Press Release Summary:
Targeted for electronic assembly manufacturers, 2-part 20-3063 epoxy potting and encapsulating compound has 1:1 mix ratio with resin pigmented black and catalyst white for visual indication that products have been properly mixed. It cures at room temperature to 75-80 Shore D hardness, has 45 min pot life, usable temperature range of -40 to 130Â°C, and dielectric strength of 450 V/mil.
Original Press Release:
Epoxies, Etc...Develops New Low Cost Potting & Encapsulating Compound
CRANSTON, RHODE ISLAND, USA
20-3063 is an electronic grade epoxy potting and encapsulating compound. This product provides several advantages to electronic assembly manufacturers.
The 20-3063 is low in viscosity allowing fast flow in and around electronic components. It has a non-critical one to one mix ratio ensuring a completely cured assembly even if slightly off ratio. The 20-3063 is formulated to be a low cost product capable of replacing many higher cost potting systems.
Samples and information about the 20-3063 can be obtained by visiting our website: www.epoxies.com.
20-3063 is an electronic grade potting and encapsulating compound. This is a low cost epoxy system designed for applications requiring a low viscosity. 20-3063 has an easy one to one mix ratio by weight or volume. The resin is pigmented black and the catalyst white for a visual indication that the products have been properly mixed together.
o Low Viscosity
o Easy 1:1 Mix Ratio
o Low Cost
o Room Temperature Cure
Mix Ratio, By Volume or Weight 1:1
Viscosity, 25°C, cps
Mixed Viscosity, 25°C, cps 6,700
Specific Gravity, 25°C, cps
Pot Life, 100 Gram Mass, 25°C 45 Minutes
Hardness, Shore D 75-80
Temperature Range of Use, °C -40 to 130
Dielectric Strength, volts/mil 450