Aprima Medical Software, Inc
Carrollton, TX 75006
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Power Supply is available in compact 1U enclosure.
Model D1U-W-1200-12-HC front-end power supply delivers up to 1,200 W (220 Vac) and 900 W (110 Vac) from its 12 V main output. It features N+1 redundancy, hot-swapability, active current sharing on main output, I2C bus, status indicators, and over-voltage, over-current, and over-temperature protection. Available with standby output voltages of 3.3 and 5 V, product has overall dimensions of 304.8 x...
Read More »Power Supply delivers any required voltage on each output.
Model RCL175 AC/DC switching power supply enables users to specify any voltage level while still maintaining full agency approvals. It is available with 1-4 outputs: 3-60 V on output 1, 5-60 V on output 2, and 5-30 V on outputs 3 and 4. Output 1 is user-adjustable by Ã-
Read More »Carbon Filters improve air quality in commercial buildings.
CamsorbÃ-® Riga-Carb deep-pleated carbon filters remove strong nuisance odors and diesel emissions and allow make-up air intake flow to be lowered. Model 201 contains high-activity RAD activated carbon and is designed to control odors from restaurants, office machines and furnishings, human occupants, and VOCs. Model 205 contains specially-treated RAD media for control of odors from...
Read More »Push-Pull Connectors operate in temp range of -40 to +100-
Amphe-PPM series of push-pull aluminum shell connectors enable quick mating and unmating of signal and power interconnects in medical electromechanical instrumentation and process control applications. Non-sealed connectors are offered in 12 or 16 mm housings with 2-12 contacts 1.0-2.5 mm in dia, and rear accessory can be either rubber boot or cable clamp. Sealed connectors are available in 10,...
Read More »SerDes Devices offer throughput range of 100-600 Mbps.
Available in 5 x 5 mm QFN package, SN65LV1023A serializer and SN65LV1224B deserializer comprise 10-bit SerDes chipset designed to transmit and receive serial data over LVDS differential backplanes at equivalent parallel word clock rate from 10-66 MHz. Devices feature power consumption less than 450 mW (typ) at 66 MHz, operating temperature range of -40 to 85Ã-
Read More »Mini-ITX Motherboard is based on ATi RS400 chipset.
Supporting 800 MHz FSB and IntelÃ-® LGA775 socket, MB877 170 x 170 mm Mini-ITX motherboard has built-in Ati M10 graphic core. Features include PCI Express Gigabit LAN, 4 USB 2.0 ports, 4 serial ports, watchdog timer, 32-bit PCI expansion, and digital I/O. Paired with ULi M1573 south bridge, it provides integrated 2-port SATA RAID controller. Motherboard is suited for gaming, POS, medical,...
Read More »Multi-Chip Package combines NAND Flash and LPSDRAM.
Multi-Chip Package memory portfolio series is designed to meet needs of multimedia applications in 3G and CDMA mobile phones, and in other portable devices, where memory requirements are high and space and power are limited. Series offers memory densities up to 1-Gbit of NAND Flash with up to 512-Mbit of LPSDRAM. NAND Flash and LPSDRAM components have separate power supplies and ground lines,...
Read More »Hose System is constructed with convoluted PTFE.
Designed for use in chemical, pharmaceutical, biotech, and food processing industries, PAGE-flex(TM) System utilizes stainless steel helix wire mechanically fixed to each end fitting, providing end-to-end electrical continuity while enhancing hose stability. Available in sizes from Ã-½-4 in. ID, PAGE-flex(TM) system is offered with PTFE Flare-Seal(TM) Sanitary and PTFE Flare-Seal(TM) Swivel...
Read More »Waterproof Case is designed for HP iPaq 6500.
OtterBox 1910 provides access to sync/charge, SD Slot, headset jack, and keypad functions on iPaq 6500 and its clear window on back allows use of 6500's camera and flash through case. Conforming to IP67 and MIL SPEC 810F, case is made from injection molding process and comprised of polycarbonate shell with thermoplastic rubber overmolding for drop-protection. Its user-replaceable membrane...
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Low-Voiding Solder Paste suits fine-pitch applications.
Designed for high-volume stencil printing applications with CSP lead pitches of 0.5 and 0.4 mm, MulticoreÃ-® LF328 is formulated to deliver low voiding in BGA joints. It provides tack force sufficient to resist component movement during high-speed placement and enables print speeds with print pressure that minimizes board warpage. Classified as ROL0 to ANSI/J-STD-004, is halide-free, no-clean...
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