Aprima Medical Software, Inc

New Structural Bonding Adhesive with Viscosity of 10,000 cP

New Structural Bonding Adhesive with Viscosity of 10,000 cP

Protects EV components against shock, vibration and other damaging forces. Cures tack free in seconds upon exposure to UV/Visible light energy and LED curable at 385 nm wavelength. Ideal for shallow potting and sealing of connectors, thermal switches and sensors as well as for tamper proofing applications.

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New Structural Bonding Adhesive with Viscosity of 10,000 cP

New Structural Bonding Adhesive with Viscosity of 10,000 cP

Protects EV components against shock, vibration and other damaging forces. Cures tack free in seconds upon exposure to UV/Visible light energy and LED curable at 385 nm wavelength. Ideal for shallow potting and sealing of connectors, thermal switches and sensors as well as for tamper proofing applications.

Read More »
New RCO-6000-CFL Edge Computers With Rugged Edge Performance and Powerful Computing

New RCO-6000-CFL Edge Computers With Rugged Edge Performance and Powerful Computing

Offers Intel®’s 9th generation Core™ processors, integrated high-speed NVMe storage and eMBB connectivity. Supports rich expandability to boost wireless connectivity, streamline integration and unlock automation capabilities in harsh IoT deployments. Features fanless design, broad voltage latitude, wide operating temperature, shock and vibration tolerance and TPM 2.0 hardware security.

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New RCO-6000-CFL Edge Computers With Rugged Edge Performance and Powerful Computing

New RCO-6000-CFL Edge Computers With Rugged Edge Performance and Powerful Computing

Offers Intel®’s 9th generation Core™ processors, integrated high-speed NVMe storage and eMBB connectivity. Supports rich expandability to boost wireless connectivity, streamline integration and unlock automation capabilities in harsh IoT deployments. Features fanless design, broad voltage latitude, wide operating temperature, shock and vibration tolerance and TPM 2.0 hardware security.

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New Emissometer Performs In-Depth Analysis

New Emissometer Performs In-Depth Analysis

Designed to generate high-resolution diffuse and specular reflectance and total emissivity maps of MOCVD carriers. Displays the number of defects it detected and summarizes the number of the pocket, web and halo-region defects. Early defect detection and detects quality issues before shipping the carrier to end user.

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New Emissometer Performs In-Depth Analysis

New Emissometer Performs In-Depth Analysis

Designed to generate high-resolution diffuse and specular reflectance and total emissivity maps of MOCVD carriers. Displays the number of defects it detected and summarizes the number of the pocket, web and halo-region defects. Early defect detection and detects quality issues before shipping the carrier to end user.

Read More »

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