Starter Kit facilitates FPGA-based application evaluation.
Supplied with necessary hardware, software tools, evaluation board, power supply, reference designs, and accessories, Spartan(TM)-3AN Starter Kit provides out-of-the-box functionality for prototyping high-volume non-volatile applications requiring higher system integration or security. Board features 700K system gate FPGA and is equipped with subsystems such as 10/100 Ethernet PHY, DDR2 SDRAM,...
Read More »Starter Kit adds wireless connectivity to applications.
With Starter Kit, developers with little or no RF design experience can add IEEE802.15.5 and ZigBee wireless connectivity to their products. Three hardware nodes, based on JN5139 wireless microcontroller modules, allow users to evaluate and develop wireless sensor network applications. Serial API can be used, either embedded with application or via serial or SPI ports to external microcontroller....
Read More »IP Phone Platform speeds development of low-end phones.
Powered by DSP core, Model TNETV2502 includes silicon, software, and complete reference design, offering manufacturers tools needed to develop IP phones. Power-over-Ethernet technology allows phone to be powered directly from standard Ethernet cable instead of ac power supply. Targeting small and medium enterprises, TNETV2502-based IP phones typically offer 1 voice port, which is 1 channel of...
Read More »CorEdge Networks and Fujitsu Demonstrate Industry's First 10GbE MicroTCA Implementation at the MicroTCA Summit, May 30 to June 1, Baltimore, at Booth #29
BOSTON and SUNNYVALE, Calif., May 25 // -- CorEdge Networks and Fujitsu Microelectronics America, Inc. (FMA) have collaborated to develop the industry's first 10GbE MicroTCA demonstration. It will be shown at the MicroTCA Summit in Baltimore, Maryland, between May 30th and June 1st. The demonstration is housed in CorEdge's 2U PicoTCA system, a 3.5" x 13" x 8.5" (H x W x D) platform, which...
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6 Engineering & High-Performance Plastics Used for Machined Components
This resource breaks down six of the most commonly used high-performance plastics, properties and common applications, and questions to ask during material selection.
Read More »Xilinx Simplifies Memory Interface Designs with New Complete FPGA Solutions
SAN JOSE, Calif., May 29 /- Xilinx, Inc. (NASDAQ:XLNX), the world's leading supplier of programmable solutions, today announced immediate availability of its low cost Spartan(TM)-3A FPGA development kit for DDR2 SDRAM interfaces, the Virtex(TM)-5 FPGA development platform (ML-561) for multiple high-performance memory interfaces (I/Fs), and the memory interface generator (MIG) software version...
Read More »Kit aids development of networked embedded systems.
Intended for STR91x 32-bit microcontroller family based on ARM966E® core, STR9-comStick is configured as USB stick with built-in USB connector that enables it to plug into host PC. Included Hitex software tools allow developer to modify and recompile application source code, program STR91x MCU, and debug applications as they run on development system. Kit also includes sample applications,...
Read More »Chips offer through-hole packaging option.
Electrically and thermally identical to SMT versions, VoI Chips with through-hole packaging are compatible with hand soldering and wave solder techniques. Through-hole assembly facilitates multi-chip, cold-plate or heatsink mounting, speeding system assembly. Packing option is available for all VoI Chips, including MIL-COTS versions.
Read More »Subwoofer Signal Processor comes with PC GUI interface.
SonicMaster2(TM) delivers programmable platform for subwoofer signal conditioning that provides equalization, adjustable filters, and limiters, enabling protection from amplifier clipping and woofer bottoming for active subwoofer designs. Reconfigurable unit also enables addition of all analog AutoEQ processing. Product features 100% analog signal path for Pure Analog Sound, options for push...
Read More »eASIC and IAR Systems Deliver e926 Development Kit for Designing Low-Cost, Customized ARM926EJ(TM) Embedded Systems
SANTA CLARA, Calif., May 22 // -- eASIC Corporation, a provider of Structured ASIC devices, and IAR Systems, a provider of embedded development tools, today announced the immediate availability of the e926 Development Kit for designing affordable ARM926EJ-based embedded systems. The e926 Development Kit provides embedded system designers with a comprehensive application development environment....
Read More »Evaluation Board tests IP connectivity applications.
Demonstrating iChip CO2128 IP controller's Internet connectivity, Model II EVB-630 supports integration of upper layer Internet protocols using AT+i commands or iChipConfig Utility, and is used for evaluation and development of secure WiFi, LAN, cellular, or dial-up networking, offering developers flexibility in designing M2M applications. It enables developers to test out, develop, and debug...
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Harpro Modular Containers Offer an Eco-friendly, Portable Recycling Solution
Harpro's MiddleMan™ recycling container frames and reusable bags are made from eco-friendly material, fold for easy storage, and are easy to assemble. Check out the video to learn more.
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