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Materials & Material Processing ->
Materials ->
Composite Materials ->
Metal Matrix Composites
Metal Matrix Composites
(Showing headlines 1 - 4)
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 Pin Fin Coolers suit hybrid vehicle IGBT applications.Ceramics Process Systems
Chartley, MA 02712
Mar 03, 2008
Coolers with AlSiC (Aluminum Silicon Carbide) metal matrix composite pin fin substrates are designed for liquid-cooled, high-power module systems used in hybrid electric vehicle applications. They provide isotropic thermal expansion (8 ppm/°C) compatible with thermal expansion of IGBT die and ceramic dielectric substrates to reduce mechanically induced stresses during thermal cycling. Product also facilitates IGBT assembly by eliminating need for stress compensation layers.
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 Metal Matrix Composite enhances thermal performance.CPS Technologies Corp.
Norton, MA 02766
Nov 08, 2006
AlSiC features high stiffness to low density ratio, making it structurally suited for large parts with thin cross sections while enabling incorporation of thermal management features such as pin fins. Pins are cast during AlSiC pressure infiltration process and are targeted for microprocessor lids or liquid cooled IGBT base plates. Tailored, isotropic coefficient of thermal expansion provides compatibility with electronic assemblies, devices, and dielectric substrates.
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 Metal-Matrix Composite provides thermal management.CPS Technologies Corp.
Norton, MA 02766
Mar 13, 2006
Suited for IGBT base plates, Aluminum Silicon Carbide Composite is RoHS-compliant and features high thermal conductivity, preventing bowing and flexing of packaging and substrate material. Isotropic coefficient of thermal expansion can be adjusted for specific applications by modifying Al-metal/SiC-particulate ratio to match CTE of die or substrate. Base plates can be used in high-power traction, power control, and fly-by-wire applications.
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 Metal Matrix Composite has adjustable CTE value.CPS Technologies Corp.
Norton, MA 02766
Jul 29, 2004
AlSiC (Aluminum Silicon Carbide) enables tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies; isotropic CTE value is adjusted by modifying Al-metal/SiC-particulate ratio. Thermal conductivity of material prevents bowing and flexing of packaging and substrate material. Product is suited for housing, interconnection, and thermal management of microelectronic, optoelectronic, and power electronic devices.
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(Showing headlines 1 - 4)
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