Company News


63 Lancaster Ave., Malvern, PA, 19355, US

Share Like Tweet Add Email

Latest New Product News from

Electrical Equipment & Systems, Electronic Components & Devices

N-Channel MOSFETs save energy in soft switching topologies.

May 26, 2015

Built on superjunction technology, 600 Volt EF Series is suited for zero voltage switching/soft switching topologies such as phase-shifted bridges and LLC converter half bridges. Fast body diode N-channel power MOSFETs include 21 A Model SiHx21N60EF, 47 A Model SiHx47N60EF, and 70 A Model SiHx70N60EF with ultra-low on-resistance of 176 mΩ, 65 mΩ, and 38 mΩ, respectively. Low reverse recovery charge helps to avoid failure from shoot-through and thermal overstress. Read More

Electronic Components & Devices

Super Bright LEDs come in compact packages with dome lenses.

May 21, 2015

Utilizing ultra-bright AllnGaP on Si chip technology, VLD.1235.. series includes super red (630 nm), red (624 nm), amber (616 nm), and yellow (589 nm) LEDs in 2.3 x 2.3 x 2.8 mm, untinted, SMT packages with dome lenses. Luminous intensity ranges are 5,600–22,400 mcd for super red and 9,000–35,500 mcd for all other colors. Available in gullwing and reverse gullwing versions, LEDs withstand drive currents up to 70 mA, offer ±11° angle of half intensity, and withstand ESD voltages up to 2 kV. Read More

Electronic Components & Devices

Ultrafast Recovery Diodes minimize conduction losses.

May 18, 2015

Offered as die in wafer form, H and U Series FRED Pt® Gen 4 Ultrafast recovery diodes are optimized for high-frequency converters in power modules, motor drives, UPS, and solar or welding inverters. Designed to minimize conduction losses in medium-speed circuits, U Series features forward voltage down to 1.4 V for 600 V devices and 1.48 V for 650 V devices. H Series offers reverse recovery times down to 25 ns with forward voltages down to 1.65 V for 600 V devices and 1.74 V for 650 V devices. Read More

Electronic Components & Devices

Thick Film Chip Resistors deliver up to 500 V.

May 8, 2015

Designed with protective metal glaze on ceramic, RCV e3 Series offers high limiting element voltages of 400 V and 500 V in compact 0805 and 1206 case sizes with power ratings of 0.125 and 0.25 W, respectively. Devices offer tolerances of 1% and 5%, TCR of ±100 ppm/K and ±200 ppm/K, and resistance range from 100 kΩ to 10 MΩ. With high temperature operation up to +155°C, RoHS-compliant resistors are suitable for power supplies, battery chargers, vacuum tubes, and converters. Read More

Electronic Components & Devices

Thin Film Chip Resistor operates from -55 to +230°C.

May 6, 2015

Available in AEC-Q200 automotive-qualified 0603 case size, PLTT 0603 offers resistance range of 250 Ω to 150 kΩ, low absolute TCR down to ±5 ppm/°C, and laser-trimmed tolerances down to ±0.02%. Stable film and performance characteristics of 0.5% ppm at +175°C for 2,000 hr at 50% of rated power make device optimized for low-noise single-signal processing required to compensate for low offset and temperature drift in high-temperature automotive environments, such as exhaust sensing. Read More

Electronic Components & Devices

Thin Film Resistors offer ratio tolerances to ±0.05%.

May 4, 2015

Constructed with tantalum nitride resistor film on high-purity alumina or ceramic substrate, AORN Series features low TCR tracking of ±5 ppm/°C and long-term ratio stability of 0.015% after 1,000 hr at +155°C. AEC-Q200-qualified, dual in-line devices are available as 4 equal-value resistors ranging from 1–100 kΩ and as 2 resistor dividers in same package with ratios from 1:1 to 1:100. Housed in 8-pin SOIC package, units offer 100 mW per resistor element and are rated for ESD to 2 kV at >10 kΩ. Read More

Electronic Components & Devices

Thin Film Bar MOS Capacitor operates up to 100 V.

April 29, 2015

Available in 120 x 35 mil Case A or 240 x 35 mil Case B, Model BRCP is designed for high-power hybrid assemblies and SiC and GaN applications. Unit offers capacitance range of 5–100 pF, low TCC down to ±50 ppm/°C, and absolute tolerance down to ±5%. Operating from -55 to +150°C, capacitor is optimized for LC, RC, or LRC filters; RF choking; and DC blocking and impedance matching. For these applications, BRCP can accommodate 7 bonds for Case A and 15 bonds for Case B. Read More

Electronic Components & Devices

Thick Film Chip Resistors feature long side terminations.

April 24, 2015

Available in 0612 and 1020 case sizes, Models RCWE0612 and RCWE1020 provide power ratings to 1 W and 2 W, respectively. AEC-Q200-qualified, surface-mount, wraparound chip resistors offer low resistance values from 0.01–0.976 Ω, tolerance down to ±1%, and TCR of ±100 ppm/°C, ±200 ppm/°C, and ±300 ppm/°C. Devices are optimized as current sensing resistors and shunts in DC/DC converters, voltage regulation modules, and inverters in cell phones, computers, air conditioners, and heat pumps. Read More

Electronic Components & Devices

Snap-In Power Aluminum Capacitors come in cases down to 20 x 25mm.

April 23, 2015

Supplied in cylindrical aluminum case with pressure relief valve, insulated with blue PET sleeve, miniaturized 256 PMG-SI series offer capacitance from 820–47,000 µF, operating range of -40 to +105°C, and useful life of 2,000 hr at +105°C. There are 17 case sizes ranging from 20 x 25 mm to 35 x 45 mm, voltages vary from 16–100 V, and ripple current is rated to 4.85 A. These polarized aluminum electrolytic capacitors with non-solid electrolyte also feature ESR down to 14 mΩ. Read More

Electronic Components & Devices

Fast Recovery Rectifiers feature low-profile design.

April 17, 2015

Housed in low-profile SMPD package measuring less than 1.7 mm in height, 10–30 A FRED Pt® Hyperfast and Ultrafast Recovery Rectifiers minimize switching losses and over-dissipation in automotive and telecom applications while providing high-density alternative to TO-263 package. Devices offer reverse voltages of 200 and 600 V, reverse recovery time down to 25 ns, and typical forward voltage drop down to 0.75 V in single- and dual-die configurations. Read More

Electronic Components & Devices, Vision Systems

IR Emitters reduce component count while increasing intensity.

April 15, 2015

Comprising one leaded 5 mm IR emitter with parabolic lens and 8 SMD devices in 0805, PLCC-2, top-looking and side-looking packages, high-speed 940 nm IR emitters employ SurfLight™ surface emitter chip technology. Emission of nearly all light and power from top of chip results in radiant intensity ratings up to 600 mW/sr (leaded) or 10–120 mW/sr (SMD). Respectively, angles of half intensity for leaded and SMD devices are ±3° and ±9° to ±60°. Rise and fall times are 10 nsec. Read More

Sensors, Monitors & Transducers

NTC Thermistor Dies offer gold and silver metallizations.

April 9, 2015

Featuring gold metallization, Model NTCC300E4 supports gold wire bonding and conductive adhesive gluing, while Model NTCC200E4 with silver metallization supports aluminum wire bonding and is compatible with reflow soldering and nano-silver paste sintering. RoHS-compliant thermistors offer resistance at +25°C from 4.7 kΩ to 20 kΩ, with tolerance down to ±1%. Packaged in conductive PS blister tape, devices provide high stability from -55 to +175°C, with drift of <3% after 1,000 hr. Read More

Electronic Components & Devices

Solid Tantalum SMD Molded Chip Capacitors conserve PCB space.

April 3, 2015

While TMCJ and TMCP are respectively offered in J (1608-09) and P (2012-12) case sizes, TMCU comes in UA (3216-12) and UB (3528-12) package options. Each package conserves PCB space and offers profile that optimizes mounting on mezzanine cards. RoHS-compliant products offer capacitance values from 0.1–220 µF, with tolerances down to ±10%, over 2.5–25 Vdc range and operate from -55 to +125°C with voltage derating above +85°C. Lead (Pb)-free terminations are standard. Read More

Electronic Components & Devices

Compact Power MOSFET is designed for automotive applications.

April 1, 2015

Offering alternative to D²PAK and DPAK devices used in automotive applications, AEC-Q101-qualified SQJQ402E comes in 100% lead (Pb)-free, 8 x 8 x 1.8 mm PowerPAK® 8x8L package featuring gull-wing leads for mechanical stress relief. This 40 V TrenchFET® power MOSFET, operating to +175°C, features internal construction that minimizes inductance and enables max on-resistance of 1.5 mΩ at 10 V (1.8 mΩ at 4.5 V). Continuous drain current capability is rated up to 200 A. Read More

Electronic Components & Devices, Electrical Equipment & Systems

BiSy Single-Line ESD Protection Diode conserves board space.

March 26, 2015

Supplied in 0.6 x 0.3 x 0.27 mm package, VBUS05B1-SD0 protects high-speed data lines and antennas in mobile devices against transient voltage signals. Leads length and package size minimizes inductance, allowing fast transients, such as an ESD strike, to be clamped with minimal overshoot/undershoot. Properties include 0.29 pF typ load capacitance (0.4 pF max), <0.1 µA max leakage current at 5.5 V working voltage, 8.8 V typ breakdown voltage at 1 mA, and 18 V max clamping voltage at 2.5 A. Read More

Electronic Components & Devices

Wet Tantalum Capacitor is approved to DLA 15005.

March 25, 2015

Featuring glass-to-tantalum hermetic seal, Model DLA 15005 is approved to Defense Logistics Agency drawing 15005. Electrolytic capacitor combines reverse voltage of 1.5 V at +85°C with optimized vibration capability and thermal shock of 300 cycles. Device operates from -55 to +85°C with current voltage of 75 V and capacitance of 1,000 µF. Offered in axial T4 case size, capacitor is optimized for timing, filtering, energy hold-up, and pulse power applications in space and avionics equipment. Read More

Electronic Components & Devices

MOSFET extends battery usage in ultraportable applications.

March 19, 2015

Offered in chipscale MICRO FOOT® package with 1 mm² footprint, Si8410DB TrenchFET® 20 V n-channel MOSFET is optimized for use as load switch, small-signal switch, and high-speed switch in power management applications. Device features low on-resistance of 37 mΩ at 4.5 V, 41 mΩ at 2.5 V, 47 mΩ at 1.8 V, and 68 mΩ at 1.5 V. With ratings down to 1.5 V and ±8 V VGS, MOSFET extends battery usage in wearable devices, smartphones, tablets, and solid-state drives. Read More

Electronic Components & Devices

SMD MLCCs target automotive applications.

March 13, 2015

Available with C0G (NP0), X7R, and X8R dielectrics in 6 body sizes ranging from 0402–1812, Series VJ....31X operates up to +150°C. Devices with C0G (NP0) dielectric offer voltages to 3,000 Vdc with capacitance down to 1 pF, while  X7R and X8R devices provide higher capacitance to 1.0 µF and voltages to 1,000 Vdc. Qualified according to AEC-Q200 with PPAP available on request, RoHS-compliant capacitors are optimized for automotive powertrain, chassis, lighting, and comfort electronics. Read More

Materials & Material Processing

Custom Thin Film Substrate support sidewall patterning.

March 4, 2015

Increasing design flexibility and density for equipment miniaturization, SDWP substrates accommodate die attach or wire bonding on side walls as well as top side. This lets designers provide continuity between top and bottom of die, connect wire bonds to traces on side of die, or make contact with side of die with pin. SDWP substrates feature plate thickness of ≤0.025 in., min line width and gap of ≥0.003 in., and tight line width and gap tolerances down to ±0.001 in. Read More

Sensors, Monitors & Transducers, Test & Measuring Instruments

Integrated UV Light Sensor features Filtron(TM) UV technology.

March 2, 2015

Incorporating photo-pin-diode (280–400 nm spectral sensitivity, 355 nm peak sensitivity wavelength) and signal processing IC in 2.35 x 1.8 x 1.0 mm SMT package, VEML6070 employs Filtron™ UV technology and converts solar UV light intensity into digital data. I²C bus interface simplifies operation, and refresh rate setting simplifies designs by eliminating need for external RC low pass filter. Temperature-compensated sensor also provides fluorescent light flicker immunity. Read More

Other Company News from