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Advanced Thermal Solutions, Inc.
Designed to protect components from excess heat, Zipper Fin Heat Sinks have zipper fins machined from thin sheet metal, typically aluminum or copper, formed into custom shapes. Sheets are designed to interlock with very narrow space between layers. Fin assembly is wave soldered to metal base forming very rigid, lightweight heat sink. To contain and optimize cooling airflow, heat sinks can be designed with integral ducts. Read More
Portable chiller systems, with cooling capacities up to 600 W, allow precise temperature control of recirculating coolants as regulated by thermoelectric module or PID control. For fluid baths, ATS-CHILL iM immersion chiller controls fluid temperature via immersible evaporator. Liquid-to-air heat exchangers offer metal fin density that maximizes heat transfer from liquid to air and optimizes liquid cooling capability. Products come in various sizes and heat transfer capacities up to 250 W.
Used for transporting power dissipation away from hot electronic components, ATS copper heat pipes are available in 33 round and flat profile versions. Products transfer component heat to heat sinks with minimal temperature difference while also distributing heat efficiently across length of heat spreaders. Shaped by hand or machine to meet application needs, all heat pipes can be friction fit, clamped, soldered, or adhesively attached and are effective in temperatures from 30–120°C.
Optionally available with hands-free tripod or blade mount stand, ATS-0345 vane anemometer provides precise measurements for automotive, aerospace and HVAC studies; fume hoods; air ducts; wind tunnels; and marine applications. Unit can determine air speed values from 0.3–45 m/s, with accuracy to 0.1 m/s or 3%, while air temperatures can be measured from 32 to 140°F with accuracy of ±2.7°F. Powered by 9 V battery, portable unit has LED display and powers off when inactive.
Preloaded with IQstage™ DAQ software, iQ-200™ measures temperatures of solid materials and surrounding air from -40 to 750°C while also tracking air velocity from 0–1,200 fp (standard) or 0–10,000 fpm (custom) and air pressure (0–0.15 psi). Measurements are taken simultaneously at multiple points to accurately profile heat sinks, PCBs, and card racks for testing and characterization. Instrument connects via USB to PC for data management, storage, and sharing. Read More
Equipped with solid-state color camera, ethermVIEW™ System provides macroscopic inspection of boards and components coated with heat-sensitive liquid crystals, which reflect incident light at visible wavelengths based on surface temperatures where they are applied. Camera captures reactive TLC colors to reveal hot spots and defects for effective thermal management. Linking to PC via Firewire, system includes thermSOFT software for image processing and management. Read More
Comprising 32 heat sinks for convection cooling of high heat flux LEDs, Star series is made from aluminum and has round profile. Cooling fins, arrayed in round, star-like cross section, optimize thermal performance in local air flow. Depending on model, cooling performance reaches more than 60 K (∆Ths-ambient) at 50.0 W of power dissipation. Flat base at one end allows secure, direct mounting of LEDs, while integral threads on base perimeter allow attachment of brackets and other hardware. Read More
Supporting fans and fan trays up to 30 A, FSC-200 Fan Speed Controller provides precise management of fan speeds during thermal management studies of electronic devices. Unit comes with ATS stageSPEED software, which allows use of PC to incrementally control speed from 0–100% of max power. Communicating with PC via USB connection, FSC-200 controls fans and fan trays with 0.5% resolution and provides ±1% data accuracy. Read More
Producing air flows up to 1,000 fpm, Model CLWT-115 provides system for thermally characterizing PCBs, heat sinks, and components at controlled temperatures from ambient to 185°F. Clear Lexan test section, measuring 30.5 x 10.2 x 4.55 in., provides continuous view of test specimens, as well as flow visualization studies. Chamber can be accessed from top or sides for mounting and repositioning components. Six ports on side walls are provided for temperature and velocity sensors. Read More
Used for characterizing thermal conditions in electronic systems, MS 1000-CS-WC is calibrated for natural convection as well as high velocity flows and has plastic base that eliminates potential shorting issues. Candlestick-shaped profile minimizes disturbance of heat flow in test domain, while plastic-sleeved stem facilitates installation and repositioning during testing process. Product is capable of measuring temperature from -30 to +150°C ±1°C and velocity from 0-10,000 fpm ±2%. Read More
With integral push pin mounting system, maxiFLOW(TM) heat sinks offer accelerated, safe attachment onto BGAs and other hot components. Each heat sink comes with one pair of plastic or brass push pins that run through opposite corners of heat sinks and mount securely into 3.00 mm holes in PCB as laid out in industry standard patterns. While integral spring on each pin provides ~2 lb of retention load, low-profile spread fin array maximizes surface area for effective convection cooling. Read More
Used to profile heat sinks, components, and PCBs, iQ-200(TM) simultaneously measures temperatures for solid materials and surrounding air in addition to tracking air velocity and air pressure at multiple points. Laboratory instrument accommodates inputs from up to 12 J-type thermocouples, 16 air temperature/velocity sensors, and 4 DP sensors. USB interface allows PC-based data management, storage, and sharing, while software manages incoming data and provides graphic presentation. Read More
Comprised of benchtop laboratory-grade wind tunnel, automated controller, and multiple sensors, iTHERM-100(TM) Test Station precisely manages velocity and direction of airflow within test environment. System can be used for categorizing airflow and measuring pressure drop across heat sinks and over other PCB components. With attached thermocouple, iTHERM-100 is also suited for individual thermal management studies on CPUs and other hot components. Read More
Featuring spread fin array that maximizes surface area for effective convection cooling, maxiFLOW(TM) heat sinks cool ICs and other hot components in narrow packaging and low airflow velocity conditions. Standard heights are as low as 9.5 mm, and extruded aluminum fabrication minimizes thermal resistance from base to fins. Pre-assembled with ATS maxiGRIP(TM) mounting hardware, sinks meet requirements for Telcordia GR-63-Core, ETSI 300 019, and MIL-STD-810. Read More
Made from black anodized, extruded aluminum, Models ATS-590 and ATS-619 RoHS compliant heat sinks maintain component case temperature at or below manufacturer's thermal specifications. Model ATS-590 measures 9.5 x 25 x 25 mm, has thermal resistance of 8.42°C/W at its base in air velocity of 200 ft/min. Measuring 22 x 24 x 16.25 mm, ATS-619 has thermal resistance of 6.11°C/W, and employs maxiGRIP(TM) attachment solution with plastic frame clip that snaps securely around chip. Read More
Able to operate on any axis, BWT-104(TM) is designed for thermal characterization of components, circuit boards, and cooling devices. Polynomial shape and internal flow management system includes honeycombs and screens to break up turbulence, providing uniform, homogeneous flow up to 1,200 fpm as generated by 3 independently selectable 24 Vdc fans. While aluminum and Plexiglas® construction permits clear view of test section, 12 ports facilitate probe insertion. Read More
Designed for Freescale Semiconductor's MPC8349E PowerQUICC II Pro processors, Model ATS-552 helps ensure that junction temperatures do not exceed maximum specified value. Unit's thermal resistance is 2.7°C/W at its base in air velocity of 200 fpm. Made from black anodized aluminum, heat sink features 14 integral linear fins, 0.5 mm thick, to maximize cooling surfaces in local airflow. Unit is preassembled with ATS maxiGRIP(TM) mounting system. Read More
Fabricated from extruded aluminum, models ATS-486, ATS-503, and ATS-504 mitigate intensity of heat generated by high-output LEDs and ensure maintenance-free service life. These maxiFLOW(TM) heat sinks feature low-profile, spread fin array that maximizes surface area for effective convection cooling, particularly when air flow is limited. Available un-anodized or black anodized, with thermal tape or without, products have been tested on OSRAM's DRAGONstick® LEDs. Read More
Featuring integral fan that blows air through linear field of flat aluminum fins, Juneau ATS-405 Active Heat Sink delivers thermal resistance of 0.51°C/W with thermal grease. Developed to cool Freescale processors in restricted height enclosures, Anchorage ATS-474 Passive Heat Sink features maxiFLOW(TM) angled fin technology with thermal resistance of 1.05°C/W in air velocity of 100 lfm and 0.49°C/W in air velocity of 400 lfm. Read More
Measuring 9 mm in height, Model EX2 is suited for use inside enclosures where space is limited. Case-to-ambient thermal resistance is 1.8°C/W within air velocity of 600 fpm. Unit can be securely attached to component with double-sided, thermally conductive adhesive tape. No mechanical hardware is required. Read More
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