Heat Sinks

Low-Profile Heatsinks enhance space-constrained designs.
Heat Sinks

Low-Profile Heatsinks enhance space-constrained designs.

Optimized for deployment in streamlined, high-density electronic designs, LPH00xx series utilizes VersarienCu™ microporous copper technology and offers form factors that cover 10 x 10 x 2 mm through 40 x 40 x 5 mm. Microporous structure maximizes surface area and optimizes heat dissipation in space constrained designs. For applied load of 5 W,- thermal resistance of 40 x 40 x 5 mm...

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Zipper Fin Heat Sinks optimize cooling performance.
Heat Sinks

Zipper Fin Heat Sinks optimize cooling performance.

Designed to protect components from excess heat, Zipper Fin Heat Sinks have zipper fins machined from thin sheet metal, typically aluminum or copper, formed into custom shapes. Sheets are designed to interlock with very narrow space between layers. Fin assembly is wave soldered to metal base forming very rigid, lightweight heat sink. To contain and optimize cooling airflow, heat sinks can be...

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Push Pin Heat Sinks Offer More than 100,000 Configurations
Heat Sinks

Push Pin Heat Sinks Offer More than 100,000 Configurations

Norwood, MA -- With 108,000 possible configurations, Advanced Thermal Solutions, Inc. (ATS) now provides the widest choice of push pin-mounted heat sinks for cooling BGAs and other hot components. More than 200 ATS heat sinks are available with convenient push pin mounting. The lightweight aluminum heat sinks include straight fin, cross-cut, and ATS maxiFLOW spread fin geometries. More than 100...

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Heat Sinks

Future Electronics Promotes the 90x Series Black Anodize Pin Fin Heat Sinks from Wakefield-Vette

Pointe Claire, Quebec - Future Electronics, a global leading distributor of electronic components, has announced immediate availability of 90x Series black anodize pin fin heat sinks from Wakefield-Vette. Wakefield-Vette's 901-910 heat sink series support thermal cooling needs for chipsets, with a range of chip footprints from 19 mm to 40 mm available. They comprise a six-piece unit including the...

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Cold Forged Round Heatsinks enhance CoB/MPCB LED heat dissipation.
Heat Sinks

Cold Forged Round Heatsinks enhance CoB/MPCB LED heat dissipation.

Heatsinks for CoB LED applications use 7 or 10 mm base to address heating needs. Base thickness spreads heat dissipation for effective operation. Heatsinks for Metal Core PCB (MPCB) LED- applications use 5 mm base for efficient cooling. Inherently designed with concern for thermal management in mind, metallic board exhibits thermal resistance that promotes- heat dissipation over- horizontal...

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Heat Sinks

Dual Tower CPU Cooler provides quiet operation.

Featuring 150 mm wide fin-stack and widely spaced heatpipes,- Model NH-D15 enables uniform heat distribution for optimal efficiency. Recessed lower fins enable- NH-D15 to provide 64 mm clearance for tall memory heatsinks in single fan mode. Cooler also features pro-grade SecuFirm2™ multi-socket mounting system and NF-A15 fans that support PWM for automatic speed control through...

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