 NS 5 Minute Set Epoxy 10-3020 NS 20 Minute Set Epoxy 10-3046 NS 46 Minute Set Epoxy In addition to providing rapid assembly they also offer good water resistance, chemical...

Read More »
40-3907 Epoxy Resin provides resistance to chemicals.
Optics & Photonics

40-3907 Epoxy Resin provides resistance to chemicals.

Ideal for bonding and sealing applications that cannot utilize heat to cure the adhesive, 40-3907 Epoxy Resins are electrically conductive room temperature curing adhesives. Used as repair material for electrical traces, device includes thin film set time of ninety minutes at room temperature and within six hours is close to full hardness (Shore D 78). Film is used for applications like solder...

Read More »

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