Epoxies Etc.

TriggerBond Dispensing System features static mixers.
Material Handling & Storage

TriggerBond Dispensing System features static mixers.

TriggerBond Dispensing System features cartridges and dispensing guns. Unit helps user to increase production and offers less mixing errors. Cartridges are available in 50ml, 200ml and 400ml volumes and are suitable for bonding, sealing, or small potting applications. Cartridges offer consistent mix ratio and enables operator to apply air-free mixture directly into a cavity.

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Fast Curing Epoxy Assembly Adhesives
Adhesives & Sealants

Fast Curing Epoxy Assembly Adhesives

A series of fast curing thixotropic Epoxy Assembly Adhesives was developed by Epoxies, Etc. These non-sag epoxy adhesives offer manufacturers the ability to improve productivity due to their quick 5-46 minute set times. 10-3005 NS 5 Minute Set Epoxy 10-3020 NS 20 Minute Set Epoxy 10-3046 NS 46 Minute Set Epoxy In addition to providing rapid assembly they also offer good water resistance, chemical...

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40-3907 Epoxy Resin provides resistance to chemicals.
Optics & Photonics

40-3907 Epoxy Resin provides resistance to chemicals.

Ideal for bonding and sealing applications that cannot utilize heat to cure the adhesive, 40-3907 Epoxy Resins are electrically conductive room temperature curing adhesives. Used as repair material for electrical traces, device includes thin film set time of ninety minutes at room temperature and within six hours is close to full hardness (Shore D 78). Film is used for applications like solder...

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Adhesives & Sealants

Silicone Potting Compound features lightweight formulation.

Utilizing advanced micro balloon technology fillers, 20-1634 Light Weight Silicone Potting Compound features specific gravity of 0.82, making it suited for applications that require low weight, flexibility, high heat resistance, and optimized electrical insulation properties. Two-component silicon elastomer features Shore A hardness of 34 and tensile strength of 125 psi. Formulated without...

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Adhesives & Sealants

UL 94 V-0 Potting/Encapsulating Compounds suit harsh environments.

Epoxy and urethane products that meet engineering design demands of electronic and aerospace assemblies include 20-2362 FR low-durometer, low-viscosity urethane as well as 50-2369 FR thermally conductive and thermal shock-resistant urethane. Suited for similar applications, 50-3150 FR thermally conductive epoxy can provide an RTI rating of 130°C with Cat 30, while 50-3152 FR thermally conductive...

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Polyurethane Potting Compound cures in 1 hour.
Adhesives & Sealants

Polyurethane Potting Compound cures in 1 hour.

Designed to cure within 1 hour at room temperature, 20-2183 features 2:1 mix ratio and low viscosity that makes it suitable for use in cable assemblies, potting electronics, molding parts, and encapsulating electronic components. Tough elastomeric material helps assemblies withstand thermal cycling, offers vibration resistance, and imparts low stress on electronic components during cure....

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Epoxy Potting Compound resists thermal shock and cycling.
Adhesives & Sealants

Epoxy Potting Compound resists thermal shock and cycling.

Passing Navy Hex Bar Test, MIL-I-16923C, which consists of 10 cycles from -55 to +155°C, two-part epoxy resin 20-3301 protects electronic assemblies from thermal cycling and shock. Low viscosity epoxy flows quickly around components, giving users working time of 4–6 hr. Product is typically cured at 80°C for 1–2 hr, but post cure of 150°C for 3 hr will optimize performance properties....

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Epoxy Potting Compound resists high temperatures.
Adhesives & Sealants

Epoxy Potting Compound resists high temperatures.

With 130°C relative temperature index rating, 50-3150RFR Black Epoxy with Catalyst 30 will survive elevated temperatures for long periods of time, which offers benefits as electronics get smaller and hotter. Compound is UL 746B listed and formulated to meet stringent non-burning requirements of UL 94 V-0. Typical applications include encapsulating power supplies, transformers, coils, insulators,...

Read More »
Fast Cure Adhesives suit cartridge dispensing.
Adhesives & Sealants

Fast Cure Adhesives suit cartridge dispensing.

Suitable for use with TriggerBond® dispensing guns, TriggerBond Epoxies offer shear strength up to 1,500 psi and notched Izod impact of 2.7 ft-lb/in. Adhesive's 2 components are packaged into cartridges, which fit in dual-barrel dispensing gun. Because cartridges contain precise quantities of hardener and resin, TriggerBond produces correct mix ratio every time user squeezes trigger. Three...

Read More »
TriggerBond Dispensing System features static mixers.
Material Handling & Storage

TriggerBond Dispensing System features static mixers.

TriggerBond Dispensing System features cartridges and dispensing guns. Unit helps user to increase production and offers less mixing errors. Cartridges are available in 50ml, 200ml and 400ml volumes and are suitable for bonding, sealing, or small potting applications. Cartridges offer consistent mix ratio and enables operator to apply air-free mixture directly into a cavity.

Read More »
Fast Curing Epoxy Assembly Adhesives
Adhesives & Sealants

Fast Curing Epoxy Assembly Adhesives

A series of fast curing thixotropic Epoxy Assembly Adhesives was developed by Epoxies, Etc. These non-sag epoxy adhesives offer manufacturers the ability to improve productivity due to their quick 5-46 minute set times. 10-3005 NS 5 Minute Set Epoxy 10-3020 NS 20 Minute Set Epoxy 10-3046 NS 46 Minute Set Epoxy In addition to providing rapid assembly they also offer good water resistance, chemical...

Read More »
40-3907 Epoxy Resin provides resistance to chemicals.
Optics & Photonics

40-3907 Epoxy Resin provides resistance to chemicals.

Ideal for bonding and sealing applications that cannot utilize heat to cure the adhesive, 40-3907 Epoxy Resins are electrically conductive room temperature curing adhesives. Used as repair material for electrical traces, device includes thin film set time of ninety minutes at room temperature and within six hours is close to full hardness (Shore D 78). Film is used for applications like solder...

Read More »
Adhesives & Sealants

Silicone Potting Compound features lightweight formulation.

Utilizing advanced micro balloon technology fillers, 20-1634 Light Weight Silicone Potting Compound features specific gravity of 0.82, making it suited for applications that require low weight, flexibility, high heat resistance, and optimized electrical insulation properties. Two-component silicon elastomer features Shore A hardness of 34 and tensile strength of 125 psi. Formulated without...

Read More »
Adhesives & Sealants

UL 94 V-0 Potting/Encapsulating Compounds suit harsh environments.

Epoxy and urethane products that meet engineering design demands of electronic and aerospace assemblies include 20-2362 FR low-durometer, low-viscosity urethane as well as 50-2369 FR thermally conductive and thermal shock-resistant urethane. Suited for similar applications, 50-3150 FR thermally conductive epoxy can provide an RTI rating of 130°C with Cat 30, while 50-3152 FR thermally conductive...

Read More »
Polyurethane Potting Compound cures in 1 hour.
Adhesives & Sealants

Polyurethane Potting Compound cures in 1 hour.

Designed to cure within 1 hour at room temperature, 20-2183 features 2:1 mix ratio and low viscosity that makes it suitable for use in cable assemblies, potting electronics, molding parts, and encapsulating electronic components. Tough elastomeric material helps assemblies withstand thermal cycling, offers vibration resistance, and imparts low stress on electronic components during cure....

Read More »
Epoxy Potting Compound resists thermal shock and cycling.
Adhesives & Sealants

Epoxy Potting Compound resists thermal shock and cycling.

Passing Navy Hex Bar Test, MIL-I-16923C, which consists of 10 cycles from -55 to +155°C, two-part epoxy resin 20-3301 protects electronic assemblies from thermal cycling and shock. Low viscosity epoxy flows quickly around components, giving users working time of 4–6 hr. Product is typically cured at 80°C for 1–2 hr, but post cure of 150°C for 3 hr will optimize performance properties....

Read More »
Epoxy Potting Compound resists high temperatures.
Adhesives & Sealants

Epoxy Potting Compound resists high temperatures.

With 130°C relative temperature index rating, 50-3150RFR Black Epoxy with Catalyst 30 will survive elevated temperatures for long periods of time, which offers benefits as electronics get smaller and hotter. Compound is UL 746B listed and formulated to meet stringent non-burning requirements of UL 94 V-0. Typical applications include encapsulating power supplies, transformers, coils, insulators,...

Read More »
Fast Cure Adhesives suit cartridge dispensing.
Adhesives & Sealants

Fast Cure Adhesives suit cartridge dispensing.

Suitable for use with TriggerBond® dispensing guns, TriggerBond Epoxies offer shear strength up to 1,500 psi and notched Izod impact of 2.7 ft-lb/in. Adhesive's 2 components are packaged into cartridges, which fit in dual-barrel dispensing gun. Because cartridges contain precise quantities of hardener and resin, TriggerBond produces correct mix ratio every time user squeezes trigger. Three...

Read More »

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