Interconnect Devices target Cloud Computing marketplace.
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Press Release Summary:
Q:Active® Cloud Interconnect(TM) ICs deliver 10 Gbps SFP+ and 40 Gbps QSFP throughput in single CMOS devices for use in copper cables, blade servers, switch fabrics and line cards. Each device supports 10 G Ethernet, Infiniband, FibreChannel, SAS, and PCI Express link protocols. Enabling SFP+ interconnects to run 10 m on 32 ga copper twinax, and 25 m on typical 24 ga twinax, analog ICs remove skew, attenuation, group delay, and crosstalk inside cable interconnect.
Original Press Release:
Quellan Announces Cloud Computing Interconnect Products
New Chips and Modules enable Active Copper Interconnects that are lower cost, thinner, lighter and lower power than equivalent fiber optic alternatives
AUSTIN, TEXAS - Supercomputing 2008 (SC08) - November 18, 2008 - Quellan, Inc. a leader in Analog Signal Processing and RF Noise Cancellation ICs, today announced the availability of Q:Active® Cloud Interconnect(TM), a semiconductor product line for the rapidly growing Cloud Computing marketplace.
Q:Active Cloud Interconnect is a complete product line to interconnect servers, storage devices and switches based on the industry's smallest, lowest power and highest density Integrated Circuits. These IC's deliver 10Gbps SFP+ and 40Gbps QSFP throughput in single CMOS devices for use in Active Copper Cables, blade servers, switch fabrics and line cards. The QLx111GTx and QLx111GRx achieve 10Gbps Transmit and Receive functionality respectively in just a 3x3mm package, while the QLx411GTx and QLx411GRx perform similar Transmit and Receive functions at 40Gbps in a compact 7x4mm footprint. Each Quellan device is capable of supporting 10G Ethernet, Infiniband, FibreChannel, SAS and PCI Express link protocols.
These devices dramatically improve performance by removing impairments such as skew, attenuation, group delay and crosstalk inside the cable interconnect and are entirely analog for ultra low power consumption and the smallest possible footprint. They enable SFP+ interconnects to run 10 meters on 32 gauge copper twinax, which at just 2mm in diameter is 75% thinner than fiber optic alternatives and lighter in weight. On typical 24 gauge twinax these chips extend SFP+ interconnects to reach 25 meters - allowing data centers to interconnect clusters without the hefty power consumption and cost of fiber optic lasers and receivers.
"It's very important strategically for the big computer makers to get in this (Cloud Computing) market," said Susan Eustis, president of WinterGreen Research, a technology research firm. "It's just emerging, but it's going to be a huge multibillion-dollar business three or four years from now."
IDC forecasts world-wide spending on new server, management and power/cooling infrastructure to reach $250 Billion in 2011, up from $150 Billion in 2004. According to Dataquest, there are now 7,000 major data centers up and running and many more being built out. Quellan chips are currently embedded in cables, switches and supercomputers in these data centers - a single switch can utilize up to 30,000 channels of Q:Active technology.
To accelerate time to market Quellan's QLx1000M and QLx4000M modules deliver a turnkey subsystem that seamlessly integrates the Company's Q:Active IC's into existing SFP+ and QSFP connectors so manufacturers can quickly deliver ultra-thin, low power lightweight interconnects.These products provide the highest level of signal integrity and noise immunity in a ready to integrate form factor.
"Clearly this is a breakthrough for Data Center interconnects at a time that's right," said Ken Fleck of Fleck Research and veteran of the interconnect industry. "The approach Quellan is taking and the technology and its benefits are impressive."
OEM's profit by working with Quellan's Q:Active Cloud Interconnect program which provides cable OEMs with the benefits of analysis, development and benchmarking to accelerate time to market. The program also provides system OEM's with reference cables for system evaluation and performance benchmarking.
"Quellan's Q:Active technology provides a seamless method for increasing reach and interconnect density," said Eric Gaver of W.L. Gore and Associates. "Our active cables are now sampling and we plan to continue to innovate with this technology going forward."
"Cloud Computing requires extensive high speed distribution of compute power and therefore puts pressure on system interconnects," said Tony Stelliga, CEO of Quellan. "Q:Active meets the challenge by embedding active analog silicon in the connectors to yield copper interconnects that are thinner, lighter, lower power and less expensive than fiber optic equivalents."
About Quellan
QUELLAN, INC., headquartered in Santa Clara, California, designs and markets analog integrated circuits that dramatically enhance the performance of system interconnects and radio frequency receivers. Quellan chips are embedded in connectors, receiver modules and handheld mobile devices to improve speed, density and reception quality. The company's patented Collaborative Signal Processing products perform adaptive noise cancellation and equalization with an entirely analog signal path for ultra low power. Quellan serves a broad range of applications in the computing, storage, consumer and wireless markets.
