Lasers

Direct Diode Laser System suits industrial applications.

Capable of producing 1 kW of output at 975 nm from 600 Â-µm core fiber having numerical aperture of 0.22, HighLight(TM) 1000F is suited for welding, cladding, and heat treating metals and alloys. Fiber coupling allows kW power to be delivered directly to work piece; either 180Â-

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UV Lasers offer true CW output for bio applications.

Based on optically pumped semiconductor laser technology, Genesis(TM) 355 solid state UV lasers are available with output powers of 40, 60, 80 and 100 mW, and feature beam quality of M2 less than 1.2 and low noise of less than 0.5% rms. They are suited for flow cytometry applications as well as emerging confocal microscopy applications.

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Solid State Laser offers 15-25 W output power range.

Featuring diode-pumped and solid-state unidirectional ring-resonator design, Verdi IR 25 laser delivers 25 W of single-mode CW output at 1,064 nm. Its single-longitudinal-mode output has low-noise of less than 0.04% RMS, narrow-linewidth of less than 2.5 MHz FWHM, and coherence length greater than 60 m. With piezo control bandwidth of DC to 20 kHz, device includes piezo-actuated resonator mirror,...

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Laser Amplifier delivers over 3.5 mJ pulse energy at 1 kHz.

Available in choice of either less than 50 or 100 fsec pulse width models, Libra(TM) HE one-box ultrafast Ti:Sapphire amplifier is offered with standard pulse repetition rate of either 1 or 5 kHz at 800 nm. Utilizing E-2 Engine(TM) regenerative amplifier design, unit offers beam quality with M2 less than 1.3, and output stability of less than 0.5% rms. Unit is suited for power-heavy applications...

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Laser Separation Tool scribes generation 8 and larger glass.

Laser Separation Tool scribes generation 8 and larger glass.

Model F 250 GL laser separation tool for scribing generation 8 and higher sized glass is suited for flat panel display and photovoltaic industries. System utilizes Zero Width Laser Cutting Technology(TM), which splits materials at molecular level, and also incorporates mode selective resonator and specialty gas mix range for changing wavelength during cutting. It also optimizes control of beam...

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Failure Analysis System inspects IC chip packages.

Failure Analysis System inspects IC chip packages.

Using laser technology, FiberTower(TM) DFAS allows operator to remove individual layers of mold compound through to substrate. System can import images from variety of testing processes such as SAM, X-ray, and SEM to show operator exact area of concern within sample. Controllable by operator through GUI, DFAS IC chip decapitation process provides accurate dissection without damaging sample. Laser...

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Laser Scribing Machine targets flat panel display industry.

Intended for thin glass cutting, Fantom G8 utilizes non-contact Zero Width Laser Cutting Technology(TM), which scribes glass on molecular level and allows applications to be processed with no material loss and no chips or other debris associated with conventional scribe and break techniques. Machine incorporates modular design laser and direct-drive linear motion system, forming precision,...

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Green Laser suits scientific and OEM applications.

Green Laser suits scientific and OEM applications.

Based on optically pumped semiconductor laser technology, 2,000 mW CW Genesis(TM) 532-2000 S provides M2 of less than 1.2, no green noise, and overall amplitude noise at 0.06% or better. Laser is completely air-cooled with compact laser head measuring 11 x 6 x 3.3 in. In addition to high throughput applications in life sciences such as flow cytometry and DNA sequencing, laser is suited for...

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Portable Laser Measurement Arms facilitate 3D inspection.

Portable Laser Measurement Arms facilitate 3D inspection.

Designed to collect 3D data positions and 3D point clouds with simple manual movements, Axxis Arms and Arm/Scanner systems provide solution for detailed measurements, reverse engineering, prototyping, and quality control. Arms come in 6 and 7 axis models with reaches of 2.6 or 3.2 m, and feature USB interface, and lightweight construction using aeronautical aluminum and carbon fiber tubes....

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Laser Marking Heads feature low drift.

Laser Marking Heads feature low drift.

Measuring 6.6 x 4.62 x 5.75 in., warpSCAN II(TM) Series provides long-term drift of less than 0.3 mrad. Dust-proof, temperature stabilized units are available in 7, 10, and 14 mm aperture sizes with marking speeds of 3.5, 2.5, and 1.5 m/s, respectively. Units can be customized with galvanometer mirrors and objectives as well as mounts for all laser types and image fields. All are equipped with...

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