Company News

Epoxies Etc.

21 Starline Way, Cranston, RI, 02921, USA

  • 800-EPOXIES

Latest New Product News from
Epoxies Etc.

Adhesives & Sealants, Materials & Material Processing, Paints & Coatings

40-3907 Epoxy Resin provides resistance to chemicals.

November 23, 2016

Ideal for bonding and sealing applications that cannot utilize heat to cure the adhesive, 40-3907 Epoxy Resins are electrically conductive room temperature curing adhesives. Used as repair material for electrical traces, device includes thin film set time of ninety minutes at room temperature and within six hours is close to full hardness (Shore D 78). Film is used for applications like solder... Read More

Materials & Material Processing

Silicone Potting Compound features lightweight formulation.

October 26, 2016

Utilizing advanced micro balloon technology fillers, 20-1634 Light Weight Silicone Potting Compound features specific gravity of 0.82, making it suited for applications that require low weight, flexibility, high heat resistance, and optimized electrical insulation properties. Two-component silicon elastomer features Shore A hardness of 34 and tensile strength of 125 psi. Formulated without... Read More

Materials & Material Processing

UL 94 V-0 Potting/Encapsulating Compounds suit harsh environments.

September 20, 2016

Epoxy and urethane products that meet engineering design demands of electronic and aerospace assemblies include 20-2362 FR low-durometer, low-viscosity urethane as well as 50-2369 FR thermally conductive and thermal shock-resistant urethane. Suited for similar applications, 50-3150 FR thermally conductive epoxy can provide an RTI rating of 130°C with Cat 30, while 50-3152 FR thermally... Read More

Materials & Material Processing

Polyurethane Potting Compound cures in 1 hour.

April 22, 2016

Designed to cure within 1 hour at room temperature, 20-2183 features 2:1 mix ratio and low viscosity that makes it suitable for use in cable assemblies, potting electronics, molding parts, and encapsulating electronic components. Tough elastomeric material helps assemblies withstand thermal cycling, offers vibration resistance, and imparts low stress on electronic components during cure.... Read More

Adhesives & Sealants, Materials & Material Processing, Paints & Coatings

Epoxy Potting Compound resists thermal shock and cycling.

January 19, 2016

Passing Navy Hex Bar Test, MIL-I-16923C, which consists of 10 cycles from -55 to +155°C, two-part epoxy resin 20-3301 protects electronic assemblies from thermal cycling and shock. Low viscosity epoxy flows quickly around components, giving users working time of 4–6 hr. Product is typically cured at 80°C for 1–2 hr, but post cure of 150°C for 3 hr will optimize performance... Read More

Adhesives & Sealants, Materials & Material Processing

Epoxy Potting Compound resists high temperatures.

March 27, 2015

With 130°C relative temperature index rating, 50-3150RFR Black Epoxy with Catalyst 30 will survive elevated temperatures for long periods of time, which offers benefits as electronics get smaller and hotter. Compound is UL 746B listed and formulated to meet stringent non-burning requirements of UL 94 V-0. Typical applications include encapsulating power supplies, transformers, coils,... Read More

Adhesives & Sealants

Fast Cure Adhesives suit cartridge dispensing.

February 4, 2015

Suitable for use with TriggerBond® dispensing guns, TriggerBond Epoxies offer shear strength up to 1,500 psi and notched Izod impact of 2.7 ft-lb/in. Adhesive's 2 components are packaged into cartridges, which fit in dual-barrel dispensing gun. Because cartridges contain precise quantities of hardener and resin, TriggerBond produces correct mix ratio every time user squeezes trigger.... Read More

Green & Clean, Materials & Material Processing

Polyurethane Potting Compound is environmentally friendly.

October 20, 2014

Intended for electronic applications with low toxicity requirements, 20-2121 Polyurethane is made from natural oil polyol, meets FDA food contact requirements, and does not contain TDI, MbOCA, or Mercury. Plant-based potting, casting, and encapsulating compound, exhibiting minimal shrinkage or exotherm, offers elastomeric properties that limit stress on electronics. Tensile strength is 2,000... Read More

Chemicals & Chemical Processing, Green & Clean, Paints & Coatings

Casting Resin is suitable for cable and harness assemblies.

March 12, 2013

Offering alternative to injection molds when encapsulating electronics, 20-2180 Polyurethane Potting and Encapsulating Resin can be poured into metal or silicone mold to create assembly with firm seal around jacketed wires. Rubber-like texture makes it suited for outdoor applications. Resistant to moisture and chemicals, stable and vibration-resistant product has 2:1 mix ratio, self-levels... Read More

Materials & Material Processing

Silicone Compound helps make strong, durable molds.

December 26, 2012

Formulated without solvents or other toxic materials, 70-1300 RTV Silicone Elastomer does not shrink during cure, is resistant to chemicals, and cannot be regulated or considered hazardous for transportation. Clear color helps user increase mold production precision, while strength and chemical resistance lend to molds that allow for increased number of pours. Read More

Materials & Material Processing

Silicone Elastomer suits potting and encapsulating.

November 26, 2012

Providing protection in extreme environmental conditions, 2-component 20-1634 is suitable for potting electronic assemblies and other industrial applications requiring low weight, flexibility, heat resistance, and optimized electrical insulation properties. Product cures in deep sections, eliminating need for multiple pours. Formulated without solvents or other toxic materials, compound is safe... Read More

Materials & Material Processing

Thermally Conductive Silicone protects electronics.

October 18, 2012

With 1:1 mix ratio, flexible 50-1952 cushions electronics from vibration and impact, and is specially formulated for quick thermal transfer away from heat generating electronic devices. Non-corrosive silicone potting and encapsulating compound is made without use of harsh solvents or other toxic materials and is not hazardous to ship. Operating from -65 to +235°C, low-exotherm... Read More

Chemicals & Chemical Processing, Materials & Material Processing

Silicone Compound is designed for potting and encapsulating.

September 28, 2012

Free of any flammable or toxic solvents, 2-part 50-1225 has -65 to +210°C service temperature, will cure in deep sections, and will not support or promote flame. Compound is designed for electronic packages that require flow around components, thermal conductivity, and ability to sustain environmental extremes. While material flexibility will cushion electronics through aging and thermal... Read More

Chemicals & Chemical Processing, Materials & Material Processing, Paints & Coatings

Potting Compound is quick, convenient and easy to use.

August 22, 2012

Used for potting and encapsulating, 20-2028 lightweight (11 lb/ft³) closed cell liquid urethane foaming resin system has 1:1 mix ratio and 10 min demolding time. This potting foam does not utilize MOCA or TDI, promoting safe use, while low density facilitates repairs if mistakes are made first time around. Resistant to chemical solvents, moisture, thermal shock, and impact, product is... Read More

Adhesives & Sealants

One-Component Epoxy maintains properties over temperature range.

August 14, 2012

Able to withstand stretching, impact, and heating/cooling, 50-3122 is formulated to maintain optimal peel and shear strength over -60 to +205°C range. This 100% solids system, in addition to offering electrical insulation, is resistant to vibration, stress fatigue cracking, and chemicals. Product does not require any mixing and cures in 5 min to 2 hr depending on cure temperature. Areas of use... Read More

Adhesives & Sealants

Epoxy Adhesive withstands exposure to UV rays.

March 30, 2012

Virtually invisible, type 10-3713, 2-component epoxy adhesive dries clear so excess material is barely noticeable. Formulated with agents that guard against UV rays, non-yellowing epoxy has low viscosity that allows for good coverage of all surfaces, and bonds to most substrates. It penetrates substrates to form bonds at room temperature or with mild heat. Read More

Adhesives & Sealants

Low-Viscosity Epoxy Adhesives offer fast set times.

March 1, 2012

Setting in 5, 20, and 46 min, respectively, Quick-Set Trio (10-3005, 10-3020, and 10-3046) cure at room temperature. Clear and solvent-free products are suited for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, rubbers, plastics, and more. Offered in TriggerBond dual barrel cartridge system or bulk packaging, products meet UL94 HB requirements; resist effects of... Read More

Materials & Material Processing

Flame Retardant Potting Compound stays flexible in cold temps.

January 2, 2012

Designed to meet UL 94 V-0 flammability standard, 20-2362 FR remains soft in very low temperatures down to -72°C. Polyurethane potting and encapsulating compound is suited for cushioning and protecting sensitive electronic components since it provides vibration resistance and does not stress components. Compliant with REACH and RoHS, product is also moisture-resistant and will not damage... Read More

Adhesives & Sealants

Polyurethane Adhesives bond plastic and metal substrates.

August 1, 2011

Featuring flexible formulation that allows bonding to substrates with different coefficients of thermal expansion, High Viscosity 10-2055 and 10-2055 HV Polyurethane Adhesives produce semi-flexible bond with resulting durometer of 55 Shore D, while 10-2080 and 10-2080 HV produce semi-rigid bond with durometer of 80 Shore D. Iso and Poloyol components are low in viscosity for handling and only... Read More

Materials & Material Processing

Epoxy Potting Compound meets NASA's outgassing requirements.

May 31, 2011

Suited for casting, potting, and encapsulating, 20-3652 adheres to metals, ceramics, and plastics. Dielectric grade epoxy features Shore D hardness of 88, tensile strength of 9,000 psi, flexural strength of 15,000 psi, and operating temperature range of -65 to +160°C. When cured with Catalyst No. 190 and Catalyst No. 105, resin system meets NASA's outgassing requirements. Read More

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Epoxies Etc.