Heat Sinks

Heat Sinks cool components in low air flow conditions.
Heat Sinks

Heat Sinks cool components in low air flow conditions.

Measuring 4-7 mm in height, blueICE(TM) Heat Sinks feature thermal resistance as low as 1.23°C/W within air velocity of 600 fpm. Double-sided, thermally conductive adhesive tape can be used to attach heat sinks securely to components so no mechanical hardware is needed. Units are suited for use inside most telecommunications enclosures where space is limited.

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Heat Sinks cool DC/DC converters in low-airflow conditions.
Heat Sinks

Heat Sinks cool DC/DC converters in low-airflow conditions.

Low-profile powerICE(TM) heat sinks optimize thermal management of PCB-mounted power modules in spatially-constrained applications with bypassed and unducted flow conditions. Measuring 58 x 61 x 4-7 mm, products have aluminum fins and base and exhibit thermal resistance down to 1.23°C/W with air velocity of 600 fpm. They are provided with double-sided, thermally conductive adhesive tape for...

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Heat Sinks

Heat Sinks are suited for use with power modules.

Low-profile powerICE(TM) heat sinks optimize thermal management of pcb-mounted power modules in spatially constrained applications with inadequate airflow. Offered with 100, 200, 400, and 600 ft/min velocities, products provide resistance values from 1.23-14.0 Rca. Suited for bypassed and unducted flow conditions, units are offered in 6 package sizes from 7 x 58.2 x 61 to 4.0 x 58.2 x 36 mm.

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