Press Release Summary:
Flexible polyurethane potting and encapsulating resin system 20-2353 imparts no stress on delicate/sensitive electronic surface mount components during cure or when thermal cycled in electronic assemblies. Suited for continuous exposure in wet environments, it does not absorb any moisture and maintains flexibility down to -70Â°C. Product offered as alternative to Silicone systems due to its flexibility, adhesion, and electrical insulation properties.
Original Press Release:
Epoxies, Etc...Develops New Polyurethane Potting Compound
CRANSTON, RHODE ISLAND, USA
Epoxies, Etc... has developed a new flexible polyurethane potting and encapsulating resin system. The 20-2353 has been developed to protect delicate and sensitive electronic surface mount components. This soft polyurethane does not impart any stress on components during cure or when thermal cycled in electronic assemblies.
20-2353 is also an excellent choice for continuous exposure in wet environments. It does not absorb any moisture and will therefore insulate electronic systems in damp or wet applications. Another benefit to using 20-2353 is its ability to maintain flexibility down to -70°C.
20-2353 is a good alternative to Silicone systems due to its flexibility, electrical insulation properties, and ability to adhere to substrates better than Silicone. 20-2353 is a more cost-effective system than most Silicones allowing electronic companies to improve properties and reduce costs.
Samples of 20-2353 are readily available and may be requested from the website www.epoxies.com