Press Release Summary:
RoHS-compliant SCSI termination resistor network, BB1020DTLF, uses thick film resistors on ceramic substrate with BGA terminals, minimizing stray capacitance and inductance characteristics. This low voltage differential (LVD) network is designed to terminate SPI-2 (Ultra2) and SPI-3 (Ultra3) bussed applications. It measures 0.20 x 0.45 in., with solder balls on 0.05 in. centers. Each surface-mountable BB1020DTLF contains LVD termination for up to 9 lines.
Original Press Release:
BI Technologies Develops RoHS-Compliant BGA Network for High-Speed Low Voltage Differential SCSI Bus Applications
BGA network features minimum stray capacitance, exceptional high frequency performance...
MUNICH, Germany (November 14, 2006) - Providing design engineers with a network device designed for the termination of high speed applications, TT electronics BI Technologies Electronic Components Division has released a RoHS-compliant SCSI termination resistor network. Designated the BB1020DTLF, the low voltage differential (LVD) network is designed to terminate high performance SPI-2 (Ultra2) and SPI-3 (Ultra3) bussed applications.
According to Mike Torres, product manager for BI Technologies' Electronic Components Division, the BGA network design is optimized for minimal stray capacitance and exceptional high frequency performance. "This network utilizes thick film resistors on a ceramic substrate with ball grid array terminals," said Torres. "The resistors and terminal balls are placed on the same side of the ceramic substrate, resulting in the absolute minimum stray capacitance and inductance characteristics."
As a result of the design, wide SCSI bus applications can be terminated with three BB1020DT Series networks and one linear regulator IC, Torres continued.
The BB1020DT Series networks feature 18 resistors with a nominal resistance of 475W and 9 resistors with a nominal resistance of 121W. Absolute tolerance is ±1%, with TCR of ±100ppm/°C. Power rating is 1 Watt per network at 70°C. Inter-lead capacitance is less than 0.1pF. And operating temperature range is -55°C to +125°C. BI Technologies will also produce devices outside these specifications to meet customer requirements.
The BGA network measures 0.20 inches by 0.45 inches, with solder balls on 0.05 inch centers. Each of the BB1020DTLF devices contains low voltage differential termination for up to 9 lines. The termination network is surface mountable with automated pick and place equipment. The balls for the RoHS-compliant version utilize a copper core and are tin plated.
Typical pricing for the BB1020DTLF SCSI termination network is approximately $0.70 each in quantities of 10,000 pieces, with lead times from stock to 8 weeks.
For more information about BI Technologies' BB1020DT Series termination networks, contact BI Technologies at 714-447-2457, by fax at 714-388-0046; by mail at 4200 Bonita Place, Fullerton, CA 92835; or visit: http://www.bitechnologies.com/products/passive.htm.
Contact BI Technologies Ltd. in Scotland at +44-1592-662200. In Germany, contact TT electronics at +49-8161-49-08-0; visit www.tt-electronics.de or email email@example.com. In France, contact TT France at +33-1-45-12-38-80; visit the Web site www.ttelectronics.fr or e-mail firstname.lastname@example.org. In Italy, contact TT S.r.l. at +39-02-688-8951; visit ttelectronics.it or e-mail email@example.com.
BI Technologies has been an innovator and leader in electronic components for more than 50 years. The company is a global manufacturer of trimming and precision potentiometers, position sensors, turns-counting dials, chip resistor arrays, resistor networks, integrated passive networks, transformers, inductors, hybrid microelectronics and custom integration products for communication, computer, automotive and industrial applications.
BI Technologies serves a global customer base with manufacturing locations in the United States, Mexico, Scotland, Japan, China and Malaysia.
TT Electronics plc is a global electronics company manufacturing a broad range of advanced electronic components, assemblies and sensor modules for the automotive, industrial, telecommunication, computer and aerospace markets.