Heat Sinks cool components in low air flow conditions.
Measuring 4-7 mm in height, blueICE(TM) Heat Sinks feature thermal resistance as low as 1.23°C/W within air velocity of 600 fpm. Double-sided, thermally conductive adhesive tape can be used to attach heat sinks securely to components so no mechanical hardware is needed. Units are suited for use inside most telecommunications enclosures where space is limited.
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Heat Sinks cool DC/DC converters in low-airflow conditions.
Low-profile powerICE(TM) heat sinks optimize thermal management of PCB-mounted power modules in spatially-constrained applications with bypassed and unducted flow conditions. Measuring 58 x 61 x 4-7 mm, products have aluminum fins and base and exhibit thermal resistance down to 1.23°C/W with air velocity of 600 fpm. They are provided with double-sided, thermally conductive adhesive tape for...
Read More »Heat Sinks are suited for use with power modules.
Low-profile powerICE(TM) heat sinks optimize thermal management of pcb-mounted power modules in spatially constrained applications with inadequate airflow. Offered with 100, 200, 400, and 600 ft/min velocities, products provide resistance values from 1.23-14.0 Rca. Suited for bypassed and unducted flow conditions, units are offered in 6 package sizes from 7 x 58.2 x 61 to 4.0 x 58.2 x 36 mm.
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How to Effectively and Efficiently Clean Heat Exchangers, Part I
An introduction to a three part series about the importance, benefits, and methods of cleaning heat exchangers.
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Simple Connection – MGB with EtherNet/IP
The new MGB with EtherNet/IP is a leap forward in access door safety. Designed for easy installation, flawless performance, and long service life, it is engineered with robust features and cutting-edge technology that places it firmly at the leading edge of the door safety device industry. To learn all about the benefits of the Euchner MGB, see our video.
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