Arrays

Arrays

FPGAs target wireless, video, and display applications.

Cyclone III FPGAs deliver 5-120K logic elements, up to 4 Mbit memory, and up to 288 DSP multipliers. They allow integration of Software Defined Radio waveforms in single device for less than 0.5 W static power, and support video system I/O, video compression encoding, and video and image processing applications. Also featuring display-specific I/O interface support, 65 nm devices meet all 1,080p...

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Electronic Chips

Agere Systems Begins Sampling Industry's Fastest Preamplifier Chip for Enterprise and Desktop Hard Disk Drive Markets

Agere Systems Begins Sampling Industry's Fastest Preamplifier Chip for Enterprise and Desktop Hard Disk Drive Markets ALLENTOWN, Pa., March 6 / -- Agere Systems (NYSE:AGR) today announced that it is shipping samples to customers of its latest high-performance, low-power preamplifier integrated circuit (IC) specifically designed for use in enterprise and desktop computer hard disk drives (HDDs)....

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Electronic Chips

Intel TeraFlop Research Chip: A Glimpse of Things to Come

This week Intel announced a test chip for its Terascale Computing Research program. The objective is to eventually bring super-computing into mainstream computing. The Teraflops Research Chip is an 80 core design. Keep in mind that this is not an MPU architecture ready for commercialization but a test vehicle. An individual core does not have the same capability as the current complex cores in...

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Programmable Logic Controllers

FPGAs target edge-of-network applications.

Targeting edge-of-network applications, 90 nm I/O optimized Spartan(TM)-3A platform includes models 3S700A and 3S1400A. Built on 90 nm Spartan-3 FPGA fabric, Spartan-3AN family is comprised of non-volatile FPGA solutions that combine SRAM-based technology with non-volatile flash technology in one chip. Spartan-3A platform consists of 5 devices offering up to 1.4 million system gates and 502 I/Os.

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Data Storage Equipment

EMC Unveils Economical and Easy-to-Use Storage Solutions for Midsize Companies

HOPKINTON, Mass., Feb. 20 / -- EMC Corporation (NYSE:EMC), the world leader in information infrastructure solutions, today announced several cost-effective and easy-to-use solutions to help its customers more effectively consolidate, back up, archive and protect their information. EMC introduced the EMC(R) CLARiiON(R) CX3-10 UltraScale(TM) networked storage system, a new entry point into its...

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Miscellaneous Software

Xilinx Simplifies Design of PCI Express, Gigabit Ethernet and XAUI With New Virtex-5 Protocol Packs

Protocol-specific Characterization Reports, IP Cores, Interoperability Data, and Technical Documentation Enable Users to Rapidly Adopt Pervasive Industry Standard Interfaces SAN JOSE, Calif., Feb. 20 /-- Xilinx, Inc. (NASDAQ:XLNX), the world's leading supplier of programmable solutions, today announced the availability of protocol packs for PCI Express(R), Gigabit Ethernet, and XAUI for its 65-nm...

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Signal Processors

Xilinx at 2007 3GSM World Congress

What: Xilinx demonstrates programmable logic technology for infrastructure and handset solutions and showcases its latest Virtex(TM)-5 SXT platform FPGA, optimally configured for high-performance digital signal processing in base stations. Where: Fira de Barcelona, Barcelona, Hall 1, Stand 1E47 When: February 12-15, 2007 Exhibits: Monday, February 12 9am - 7pm Tuesday, February 13 9am - 7pm...

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Arrays

FPGAs target aerospace and defense applications.

Domain-optimized, MIL-grade Virtex(TM)-4 QPRO(TM) Series includes XQ4VLX25 with 24,192 logic cells, XQ4VLX60 with 59,904 logic cells for logic-intensive designs, and XQ4VSX55 featuring 55,296 logic cells for digital signal processing. Features such as logic fabric, block memory, clock management, and XtremeDSP slices are performance-matched to support up to 500 MHz clock speed. Hardened IP blocks...

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Miscellaneous Software

Xilinx PlanAhead Software Wins Prestigious DesignVision 2007 Award

Industry leading design planning and analysis tool recognized by IEC as most unique and beneficial to design community SAN JOSE, Calif., Jan. 30 /- Xilinx, Inc. (NASDAQ:XLNX), the world's leading supplier of programmable logic solutions today announced that its PlanAhead(TM) 8.2 design planning and analysis software has received the prestigious DesignCon 2007 DesignVision award in the category of...

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FCI Expands AirMax VS® Family with BGA Header
Electrical Connectors

FCI Expands AirMax VS® Family with BGA Header

ETTERS, PA (January 29, 2007) -FCI, a leading developer of connectors and interconnect systems, further increases the versatility of its AirMax VS® connector system by adding the option for ball grid array (BGA) attachment to its backplane header offering. By combining FCI's proven BGA technology with its innovative shieldless high-speed connector design, the new AirMax VS vertical BGA...

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