Heat Sinks

Heat Sinks cool brick DC/DC converters and power modules.
Heat Sinks

Heat Sinks cool brick DC/DC converters and power modules.

Able to reduce junction temperatures by >20%, maxiFLOW™ heat sinks enable full, half, quarter, and one-eighth brick DC/DC converters to be used at maximum operating temperature for optimum performance on PCBs. Spread fin heat sink design maximizes cooling performance in low-airflow environments by reducing pressure drop on passing air and providingÂ- increased surface area for heat...

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Heat Sinks

Heat Sink cools AMD-based 1U servers.

Available to computer OEMs and ODMs, NanoSpreader(TM) model 401-AM-001 is used to cool AMD's quad core Opteron processors. Use results in both performance enhancements as well as weight savings, which minimizes stress on retention mechanism and processor. Offered as alternative to solid copper/copper fin heat sinks, vapor chamber-based heat sink can be used with any Socket F 1U server.

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Heat Sinks

Memory Module Cooler uses integrated heat pipe.

Available in black, blue, and plain aluminum, HXR-5500 features aluminum extrusion heatsink with integrated 5 mm dia heat pipe used to cool memory modules. Heat pipe transports heat from memory module onto detached aluminum heat sink on top of module. By using this product, memory module temperature can be reduced by 13 to 14Â-

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Heat Sinks

ATS' maxiGRIP(TM) Heat Sink Attachment System Passes Tough Military Shock Testing

NORWOOD, Mass, October 31, 2006 - Advanced Thermal Solutions, Inc. (ATS), a leading thermal management and mechanical packaging solutions provider, today announced that maxiGRIP(TM), the company's patent-pending heat sink attachment system for mounting heat sinks to flip chips, BGAs, and other hot on the PCB components, has passed Mil-STD-810 Shock Testing and Unpackaged Drop Testing. Shock and...

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Heat Sinks

Diamond Heat Spreaders provide high thermal conductivity.

Available as bare, freestanding diamond segments or in metallized form, DiaTherm(TM) Heat Spreaders are laser cut from sheets of pure diamond formed by chemical vapor deposition in dc torch reactors. They are 100% polycrystalline diamond with density of 3.5 g/cubic-cm and thermal conductivity up to 1,400 W/m-k. Spreaders are suitable mounting structures for laser diodes, laser diode arrays, LEDs...

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Heat Sinks

Heat Sinks cool condensed electronic packages.

Fabricated from lightweight extruded aluminum, maxiFLOW(TM) heat sinks are utilized for cooling BGAs and hot components inside electronic systems. Featuring low profile spread fin arrays to enable convectional air cooling within restricted/low air flow conditions, they are available in lengths and widths ranging from 10 x 10 mm to 60 x 60 mm, and heights starting at 2 mm.

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Heat Sinks

Heat Sinks are suited for use with power modules.

Low-profile powerICE(TM) heat sinks optimize thermal management of pcb-mounted power modules in spatially constrained applications with inadequate airflow. Offered with 100, 200, 400, and 600 ft/min velocities, products provide resistance values from 1.23-14.0 Rca. Suited for bypassed and unducted flow conditions, units are offered in 6 package sizes from 7 x 58.2 x 61 to 4.0 x 58.2 x 36 mm.

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Neagle Choice, LLC Announces New Available Services
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Neagle Choice, LLC Announces New Available Services

Neagle Choice has long been known as a quality source for commercial sewing, printing, die cutting, and the manufacturing of a wide range of custom products. Enhancing our service capabilities has been the key to our success, and has driven our growth into many new and exciting markets. Continuing on this trajectory, we now offer precision laser cutting and etching, adding to our long line of manufacturing services. See our video to learn all about it.

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