Aprima Medical Software, Inc

Latest Ceramic and Molded Ceramic Packages Support 5G Infrastructure
Electronic Components & Devices

Latest Ceramic and Molded Ceramic Packages Support 5G Infrastructure

Protect high-power laterally-diffused metal-oxide semiconductor (LDMOS), gallium arsenide (GaAs), silicon carbide (SiC), and gallium nitride (GaN) devices. Uses copper-molybdenum-copper (CMC) bases to dissipate heat, increasing the power output the chip achieves and enabling the device to operate at cooler temperatures. Device is mounted directly onto layer of thermally-conductive copper and...

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