Multi-Purpose DSP targets compute-intensive SoC designs.
With Xtensa instruction-set architecture, quad 32-bit integer MACs, and quad single-precision 32-bit floating-point MACs, Cadence-® Tensilica® Fusion G3 Digital Signal Processor supports compute-intensive applications including radar, imaging, and mid- to high-end audio pre/post-processing. Unit offers comprehensive data-type support with auto-vectorization. DSP provides real-time control...
Read More »Multi-Purpose DSP targets compute-intensive SoC designs.
With Xtensa instruction-set architecture, quad 32-bit integer MACs, and quad single-precision 32-bit floating-point MACs, CadenceÃ-® Tensilicaî Fusion G3 Digital Signal Processor supports compute-intensive applications including radar, imaging, and mid- to high-end audio pre/post-processing. Unit offers comprehensive data-type support with auto-vectorization. DSP provides real-time...
Read More »Media Alert: Cadence to Showcase Multi-Purpose, Low-Power DSP at Linley Mobile & Wearables Conference 2016
SAN JOSE, Calif. - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that David Heine, senior design engineering architect, is scheduled to present a paper on multi-purpose, low-power DSPs for mobile and other markets at the Linley Mobile Wearables Conference on July 27, at the Hyatt Regency in Santa Clara, CA. The two-day conference runs July 26-27. WHAT: David Heine is scheduled to...
Read More »Media Alert: Cadence to Showcase Multi-Purpose, Low-Power DSP at Linley Mobile & Wearables Conference 2016
SAN JOSE, Calif. - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that David Heine, senior design engineering architect, is scheduled to present a paper on multi-purpose, low-power DSPs for mobile and other markets at the Linley Mobile Wearables Conference on July 27, at the Hyatt Regency in Santa Clara, CA. The two-day conference runs July 26-27. WHAT: David Heine is scheduled to...
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How Is Expanded Metal Foil Made?
Expanded metal foil is a lightweight coil of metal that has been slit and stretched to create a uniform mesh pattern of openings.
Read More »Multicore Processors optimize audio system applications.
Using 2 SHARC+ cores and advanced DSP accelerators, ADSP-SC57x/ADSP-2157x Processors deliver greater than 6 giga-floating-point operations/second. Combination of SHARC technology with ARM-® Cortex-A5 system control capability provides solution for complex applications such as Dolby Atmos®, DTS:X®, or active noise cancellation with headroom remaining for further audio post-processing....
Read More »Multicore Processors optimize audio system applications.
Using 2 SHARC+ cores and advanced DSP accelerators, ADSP-SC57x/ADSP-2157x Processors deliver greater than 6 giga-floating-point operations/second. Combination of SHARC technology with ARMÃ-® Cortex-A5 system control capability provides solution for complex applications such as Dolby Atmosî, DTS:Xî, or active noise cancellation with headroom remaining for further audio...
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COM Express Module supports Intel Celeron N3xxx processors.
Allowing OEMs to upgrade products while using existing carrier board, MB-73450 has Type 6 pin-outs and supports dual- and quad-core SoC processors, including Intel-® Celeron® and Pentium® N3000 series (4–10 W), as well as Intel Atom® quad-core x5-E8000 CPUs with turbo-boost frequencies from 2.0–2.56 GHz. Other features include up to 8 GB non-ECC dual-channel DDR3L, support for up...
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COM Express Module supports Intel Celeron N3xxx processors.
Allowing OEMs to upgrade products while using existing carrier board, MB-73450 has Type 6 pin-outs and supports dual- and quad-core SoC processors, including IntelÃ-® Celeronî and Pentiumî N3000àseries (4–10 W), as well as Intel Atomî quad-core x5-E8000 CPUs with turbo-boost frequencies from 2.0–2.56 GHz. Other features include up to 8 GB non-ECC dual-channel...
Read More »Inuitive Selects CEVA-XM4 Intelligent Vision DSP for Next Generation 3D Computer Vision SoC
NU4000 multi-purpose SoC brings ultra-low power computer vision capabilities to augmented reality and virtual reality devices, drones, robotics and more MOUNTAIN VIEW, Calif., - May 31, 2016 - CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that Inuitive, a developer of cutting edge depth sensing, computer vision and image...
Read More »Inuitive Selects CEVA-XM4 Intelligent Vision DSP for Next Generation 3D Computer Vision SoC
NU4000 multi-purpose SoC brings ultra-low power computer vision capabilities to augmented reality and virtual reality devices, drones, robotics and more MOUNTAIN VIEW, Calif., - May 31, 2016 - CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that Inuitive, a developer of cutting edge depth sensing, computer vision and image...
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High or Low Volume Custom Crates and Boxes Available from Reid Packaging
Reid provides mil-spec crates and corrugated boxes in custom dimensions from single to triple wall and will even package them on-site. Check out the video to learn more.
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