Industrial ATX Motherboard serves DVR, NVR, and signage markets.
Based on IntelÃ-® B75 Express chipset, IMB204 accommodates 22 nm, third generation IntelÃ-® Core™ i7/i5/i3 processors in LGA1155 socket. Embedded board also supports 32 GB DDR3 1333/1600 system memory and PCIe x16 Gen 3 as well as SATA-600 interfaces, whileÃ- IntelÃ-® HD Graphics with DX11 support enables optimal graphic processing and dual-view capability. Along with diverse...
Read More »Server Laptop provides complete mobility, accelerated setup.
Measuring 16.76 x 11.44 x 2.31–2.48 in., EUROCOM Panther v5.0 Server Edition (SE) is powered by 6- and 8-core IntelÃ-® XeonÃ-® E5-2600 series processors, can beÃ- carried by hand, and weighs 12 lb. System comes with integrated keyboard, 17.3 in.Ã- LCD, touch pad, and UPS. Microsoft Windows Server 2012, also included, promotes performance viaÃ- virtualization. Solution allows...
Read More »COM Express Modules utilize 3rd Gen Intel-® Core(TM) technology.
Equipped with Intel HM76 Express Chipset, conga-TS77 and conga-BS77 are available with 2.20 GHz dual-core IntelÃ-® CeleronÃ-® Processor 1020E, 1.40 GHz dual-core Intel Celeron Processor 1047UE, or 1.50 GHz single-coreÃ- Intel Celeron Processor 927UE. Modules offer up to 16 GB of dual-channel DDR3 memory plus direct support for USB 3.0 and Intel Hyper-Threading Technology. Additional...
Read More »Vuzix Smart Glasses Debut in Europe During Mobile World Congress Showstoppers
OXFORD, England and BARCELONA, Spain - Vuzix Corporation's (TSX-V: VZX, OTC:BB: VUZI, FMB: V7X)Ã- M100 Smart Glasses will be making their European debut during the showstoppers media event on Sunday, February 24(th). Mobile industry participants and gadgeteers can test out the world's first smart 'hands free' display and communications system for on the go data access, paired to their...
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Product Development and the Supply Chain: How to Survive a Pandemic with Digital Manufacturing
This white paper provides an overview on how to survive a pandemic with digital manufacturing.
Read More »Embeddable XMC Module targets avionics applications.
Featuring advanced API software, Model RAR15-XMC combines 4 dual-redundant MIL-STD-1553A/B Notice II channels, 10 ARINC 429 receive channels, and 8 ARINC 429 transmit channels. Simultaneous Scheduled and Burst Mode messaging is supported on all ARINC 429 transmit channels. In addition to 8 MB of RAM and 64-bit message time tagging, conduction cooled board provides BC and RT link-list structures,...
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COM Express Type 10 Module is suited for fanless designs.
Suitable for embedding into space-constrained devices in thermal-critical applications, 84 x 55 mm NanoCOM-CV Rev.BÃ- is powered via 1.6 GHz, BGA type dual core IntelÃ-® Atom™ N2600 processor, features 2 GB DDR3 800 MHz onboard memory, and also comes in wide temperature (-40 to +85Ã-
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ULP Computer-on-Module fosters enhanced SFF system development.
Helping embedded OEMs develop ULP SFF (ultra-low power small form factor) solutions, ULP-COM-sA3874i provides scalable building block suited for space-constrained, fanless, and harsh environment applications. COM leverages single-core ARM Cortex A8 technology performance based on TI AM3874 Sitara ARM processors; offers diverse interface, storage, and networking...
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MicroTCA Carrier Hubs support MTCA.4 specification.
Suited for high-speed data acquisition applications, ModelsÃ- AM4904/AM4910 support 4 high-speed fabric variants, including GbE, sRIO, PCIe, and 10 GbE. Units are equipped with 600 MHz PowerPC 405 EX processor for MCMC functionality and switching management, and enable redundant system architectures with up to 12 AMCs, 2 cooling units, and 4 power units. To provide support for various telco...
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CompactPCI SBC supports machine and factory control.
Combining 1.0 GHz Celeron processor 807UE with IntelÃ-® QM77 Platform Controller Hub, 3U Model CP3003-VÃ- provides 1 MB Smart Cache and up to 4 GB DDR3 1,333 MHz SDRAM memory. Double slot version offers comprehensive set of interfaces such as 1x VGA, 2x DisplayPort, 1x USB 3.0, 2x USB 2.0, 3x Gigabit Ethernet ports, and Serial port on front panel plus option to hold CFast module or up to...
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Embedded Box PC features integrated graphics accelerator.
Housed in 75 x 350 x 260 mm chassis, CB 753 Dual Head provides connections for 2 digital or 4 analog displays, making it suitable for fanless multi-display applications with high-resolution graphics. Unit is equipped with 2.26 GHz Intel Core 2 Duo Mobile processor and up to 8 GB DDR3 RAM. Configurable interfaces include 4x USB, 3x GB LAN, 4x RS232, PS/2 M+K, Line in, MIC In, 7.1 HD Audio, and 1x...
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560 and 572 Series IP67 Waterproof Inline Plug and Socket Connectors with Shock and Vibration Resistance
EDAC's new line of IP67 waterproof plug and socket connectors represent the cutting edge of waterproof connection technology. Part of the 560 and 572 series of connectors, they utilize innovative design concepts to deliver a level of performance and value that is unmatched in the industry. See our video to learn more.
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