Arrays

New Icicle Kit for PolarFire SoC FPGAs is Centered Around 250K Logic Element PolarFire SoC device
Arrays

New Icicle Kit for PolarFire SoC FPGAs is Centered Around 250K Logic Element PolarFire SoC device

Supported by validated and tested power management and clocking devices such as Ethernet PHY, USB controller and current sensors. Includes a PCIe® connector, mikroBUS™ socket, dual RJ45 connector, Micro-USB connector, CAN bus connector, Raspberry Pi® header, JTAG port and SD Card interfaces. Ideally suited for smart embedded imaging, IoT, industrial automation, defense, automotive and...

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New Core Arrays for Air-handling OEMs
Arrays

New Core Arrays for Air-handling OEMs

SA Series is available in standardized 20-inch core modular stacks ranging from 3 (w) x 3 (h) (2,250-CFM) to 8 (w) x 8 (h) (70,000-CFM). Optimized core face area air distribution can be channeled for either side-to-side or over-and-under configurations. Ideal for all large airflow commercial air handlers especially medical, schools, labs, convention centers and other applications where IAQ is...

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New 3 W Back-Emitting VCSEL Array Comes with VoB Technology
Arrays

New 3 W Back-Emitting VCSEL Array Comes with VoB Technology

Offers single array die that is flip-chipped with standard SMT to printed circuit board (PCB) without the need for a submount carrier. Features back-side etched micro-lenses that enable integrated optics, which further reduces part height with separate optical lenses. Uses copper pillars with solder bumps and mounts directly to a PCB using standard lead-free SMT.

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New CoB SMT VCSEL Array Eliminates The Need for Wire Bonds
Arrays

New CoB SMT VCSEL Array Eliminates The Need for Wire Bonds

Provides high performance using near-infrared light-emitting laser diodes or LEDs for 3D sensing. Device has integrated solder balls and mounts directly to a PCB using standard SMT with built-in hermeticity. Ideal for automotive long-range LiDAR prototypes for low power mobile and in-cabin 3D sensing applications.

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Microsemi RTG4 FPGAs Become Industry's First High-Speed Signal Processing Radiation-Tolerant FPGAs to Achieve QML Class V Qualification
Arrays

Microsemi RTG4 FPGAs Become Industry's First High-Speed Signal Processing Radiation-Tolerant FPGAs to Achieve QML Class V Qualification

Designation Enables Space Customers to Leverage RTG4 FPGAs' Easy Prototyping and Fast Design Times ALISO VIEJO, Calif., Aug. 28, 2018 /PRNewswire/ -- Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), today announced its RTG4™ high-speed signal processing radiation-tolerant field programmable gate arrays (FPGAs) have achieved Qualified...

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Latest Ion Accelerator 5.0 Flash Storage Array Comes with ATTO Technology
Arrays

Latest Ion Accelerator 5.0 Flash Storage Array Comes with ATTO Technology

The Ion Accelerator™ 5.0 Flash Storage Arrays are now offered with 32 Gb Fibre Channel connection. The units support 100 Gb Infiniband and 100 Gb Ethernet high-speed storage interfaces and SRP, iSCSI and Fibre Channel protocols. The ATTO Technology 32 Gb host bus adapters allow 3,200 MB/s per channel data throughput and improves number of virtual machines per physical server. The fibre channel...

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We are using the power of our platform to aid in the mass shortage of critical supplies. If your company can help provide supplies, capabilities, or materials for products such as N-95 Masks and Tyvek SuitsPlease let us know.

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