Indium Corporation

Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019
Materials

Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019

Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process...

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Materials

Indium Corporation Wins 2007 Innovation Award

May 2, 2007 - Indium Corporation's Indium5.1AT Pb-Free Solder Paste was awarded the Innovation Award at Nepcon China in Shanghai, China. Sponsored by EM Asia Magazine, the Innovation Award recognizes excellence in the Asian electronics industry. This is the third award for Indium Corporation's Indium5.1AT Solder Paste. It was awarded the Global Technology Award in 2006 and the 2007 SMT China...

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Indium Corporation to Emphasize Reliability at Mexitrónica
Materials

Indium Corporation to Emphasize Reliability at Mexitrónica

Indium Corporation will feature their RELIABILITY program at Mexitrónica, October 10-12, 2006 in Guadalajara, Mexico. A key element of this program is the company's Indium5.1 Series of Pb-Free No-Clean Solder Pastes. According to Ray Altieri, Indium Corporation Market Manager, this series features unsurpassed print transfer efficiency through small apertures, low BGA/CSP voiding across a wide...

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Indium Corporation's NF260 Wins Third Prestigious Award

Indium Corporation's NF260 Wins Third Prestigious Award

Indium Corporation's NF260 No-Flow Underfill was awarded the 2006 EM Asia Innovation Award at Nepcon Shanghai, China. Sponsored by EM Asia Magazine, the Innovation Award recognizes, rewards, and celebrates excellence in the Asian electronics industry. Indium's NF260 No-Flow Underfill has also earned the Global Technology Award at Productronica in November 2005 and the Vision Award at APEX in...

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Indium Corporation Wins 2006 Vision Award
Adhesives & Sealants

Indium Corporation Wins 2006 Vision Award

Indium Corporation's NF260 No-Flow Underfill earned the 2006 Vision Award at the APEX show in Anaheim, CA. Sponsored by SMT Magazine, the Vision Award recognizes innovativeness, cost effectiveness, speed/throughput improvements, quality contributions, ease of use, maintainability/repairability, and environmental responsibility. This is the second award for Indium's NF260 No-Flow Underfill, having...

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Materials

Solder Flux targets Pb-free wave soldering.

Suited for soldering surface-mount, mixed-technology, and through-hole electronics assemblies, 1075-EXR is water-based and non-flammable, eliminating special storage requirements and minimizing VOC emissions. Product provides surface wetting, eliminates cleaning, and minimizes solder balling. It can also be used for Sn/Pb assemblies.

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Water-Soluble Solder Paste is lead-free.
Materials

Water-Soluble Solder Paste is lead-free.

Suited for fine-pitch applications, Indium3.1 exhibits beneficial wetting under air and nitrogen reflow atmosphere. Low-voiding, low-foaming product exhibits slump resistance and results in shiny and smooth solder joints. Stencil life virtually eliminates solder paste waste, and any residue is cleaned with water. Product comes in 500 g jars and 700 g cartridges.

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Wave Solder Flux suits Pb-free applications.
Materials

Wave Solder Flux suits Pb-free applications.

No-clean, halide-free 3592-35 provides heat stability for high temperatures required in Pb-free wave soldering of mixed-technology and through-hole electronic assemblies. Solvent-based formulation offers wide process window and minimizes solder balling. It can be used with tin/copper, tin/silver/copper, and tin/lead alloys.

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Interconnect Flux is water-soluble.
Materials

Interconnect Flux is water-soluble.

Designed for use in BGA bumping and board level attachment, WS-364 water-soluble paste-flux can be applied by pin-transfer or stencil printing. It can be cleaned using room-temperature water and offers high yield in BGA bumping process. Available in syringes or cartridges, halide-free product is suitable for Sn/Pb and Pb-free applications.

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Solder Wire is comprised of high-purity materials.
Materials

Solder Wire is comprised of high-purity materials.

Die Attach Solder Wire is manufactured from minimum of 99.9% pure materials with controlled oxide levels to facilitate wetting. It can be made to specific process or piece of equipment using advanced processes to hold to crucial diameters and tolerances for proper volume deposits. Standard packaging is available in 30-40 m spools; however custom spooling is available.

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Company News

Indium Corporation Engineers Earn SMTA Certification

Indium Corporation is proud to announce that members of its United States-based technical support team have earned SMTA certification. Two Technical Support Engineers have recently earned certification as Certified SMT Process Engineers (CSMTPE): Meagan Sloan Miloš Lazić They join a number of CSMTPE colleagues at Indium Corporation, including two fellow United States-based technical support...

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People in the News

Indium Corporation President to Speak at Workforce and Education Conference

Indium Corporation’s Ross Berntson, President and COO, will be one of the featured speakers at Jobs for the Future (JFF) Horizons virtual conference at 3 p.m. EST (2 p.m. CST), Tuesday, June 9. Drawing from his unique global manufacturing experience, Berntson will participate in the session Responding to Crisis and Preparing for the Future: Regional Manufacturing Perspectives. In this session,...

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Company News

Indium Corporation Features Metal Thermal Interface Materials for Burn-in and Test at TestConX

Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, March 1-4 in Mesa, Arizona, USA. Indium Corporation’s wide portfolio of metal-based TIMs offers proven solutions for a wide variety of applications and process challenges: Challenge: thermal conductivity. Heat dissipation is key to maintaining the longevity and reliability of devices....

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People in the News

Indium Corporation Expert to Present at SMTA Indiana Indesign Symposium

Indium Corporation’s Claire Hotvedt, Product Development Specialist, will present at the SMTA Indiana Indesign Product Engineering and Development LCC Symposium, November 19, Indianapolis, Indiana, USA. Solder alloy development is a balancing act between desirable and undesirable properties. Hotvedt’s presentation, Durafuse™ LT: Developing a Mixed-Alloy Process for Property Fusion, will...

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People in the News

Indium Corporation Expert to Present at SMTA San Diego Technical Expo

Indium Corporation expert Joe Bahou, Technical Sales Support Engineer, will share his knowledge at the SMTA San Diego Technical Expo, November 5, San Diego, Calif., USA. Voiding can cause field failures and thermal problems, and lead to customer dissatisfaction with their end product. In Avoiding the Pitfalls of Voiding in PCB Assemblies, Bahou helps attendees Avoid the Void® with an...

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Company News

Indium Corporation Expert to Present at IPC Electronics Materials Forum

Indium Corporation expert Dr. Jie Geng, Research Metallurgist, will share his knowledge at the IPC Electronics Materials Forum, November 5-7, Minneapolis, Minn., USA. Dr. Geng will present Fluxes Designed for Suppressing Non-Wet-Open during BGA Assembly, which examines the increasing severity of warpage and non-wet-open (NWO) defects during BGA assembly due to the continuing advancement of...

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Company News

Indium Corporation Expert to Present at SMTA Space Coast

Indium Corporation expert Kim Flanagan, Technical Support Engineer, will present new developments in low-temperature solder materials at SMTA Space Coast on November 20 in Melbourne, Fl., USA. From wearable electronics to rework processes, the use of low-temperature solder is expanding in the PCBA industry. Flanagan’s presentation, Understanding Reliability of Low-Temperature Solders and New...

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Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019
Materials

Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019

Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process...

Read More »
Company News

Indium Corporation Experts to Present at ICEET

Indium Corporation experts will share their knowledge at the International Conference for Electronics Enabling Technologies (ICEET), June 4-6, Markham, Ontario. Ed Briggs, Northeast Regional Sales Manager, will present Electrical Reliability for Automotive Assembly. He will discuss how the increasing amount of electronics in vehicles has escalated demands on automotive electrical systems in an...

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Company News

Indium Corporation to Host Reliability Symposium at SMTA Chapter Events

Indium Corporation, in cooperation with industry partners MicroCare and Weller, is kicking off a half-day, reliability-focused technical symposium roadshow at SMTA Carolinas’ Expo & Tech Forum, starting May 2 in Durham, North Carolina. Surface Mount Technology Association (SMTA) will host a series of these technical symposiums during which partners—global leaders in their own areas of...

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